FR2348576B1 - - Google Patents

Info

Publication number
FR2348576B1
FR2348576B1 FR7711428A FR7711428A FR2348576B1 FR 2348576 B1 FR2348576 B1 FR 2348576B1 FR 7711428 A FR7711428 A FR 7711428A FR 7711428 A FR7711428 A FR 7711428A FR 2348576 B1 FR2348576 B1 FR 2348576B1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR7711428A
Other languages
French (fr)
Other versions
FR2348576A1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Micronas GmbH
ITT Inc
Original Assignee
Deutsche ITT Industries GmbH
ITT Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Deutsche ITT Industries GmbH, ITT Industries Inc filed Critical Deutsche ITT Industries GmbH
Publication of FR2348576A1 publication Critical patent/FR2348576A1/fr
Application granted granted Critical
Publication of FR2348576B1 publication Critical patent/FR2348576B1/fr
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/52Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/525Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections
    • H01L23/5256Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections comprising fuses, i.e. connections having their state changed from conductive to non-conductive
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
FR7711428A 1976-04-17 1977-04-15 Methode pour l'ajustement de dispositifs a semi-conducteurs Granted FR2348576A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2617102A DE2617102C2 (de) 1976-04-17 1976-04-17 Verfahren zum Abgleichen eines Halbleiterbauelementes

Publications (2)

Publication Number Publication Date
FR2348576A1 FR2348576A1 (fr) 1977-11-10
FR2348576B1 true FR2348576B1 (OSRAM) 1983-10-28

Family

ID=5975716

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7711428A Granted FR2348576A1 (fr) 1976-04-17 1977-04-15 Methode pour l'ajustement de dispositifs a semi-conducteurs

Country Status (5)

Country Link
JP (1) JPS52127187A (OSRAM)
DE (1) DE2617102C2 (OSRAM)
FR (1) FR2348576A1 (OSRAM)
GB (1) GB1542612A (OSRAM)
IT (1) IT1077905B (OSRAM)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3122984A1 (de) * 1981-06-10 1983-01-27 Siemens AG, 1000 Berlin und 8000 München Verfahren zur kennzeichnung von halbleiterchips und kennzeichenbarer helbleiterchip
FR2582150B1 (fr) * 1985-05-15 1987-10-23 Cahen Olivier Dispositif de compensation des ecarts de tension de seuil des transistors a effet de champ des circuits integres analogiques

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2256688B2 (de) * 1972-11-18 1976-05-06 Robert Bosch Gmbh, 7000 Stuttgart Verfahren zum auftrennen von leiterbahnen auf integrierten schaltkreisen

Also Published As

Publication number Publication date
FR2348576A1 (fr) 1977-11-10
GB1542612A (en) 1979-03-21
DE2617102C2 (de) 1984-05-30
DE2617102A1 (de) 1977-10-27
JPS52127187A (en) 1977-10-25
IT1077905B (it) 1985-05-04

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Legal Events

Date Code Title Description
ST Notification of lapse