FR2368125B1 - - Google Patents

Info

Publication number
FR2368125B1
FR2368125B1 FR7630642A FR7630642A FR2368125B1 FR 2368125 B1 FR2368125 B1 FR 2368125B1 FR 7630642 A FR7630642 A FR 7630642A FR 7630642 A FR7630642 A FR 7630642A FR 2368125 B1 FR2368125 B1 FR 2368125B1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR7630642A
Other languages
French (fr)
Other versions
FR2368125A1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sunbeam Oster Co Inc
Original Assignee
Allegheny Ludlum Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Allegheny Ludlum Industries Inc filed Critical Allegheny Ludlum Industries Inc
Priority to FR7630642A priority Critical patent/FR2368125A1/fr
Publication of FR2368125A1 publication Critical patent/FR2368125A1/fr
Application granted granted Critical
Publication of FR2368125B1 publication Critical patent/FR2368125B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
    • H01L23/49582—Metallic layers on lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01028—Nickel [Ni]

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Electroplating Methods And Accessories (AREA)
FR7630642A 1976-10-12 1976-10-12 Bande composite pour la realisation de cadres de connexion et son procede de fabrication Granted FR2368125A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR7630642A FR2368125A1 (fr) 1976-10-12 1976-10-12 Bande composite pour la realisation de cadres de connexion et son procede de fabrication

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7630642A FR2368125A1 (fr) 1976-10-12 1976-10-12 Bande composite pour la realisation de cadres de connexion et son procede de fabrication

Publications (2)

Publication Number Publication Date
FR2368125A1 FR2368125A1 (fr) 1978-05-12
FR2368125B1 true FR2368125B1 (enrdf_load_stackoverflow) 1980-05-23

Family

ID=9178642

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7630642A Granted FR2368125A1 (fr) 1976-10-12 1976-10-12 Bande composite pour la realisation de cadres de connexion et son procede de fabrication

Country Status (1)

Country Link
FR (1) FR2368125A1 (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1226967A (en) * 1984-03-08 1987-09-15 Sheldon H. Butt Tape bonding material and structure for electronic circuit fabrication
EP0219812A3 (en) * 1985-10-25 1987-09-30 Analog Devices, Inc. Packaged semiconductor device having solderable external leads and process for its production

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR645155A (fr) * 1926-12-30 1928-10-20 Procédé de préparation des pièces en vue du nickelage
GB457780A (en) * 1935-06-04 1936-12-04 Richard Thomas & Co Ltd Improvements in or relating to the production of coatings of tin on metal articles
US2428033A (en) * 1941-11-24 1947-09-30 John S Nachtman Manufacture of rustproof electrolytic coatings for metal stock
AT315947B (de) * 1971-03-26 1974-06-25 Interelectric Ag Verfahren zum Herstellen eines Systemträgers für integrierte Schaltkreise
US3875027A (en) * 1973-06-29 1975-04-01 Bundy Corp Method of electroplating tubing prior to terne alloy coating

Also Published As

Publication number Publication date
FR2368125A1 (fr) 1978-05-12

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Legal Events

Date Code Title Description
ST Notification of lapse