FR2365884A1 - Refroidisseur pour thyristors - Google Patents

Refroidisseur pour thyristors

Info

Publication number
FR2365884A1
FR2365884A1 FR7728807A FR7728807A FR2365884A1 FR 2365884 A1 FR2365884 A1 FR 2365884A1 FR 7728807 A FR7728807 A FR 7728807A FR 7728807 A FR7728807 A FR 7728807A FR 2365884 A1 FR2365884 A1 FR 2365884A1
Authority
FR
France
Prior art keywords
cooler
thyristor
helix
planes
coil
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7728807A
Other languages
English (en)
French (fr)
Other versions
FR2365884B1 (enExample
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Corp
Original Assignee
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Corp filed Critical Siemens Corp
Publication of FR2365884A1 publication Critical patent/FR2365884A1/fr
Application granted granted Critical
Publication of FR2365884B1 publication Critical patent/FR2365884B1/fr
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Microwave Tubes (AREA)
  • Rectifiers (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Coils Of Transformers For General Uses (AREA)
FR7728807A 1976-09-24 1977-09-23 Refroidisseur pour thyristors Granted FR2365884A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2643072A DE2643072C2 (de) 1976-09-24 1976-09-24 Kühldose für Thyristoren

Publications (2)

Publication Number Publication Date
FR2365884A1 true FR2365884A1 (fr) 1978-04-21
FR2365884B1 FR2365884B1 (enExample) 1980-08-01

Family

ID=5988777

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7728807A Granted FR2365884A1 (fr) 1976-09-24 1977-09-23 Refroidisseur pour thyristors

Country Status (11)

Country Link
US (1) US4161980A (enExample)
JP (1) JPS5340826A (enExample)
AT (1) AT354567B (enExample)
BE (1) BE858941A (enExample)
CA (1) CA1099338A (enExample)
DE (1) DE2643072C2 (enExample)
FR (1) FR2365884A1 (enExample)
GB (1) GB1532369A (enExample)
IN (1) IN148337B (enExample)
SE (1) SE7709899L (enExample)
SU (1) SU683648A3 (enExample)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU555193B2 (en) * 1980-11-10 1986-09-18 Edwin James Freeburn Cooling device
CH651994A5 (de) * 1981-03-10 1985-10-15 Injecta Ag Fluessigkeitsgekuehlte elektrische baugruppe sowie verfahren zu deren herstellung.
US4633371A (en) * 1984-09-17 1986-12-30 Amdahl Corporation Heat pipe heat exchanger for large scale integrated circuits
US4768539A (en) * 1987-09-18 1988-09-06 Camco, Incorporated Pipeline safety valve
US4928755A (en) * 1988-05-31 1990-05-29 Doty Scientific, Inc. Microtube strip surface exchanger
DE8915913U1 (de) * 1989-02-25 1992-02-13 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Anordnung zur Kühlung von Leistungshalbleitern über Wärmerohre
DE4301865A1 (de) * 1993-01-25 1994-07-28 Abb Management Ag Kühldose
US6536450B1 (en) * 1999-07-07 2003-03-25 Semitool, Inc. Fluid heating system for processing semiconductor materials
WO2001002108A1 (en) 1999-07-06 2001-01-11 Semitool, Inc. Fluid heating system for processing semiconductor materials
JP4543279B2 (ja) * 2004-03-31 2010-09-15 Dowaメタルテック株式会社 アルミニウム接合部材の製造方法
US20060005955A1 (en) * 2004-07-12 2006-01-12 Orr Troy J Heat exchanger apparatus and methods for controlling the temperature of a high purity, re-circulating liquid
US20070075595A1 (en) * 2005-09-30 2007-04-05 Rajmohan Narayanan Motor frame having embedded cooling coil
WO2016208027A1 (ja) * 2015-06-25 2016-12-29 日産自動車株式会社 鋳造装置及び鋳造方法
ES2906154T3 (es) * 2017-05-10 2022-04-13 Gea Food Solutions Weert Bv Medio de calentamiento para una máquina de envolver de flujo
GB2569306A (en) * 2017-12-12 2019-06-19 Rolls Royce Plc Thermal management device
DE112020005982B4 (de) * 2019-12-06 2025-07-31 Mitsubishi Electric Corporation Wärmesenke und Wärmesenke-Herstellungsverfahren
DE102022133174A1 (de) 2022-12-13 2024-06-13 Semikron Danfoss GmbH Kühlvorrichtung zur Kühlung elektronischer Komponenten, Verwendung derselben und Verfahren zu ihrer Herstellung
WO2024231485A1 (en) 2023-05-09 2024-11-14 Semikron Danfoss GmbH Cooling device for cooling electronic components

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1847573A (en) * 1930-03-12 1932-03-01 Commercial Iron Works Platen for presses with heating coils
US2282627A (en) * 1941-01-06 1942-05-12 Weiss Louis Draft assembly for chilled beverages
US2504281A (en) * 1946-04-18 1950-04-18 Ericsson Telefon Ab L M Device for condensers
DE1514511C3 (de) * 1965-07-21 1979-03-22 Siemens Ag, 1000 Berlin Und 8000 Muenchen Anordnung mit elektrisch zwangsgekühlten Halbleiterbauelementen
DE1514679A1 (de) * 1966-01-29 1969-06-19 Siemens Ag Anordnung zur Fluessigkeitskuehlung einer Gleichrichterzelle
DE1564694B2 (de) * 1966-08-27 1974-08-08 Ag Brown, Boveri & Cie, Baden (Schweiz) Gleichrichteranordnung für hohe Spannung
JPS4530270Y1 (enExample) * 1967-02-02 1970-11-20
DE2124303A1 (enExample) * 1971-05-17 1972-10-26
DE2160302C3 (de) * 1971-12-04 1975-07-17 Siemens Ag Kühldose zum Einbau in Scheibenzellenstapel

Also Published As

Publication number Publication date
SU683648A3 (ru) 1979-08-30
BE858941A (fr) 1978-01-16
SE7709899L (sv) 1978-03-25
US4161980A (en) 1979-07-24
IN148337B (enExample) 1981-01-17
DE2643072C2 (de) 1982-06-03
CA1099338A (en) 1981-04-14
AT354567B (de) 1979-01-10
ATA507877A (de) 1979-06-15
DE2643072A1 (de) 1978-03-30
FR2365884B1 (enExample) 1980-08-01
JPS5340826A (en) 1978-04-13
GB1532369A (en) 1978-11-15

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Legal Events

Date Code Title Description
ST Notification of lapse