FR2368073A1 - DEVICE FOR AUTOMATIC HANDLING OF A PART IN RELATION TO A TOOL - Google Patents
DEVICE FOR AUTOMATIC HANDLING OF A PART IN RELATION TO A TOOLInfo
- Publication number
- FR2368073A1 FR2368073A1 FR7731299A FR7731299A FR2368073A1 FR 2368073 A1 FR2368073 A1 FR 2368073A1 FR 7731299 A FR7731299 A FR 7731299A FR 7731299 A FR7731299 A FR 7731299A FR 2368073 A1 FR2368073 A1 FR 2368073A1
- Authority
- FR
- France
- Prior art keywords
- tool
- workpiece
- relation
- binary signals
- automatic handling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form
- G05B19/408—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by data handling or data format, e.g. reading, buffering or conversion of data
- G05B19/4083—Adapting programme, configuration
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/37—Measurements
- G05B2219/37572—Camera, tv, vision
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
Abstract
L'invention concerne un dispositif de manipulation automatique d'une pièce. Il comporte un outil à commande numérique, un dispositif de commande de cet outil, un dispositif de positionnement initial d'une pièce au voisinage de l'outil, un dispositif d'éclairage oblique formant une ombre, un dispositif produisant dcs signaux binaires représentant l'image de la pièce, et un dispositif d'analyse de ces signaux binaires qui détecte des caractéristiques prédominantes indiquant la position de la pièce, et produisant des signaux de correction pour que l'outil exécute correctement les opérations programmées. L'invention s'applique notamment au soudage des connexions sur les pastilles de circuits intégrés.The invention relates to a device for automatically manipulating a part. It comprises a numerically controlled tool, a device for controlling this tool, a device for initial positioning of a part in the vicinity of the tool, an oblique lighting device forming a shadow, a device producing dcs binary signals representing the image of the workpiece, and a device for analyzing these binary signals which detects predominant characteristics indicating the position of the workpiece, and producing correction signals for the tool to correctly perform the programmed operations. The invention applies in particular to the soldering of connections to integrated circuit chips.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US73350176A | 1976-10-18 | 1976-10-18 |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2368073A1 true FR2368073A1 (en) | 1978-05-12 |
FR2368073B1 FR2368073B1 (en) | 1983-10-28 |
Family
ID=24947871
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7731299A Granted FR2368073A1 (en) | 1976-10-18 | 1977-10-18 | DEVICE FOR AUTOMATIC HANDLING OF A PART IN RELATION TO A TOOL |
Country Status (4)
Country | Link |
---|---|
JP (1) | JPS5350673A (en) |
DE (1) | DE2746814A1 (en) |
FR (1) | FR2368073A1 (en) |
GB (1) | GB1592368A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0011979A1 (en) * | 1978-11-22 | 1980-06-11 | KULICKE and SOFFA INDUSTRIES INC. | Processor-controlled drive apparatus for a semiconductor-wire bonder and method of operating same |
EP0147066A2 (en) * | 1983-11-25 | 1985-07-03 | V.S. Engineering Limited | Sensing arrangement |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4632291A (en) * | 1983-02-28 | 1986-12-30 | Electrovert Ltd. | Automatic wave soldering machine |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2016547A1 (en) * | 1968-08-29 | 1970-05-08 | Ibm | |
US3641660A (en) * | 1969-06-30 | 1972-02-15 | Texas Instruments Inc | The method of ball bonding with an automatic semiconductor bonding machine |
FR2321373A1 (en) * | 1975-08-20 | 1977-03-18 | Bendix Corp | METHOD AND SYSTEM FOR AUTOMATIC TRANSPORT OF PARTS |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3746447A (en) * | 1971-07-07 | 1973-07-17 | California Computer Products | Marker enlarger |
US3773240A (en) * | 1972-03-06 | 1973-11-20 | Texas Instruments Inc | Automatic bonding machine |
US4017721A (en) * | 1974-05-16 | 1977-04-12 | The Bendix Corporation | Method and apparatus for determining the position of a body |
-
1977
- 1977-10-06 GB GB41618/77A patent/GB1592368A/en not_active Expired
- 1977-10-17 JP JP12436177A patent/JPS5350673A/en active Granted
- 1977-10-18 FR FR7731299A patent/FR2368073A1/en active Granted
- 1977-10-18 DE DE19772746814 patent/DE2746814A1/en active Granted
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2016547A1 (en) * | 1968-08-29 | 1970-05-08 | Ibm | |
US3641660A (en) * | 1969-06-30 | 1972-02-15 | Texas Instruments Inc | The method of ball bonding with an automatic semiconductor bonding machine |
FR2321373A1 (en) * | 1975-08-20 | 1977-03-18 | Bendix Corp | METHOD AND SYSTEM FOR AUTOMATIC TRANSPORT OF PARTS |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0011979A1 (en) * | 1978-11-22 | 1980-06-11 | KULICKE and SOFFA INDUSTRIES INC. | Processor-controlled drive apparatus for a semiconductor-wire bonder and method of operating same |
EP0147066A2 (en) * | 1983-11-25 | 1985-07-03 | V.S. Engineering Limited | Sensing arrangement |
EP0147066A3 (en) * | 1983-11-25 | 1987-04-15 | V.S. Engineering Limited | Sensing arrangement |
Also Published As
Publication number | Publication date |
---|---|
GB1592368A (en) | 1981-07-08 |
FR2368073B1 (en) | 1983-10-28 |
JPS5350673A (en) | 1978-05-09 |
DE2746814A1 (en) | 1978-04-20 |
DE2746814C2 (en) | 1987-08-20 |
JPS6240852B2 (en) | 1987-08-31 |
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