FR2420393A1 - Thermo-compression diffusion bonding press - esp. for joining copper heat sink to metal foil when mfg. high power semiconductor devices - Google Patents

Thermo-compression diffusion bonding press - esp. for joining copper heat sink to metal foil when mfg. high power semiconductor devices

Info

Publication number
FR2420393A1
FR2420393A1 FR7907270A FR7907270A FR2420393A1 FR 2420393 A1 FR2420393 A1 FR 2420393A1 FR 7907270 A FR7907270 A FR 7907270A FR 7907270 A FR7907270 A FR 7907270A FR 2420393 A1 FR2420393 A1 FR 2420393A1
Authority
FR
France
Prior art keywords
esp
heat sink
high power
diffusion bonding
pref
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7907270A
Other languages
French (fr)
Other versions
FR2420393B1 (en
Inventor
Douglas Eugene Houston
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co
Original Assignee
General Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Co filed Critical General Electric Co
Publication of FR2420393A1 publication Critical patent/FR2420393A1/en
Application granted granted Critical
Publication of FR2420393B1 publication Critical patent/FR2420393B1/fr
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/26—Auxiliary equipment

Abstract

Thermocompression diffusion bonding press consists of one upper plate (a) and pressure pad (b) made of metal with a prescribed coefft. of thermal expansion (CTE); and a lower plate (c) made of metal with a prescribed CTE and parallel with elements (a, b). Threaded bolts are employed to hold the assembly together, so workpieces (1, 2) being bonded together can be clamped between pad (b) and plate (c). The bolts restrict the expansion of assembly (a, b, c) so the latter applies bonding pressure to pieces (1, 2) when the assembly is heated. All three parts (a, b, c) are pref. made of stainless steel (SS), but the pad (b) may be made of Cu, Al or an Al alloy; and the bolts are not made of SS. The pieces (1, 2) are pref. bonded by using 1406-3515 kg/cm2 obtd. by heating to 300-400 degrees C in inert gas esp. 350 degrees C for 1/4 - 5 hrs. Piece (1) is pref. an Au or Cu foil, whereas piece (2) is Cu. A strong diffusion bond is obtd., esp. where fibrous Cu cable feeds current and also acts as a heat sink for high power thyristors or transistors.
FR7907270A 1978-03-22 1979-03-22 Thermo-compression diffusion bonding press - esp. for joining copper heat sink to metal foil when mfg. high power semiconductor devices Granted FR2420393A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US88909978A 1978-03-22 1978-03-22
US92734478A 1978-07-24 1978-07-24

Publications (2)

Publication Number Publication Date
FR2420393A1 true FR2420393A1 (en) 1979-10-19
FR2420393B1 FR2420393B1 (en) 1984-02-17

Family

ID=27128903

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7907270A Granted FR2420393A1 (en) 1978-03-22 1979-03-22 Thermo-compression diffusion bonding press - esp. for joining copper heat sink to metal foil when mfg. high power semiconductor devices

Country Status (2)

Country Link
DE (1) DE2911031C2 (en)
FR (1) FR2420393A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE202014000968U1 (en) * 2014-02-18 2014-06-18 Hans Kölbl Joining press for electronic devices
CN115319263B (en) * 2022-10-13 2023-01-17 中山大学 Carbon-based material/metal connection method based on Cu-C/Ti instantaneous liquid phase in-situ reaction

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2290986A1 (en) * 1974-11-15 1976-06-11 Ass Eng Ltd ASSEMBLY PROCESS OF METALS AND STRUCTURES THUS ASSEMBLED

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2290986A1 (en) * 1974-11-15 1976-06-11 Ass Eng Ltd ASSEMBLY PROCESS OF METALS AND STRUCTURES THUS ASSEMBLED

Also Published As

Publication number Publication date
DE2911031A1 (en) 1979-10-04
FR2420393B1 (en) 1984-02-17
DE2911031C2 (en) 1986-09-04

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Legal Events

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