FR2368073A1 - Dispositif de manipulation automatique d'une piece par rapport a un outil - Google Patents

Dispositif de manipulation automatique d'une piece par rapport a un outil

Info

Publication number
FR2368073A1
FR2368073A1 FR7731299A FR7731299A FR2368073A1 FR 2368073 A1 FR2368073 A1 FR 2368073A1 FR 7731299 A FR7731299 A FR 7731299A FR 7731299 A FR7731299 A FR 7731299A FR 2368073 A1 FR2368073 A1 FR 2368073A1
Authority
FR
France
Prior art keywords
tool
workpiece
relation
binary signals
automatic handling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7731299A
Other languages
English (en)
French (fr)
Other versions
FR2368073B1 (enrdf_load_stackoverflow
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Texas Instruments Inc
Original Assignee
Texas Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Texas Instruments Inc filed Critical Texas Instruments Inc
Publication of FR2368073A1 publication Critical patent/FR2368073A1/fr
Application granted granted Critical
Publication of FR2368073B1 publication Critical patent/FR2368073B1/fr
Granted legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form
    • G05B19/408—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by data handling or data format, e.g. reading, buffering or conversion of data
    • G05B19/4083—Adapting programme, configuration
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/37—Measurements
    • G05B2219/37572—Camera, tv, vision
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements

Landscapes

  • Engineering & Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Image Analysis (AREA)
  • Wire Bonding (AREA)
  • Control Of Position Or Direction (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
FR7731299A 1976-10-18 1977-10-18 Dispositif de manipulation automatique d'une piece par rapport a un outil Granted FR2368073A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US73350176A 1976-10-18 1976-10-18

Publications (2)

Publication Number Publication Date
FR2368073A1 true FR2368073A1 (fr) 1978-05-12
FR2368073B1 FR2368073B1 (enrdf_load_stackoverflow) 1983-10-28

Family

ID=24947871

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7731299A Granted FR2368073A1 (fr) 1976-10-18 1977-10-18 Dispositif de manipulation automatique d'une piece par rapport a un outil

Country Status (4)

Country Link
JP (1) JPS5350673A (enrdf_load_stackoverflow)
DE (1) DE2746814A1 (enrdf_load_stackoverflow)
FR (1) FR2368073A1 (enrdf_load_stackoverflow)
GB (1) GB1592368A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0011979A1 (en) * 1978-11-22 1980-06-11 KULICKE and SOFFA INDUSTRIES INC. Processor-controlled drive apparatus for a semiconductor-wire bonder and method of operating same
EP0147066A3 (en) * 1983-11-25 1987-04-15 V.S. Engineering Limited Sensing arrangement

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4632291A (en) * 1983-02-28 1986-12-30 Electrovert Ltd. Automatic wave soldering machine
CN115437327B (zh) * 2022-09-15 2024-10-11 中国核动力研究设计院 一种智能化核安全级dcs设计与验证方法、系统及存储介质

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2016547A1 (enrdf_load_stackoverflow) * 1968-08-29 1970-05-08 Ibm
US3641660A (en) * 1969-06-30 1972-02-15 Texas Instruments Inc The method of ball bonding with an automatic semiconductor bonding machine
FR2321373A1 (fr) * 1975-08-20 1977-03-18 Bendix Corp Procede et systeme pour transport automatique de pieces

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3746447A (en) * 1971-07-07 1973-07-17 California Computer Products Marker enlarger
US3773240A (en) * 1972-03-06 1973-11-20 Texas Instruments Inc Automatic bonding machine
US4017721A (en) * 1974-05-16 1977-04-12 The Bendix Corporation Method and apparatus for determining the position of a body

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2016547A1 (enrdf_load_stackoverflow) * 1968-08-29 1970-05-08 Ibm
US3641660A (en) * 1969-06-30 1972-02-15 Texas Instruments Inc The method of ball bonding with an automatic semiconductor bonding machine
FR2321373A1 (fr) * 1975-08-20 1977-03-18 Bendix Corp Procede et systeme pour transport automatique de pieces

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0011979A1 (en) * 1978-11-22 1980-06-11 KULICKE and SOFFA INDUSTRIES INC. Processor-controlled drive apparatus for a semiconductor-wire bonder and method of operating same
EP0147066A3 (en) * 1983-11-25 1987-04-15 V.S. Engineering Limited Sensing arrangement

Also Published As

Publication number Publication date
FR2368073B1 (enrdf_load_stackoverflow) 1983-10-28
JPS5350673A (en) 1978-05-09
JPS6240852B2 (enrdf_load_stackoverflow) 1987-08-31
DE2746814C2 (enrdf_load_stackoverflow) 1987-08-20
DE2746814A1 (de) 1978-04-20
GB1592368A (en) 1981-07-08

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