FR2400388A1 - Metallising dielectric carriers for printed circuits prodn. - using electroless coating and ultrasonic waves - Google Patents

Metallising dielectric carriers for printed circuits prodn. - using electroless coating and ultrasonic waves

Info

Publication number
FR2400388A1
FR2400388A1 FR7821333A FR7821333A FR2400388A1 FR 2400388 A1 FR2400388 A1 FR 2400388A1 FR 7821333 A FR7821333 A FR 7821333A FR 7821333 A FR7821333 A FR 7821333A FR 2400388 A1 FR2400388 A1 FR 2400388A1
Authority
FR
France
Prior art keywords
prodn
metallising
printed circuits
ultrasonic waves
carrier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
FR7821333A
Other languages
French (fr)
Inventor
Carl J Fellows
Howard B Rood
Theodore D Zucconi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of FR2400388A1 publication Critical patent/FR2400388A1/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J37/00—Processes, in general, for preparing catalysts; Processes, in general, for activation of catalysts
    • B01J37/34—Irradiation by, or application of, electric, magnetic or wave energy, e.g. ultrasonic waves ; Ionic sputtering; Flame or plasma spraying; Particle radiation
    • B01J37/341—Irradiation by, or application of, electric, magnetic or wave energy, e.g. ultrasonic waves ; Ionic sputtering; Flame or plasma spraying; Particle radiation making use of electric or magnetic fields, wave energy or particle radiation
    • B01J37/343—Irradiation by, or application of, electric, magnetic or wave energy, e.g. ultrasonic waves ; Ionic sputtering; Flame or plasma spraying; Particle radiation making use of electric or magnetic fields, wave energy or particle radiation of ultrasonic wave energy
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/187—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating means therefor, e.g. baths, apparatus

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Health & Medical Sciences (AREA)
  • Plasma & Fusion (AREA)
  • Toxicology (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Chemically Coating (AREA)
  • Catalysts (AREA)

Abstract

In the prodn. of printed circuits a dielectric carrier is electroless coated with a catalytically active substance by (a) dipping the carrier into a nucleus-forming soln. which contains Pd chloride, Sn chloride, HCl and (b) swinging an ultrasonic source over the carrier immersed in the soln. at a predetermined frequency and output. Used for metallising dielectric carrier prior to electroplating the printed circuit. Method reduces prodn. costs and allows the use of simple processing steps.
FR7821333A 1977-08-19 1978-07-12 Metallising dielectric carriers for printed circuits prodn. - using electroless coating and ultrasonic waves Pending FR2400388A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US82589777A 1977-08-19 1977-08-19

Publications (1)

Publication Number Publication Date
FR2400388A1 true FR2400388A1 (en) 1979-03-16

Family

ID=25245181

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7821333A Pending FR2400388A1 (en) 1977-08-19 1978-07-12 Metallising dielectric carriers for printed circuits prodn. - using electroless coating and ultrasonic waves

Country Status (4)

Country Link
JP (1) JPS5433233A (en)
DE (1) DE2829919A1 (en)
FR (1) FR2400388A1 (en)
IT (1) IT1108993B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5007990A (en) * 1987-07-10 1991-04-16 Shipley Company Inc. Electroplating process
JP4903457B2 (en) * 2005-09-06 2012-03-28 財団法人電力中央研究所 Metal-porous substrate composite material and method for producing the same
WO2013035480A1 (en) * 2011-09-09 2013-03-14 学校法人 関西大学 Catalyst adsorption method and adsorption device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2309196A1 (en) * 1973-02-21 1974-09-05 Matsushita Electric Ind Co Ltd Making electrical contacts - by plating bore of substrate internally
US4008343A (en) * 1975-08-15 1977-02-15 Bell Telephone Laboratories, Incorporated Process for electroless plating using colloid sensitization and acid rinse

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2309196A1 (en) * 1973-02-21 1974-09-05 Matsushita Electric Ind Co Ltd Making electrical contacts - by plating bore of substrate internally
US4008343A (en) * 1975-08-15 1977-02-15 Bell Telephone Laboratories, Incorporated Process for electroless plating using colloid sensitization and acid rinse

Also Published As

Publication number Publication date
IT7826096A0 (en) 1978-07-26
DE2829919A1 (en) 1979-03-01
IT1108993B (en) 1985-12-16
JPS5433233A (en) 1979-03-10

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