FR2346853B1 - - Google Patents

Info

Publication number
FR2346853B1
FR2346853B1 FR7704273A FR7704273A FR2346853B1 FR 2346853 B1 FR2346853 B1 FR 2346853B1 FR 7704273 A FR7704273 A FR 7704273A FR 7704273 A FR7704273 A FR 7704273A FR 2346853 B1 FR2346853 B1 FR 2346853B1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR7704273A
Other languages
French (fr)
Other versions
FR2346853A1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of FR2346853A1 publication Critical patent/FR2346853A1/fr
Application granted granted Critical
Publication of FR2346853B1 publication Critical patent/FR2346853B1/fr
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
    • H01L22/34Circuits for electrically characterising or monitoring manufacturing processes, e. g. whole test die, wafers filled with test structures, on-board-devices incorporated on each die, process control monitors or pad structures thereof, devices in scribe line
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26Testing of individual semiconductor devices
    • G01R31/2607Circuits therefor
    • G01R31/2621Circuits therefor for testing field effect transistors, i.e. FET's
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26Testing of individual semiconductor devices
    • G01R31/2644Adaptations of individual semiconductor devices to facilitate the testing thereof
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
FR7704273A 1976-04-01 1977-02-07 Appareils de controle de caracteristiques dimensionnelles de dispositifs semi-conducteurs Granted FR2346853A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/672,687 US4024561A (en) 1976-04-01 1976-04-01 Field effect transistor monitors

Publications (2)

Publication Number Publication Date
FR2346853A1 FR2346853A1 (fr) 1977-10-28
FR2346853B1 true FR2346853B1 (enExample) 1979-03-09

Family

ID=24699595

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7704273A Granted FR2346853A1 (fr) 1976-04-01 1977-02-07 Appareils de controle de caracteristiques dimensionnelles de dispositifs semi-conducteurs

Country Status (4)

Country Link
US (1) US4024561A (enExample)
JP (1) JPS52120687A (enExample)
FR (1) FR2346853A1 (enExample)
GB (1) GB1510777A (enExample)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4100486A (en) * 1977-03-11 1978-07-11 International Business Machines Corporation Monitor for semiconductor diffusion operations
US4399205A (en) * 1981-11-30 1983-08-16 International Business Machines Corporation Method and apparatus for determining photomask alignment
US4642491A (en) * 1983-06-24 1987-02-10 International Business Machines Corporation Single transistor driver circuit
EP0359866A1 (de) * 1988-09-23 1990-03-28 Siemens Aktiengesellschaft Verfahren und Halbleiteranordnung zum Messen der Stromaufnahme einer monolithisch integrierten Leistungsstruktur
US5500805A (en) * 1993-10-06 1996-03-19 Nsoft Systems, Inc. Multiple source equalization design utilizing metal interconnects for gate arrays and embedded arrays
US5563801A (en) * 1993-10-06 1996-10-08 Nsoft Systems, Inc. Process independent design for gate array devices
US5510999A (en) * 1993-10-06 1996-04-23 Nsoft Systems, Inc. Multiple source equalization design for gate arrays and embedded arrays
EP0685881A1 (en) * 1994-05-31 1995-12-06 AT&T Corp. Linewidth control apparatus and method
US5619420A (en) * 1995-05-04 1997-04-08 Lsi Logic Corporation Semiconductor cell having a variable transistor width
KR100272659B1 (ko) 1997-06-28 2000-12-01 김영환 반도체 소자의 금속배선 선폭 측정방법
US7183623B2 (en) * 2001-10-02 2007-02-27 Agere Systems Inc. Trimmed integrated circuits with fuse circuits
US6747445B2 (en) 2001-10-31 2004-06-08 Agere Systems Inc. Stress migration test structure and method therefor
US6620635B2 (en) * 2002-02-20 2003-09-16 International Business Machines Corporation Damascene resistor and method for measuring the width of same
US6815237B1 (en) * 2003-09-29 2004-11-09 Rockwell Scientific Licensing, Llc Testing apparatus and method for determining an etch bias associated with a semiconductor-processing step
US7514940B1 (en) * 2006-12-13 2009-04-07 National Semiconductor Corporation System and method for determining effective channel dimensions of metal oxide semiconductor devices
US8013400B1 (en) 2008-04-21 2011-09-06 National Semiconductor Corporation Method and system for scaling channel length

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH399588A (de) * 1962-07-17 1965-09-30 Siemens Ag Verfahren zum Bestimmen des spezifischen Widerstandes einer dünnen Halbleiterschicht
US3974443A (en) * 1975-01-02 1976-08-10 International Business Machines Corporation Conductive line width and resistivity measuring system

Also Published As

Publication number Publication date
JPS52120687A (en) 1977-10-11
GB1510777A (en) 1978-05-17
JPS549029B2 (enExample) 1979-04-20
US4024561A (en) 1977-05-17
FR2346853A1 (fr) 1977-10-28

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Legal Events

Date Code Title Description
ST Notification of lapse