FR2396418B1 - - Google Patents
Info
- Publication number
- FR2396418B1 FR2396418B1 FR7819525A FR7819525A FR2396418B1 FR 2396418 B1 FR2396418 B1 FR 2396418B1 FR 7819525 A FR7819525 A FR 7819525A FR 7819525 A FR7819525 A FR 7819525A FR 2396418 B1 FR2396418 B1 FR 2396418B1
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/04—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their crystalline structure, e.g. polycrystalline, cubic or particular orientation of crystalline planes
- H01L29/045—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their crystalline structure, e.g. polycrystalline, cubic or particular orientation of crystalline planes by their particular orientation of crystalline planes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/86—Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
- H01L29/8605—Resistors with PN junctions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Ceramic Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Semiconductor Integrated Circuits (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7662177A JPS5412576A (en) | 1977-06-29 | 1977-06-29 | Semiconductor device |
JP8359277A JPS5419379A (en) | 1977-07-14 | 1977-07-14 | Semiconductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2396418A1 FR2396418A1 (fr) | 1979-01-26 |
FR2396418B1 true FR2396418B1 (es) | 1985-02-15 |
Family
ID=26417758
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7819525A Granted FR2396418A1 (fr) | 1977-06-29 | 1978-06-29 | Dispositif a semi-conducteurs integre dont les caracteristiques ne sont pas alterees par l'encapsulage |
Country Status (3)
Country | Link |
---|---|
DE (1) | DE2828607C3 (es) |
FR (1) | FR2396418A1 (es) |
GB (1) | GB2000638B (es) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56122134A (en) * | 1980-02-29 | 1981-09-25 | Toshiba Corp | Resin-sealed type semiconductor device |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1465112A1 (de) * | 1963-10-04 | 1969-01-23 | Anritsu Electric Company Ltd | Im Vakuum niedergeschlagene Halbleiterschichten fuer Elasto-Widerstandselemente |
GB1100124A (en) * | 1964-02-13 | 1968-01-24 | Hitachi Ltd | Semiconductor devices and methods for producing the same |
US3612960A (en) * | 1968-10-15 | 1971-10-12 | Tokyo Shibaura Electric Co | Semiconductor device |
GB1249317A (en) * | 1968-11-19 | 1971-10-13 | Mullard Ltd | Semiconductor devices |
NL7306948A (es) * | 1973-05-18 | 1974-11-20 | ||
US3965453A (en) * | 1974-12-27 | 1976-06-22 | Bell Telephone Laboratories, Incorporated | Piezoresistor effects in semiconductor resistors |
DE2828605C3 (de) * | 1977-06-29 | 1982-01-14 | Tokyo Shibaura Denki K.K., Kawasaki, Kanagawa | Halbleitervorrichtung |
-
1978
- 1978-06-29 DE DE2828607A patent/DE2828607C3/de not_active Expired
- 1978-06-29 FR FR7819525A patent/FR2396418A1/fr active Granted
- 1978-06-29 GB GB7828265A patent/GB2000638B/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
GB2000638A (en) | 1979-01-10 |
DE2828607C3 (de) | 1982-08-12 |
DE2828607B2 (de) | 1981-02-05 |
GB2000638B (en) | 1982-01-20 |
DE2828607A1 (de) | 1979-01-04 |
FR2396418A1 (fr) | 1979-01-26 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
CD | Change of name or company name | ||
ST | Notification of lapse |