FR2379911B2 - - Google Patents
Info
- Publication number
- FR2379911B2 FR2379911B2 FR7703185A FR7703185A FR2379911B2 FR 2379911 B2 FR2379911 B2 FR 2379911B2 FR 7703185 A FR7703185 A FR 7703185A FR 7703185 A FR7703185 A FR 7703185A FR 2379911 B2 FR2379911 B2 FR 2379911B2
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
- H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/20—Conductive package substrates serving as an interconnection, e.g. metal plates
- H10W70/24—Conductive package substrates serving as an interconnection, e.g. metal plates characterised by materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
- H10W74/137—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed the encapsulations being directly on the semiconductor body
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/59—Bond pads specially adapted therefor
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR7703185A FR2379911A2 (fr) | 1975-10-30 | 1977-02-04 | Semi-conducteur de puissance non encapsule |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR7533171A FR2366697A1 (fr) | 1975-10-30 | 1975-10-30 | Semi-conducteur de puissance non encapsule |
| FR7703185A FR2379911A2 (fr) | 1975-10-30 | 1977-02-04 | Semi-conducteur de puissance non encapsule |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR2379911A2 FR2379911A2 (fr) | 1978-09-01 |
| FR2379911B2 true FR2379911B2 (https=) | 1982-01-08 |
Family
ID=34227837
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR7703185A Granted FR2379911A2 (fr) | 1975-10-30 | 1977-02-04 | Semi-conducteur de puissance non encapsule |
Country Status (1)
| Country | Link |
|---|---|
| FR (1) | FR2379911A2 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2634300B2 (ja) * | 1990-05-24 | 1997-07-23 | 三菱電機株式会社 | 半導体装置 |
-
1977
- 1977-02-04 FR FR7703185A patent/FR2379911A2/fr active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| FR2379911A2 (fr) | 1978-09-01 |