FR2344130B1 - - Google Patents

Info

Publication number
FR2344130B1
FR2344130B1 FR7706243A FR7706243A FR2344130B1 FR 2344130 B1 FR2344130 B1 FR 2344130B1 FR 7706243 A FR7706243 A FR 7706243A FR 7706243 A FR7706243 A FR 7706243A FR 2344130 B1 FR2344130 B1 FR 2344130B1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR7706243A
Other languages
French (fr)
Other versions
FR2344130A1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of FR2344130A1 publication Critical patent/FR2344130A1/fr
Application granted granted Critical
Publication of FR2344130B1 publication Critical patent/FR2344130B1/fr
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/11Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/117Stacked arrangements of devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/16Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H01L23/18Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
    • H01L23/20Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device gaseous at the normal operating temperature of the device
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/44Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements the complete device being wholly immersed in a fluid other than air
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/58Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/585Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries comprising conductive layers or plates or strips or rods or rings
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/14Mounting supporting structure in casing or on frame or rack
    • H05K7/1422Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
    • H05K7/1427Housings
    • H05K7/1432Housings specially adapted for power drive units or power converters
    • H05K7/14339Housings specially adapted for power drive units or power converters specially adapted for high voltage operation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Rectifiers (AREA)
  • Power Conversion In General (AREA)
FR7706243A 1976-03-08 1977-03-03 Dispositif de tyristors isole par un gaz Granted FR2344130A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2609512A DE2609512C2 (de) 1976-03-08 1976-03-08 Gasisolierte Thyristoranordnung

Publications (2)

Publication Number Publication Date
FR2344130A1 FR2344130A1 (fr) 1977-10-07
FR2344130B1 true FR2344130B1 (de) 1980-02-29

Family

ID=5971799

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7706243A Granted FR2344130A1 (fr) 1976-03-08 1977-03-03 Dispositif de tyristors isole par un gaz

Country Status (10)

Country Link
US (1) US4077057A (de)
JP (1) JPS5820553B2 (de)
AT (1) AT350668B (de)
BE (1) BE852099A (de)
CA (1) CA1075370A (de)
DE (1) DE2609512C2 (de)
FR (1) FR2344130A1 (de)
GB (1) GB1544064A (de)
SE (1) SE432322B (de)
SU (1) SU852187A3 (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3050344C2 (de) * 1980-04-25 1985-02-07 Boris Iosifovič Leningrad Albertinskij Hochspannungstransformator für einen Hochspannungsgleichrichter
JPS619107A (ja) * 1984-06-20 1986-01-16 三菱電機株式会社 密閉形直流変換所
SE9401184L (sv) * 1994-04-08 1995-10-09 Asea Brown Boveri Kapslad ventilanordning för hög spänning och hög effekt
EP3170233A1 (de) * 2014-07-16 2017-05-24 ABB Schweiz AG Ventileinheit für hochspannungsgleichstrom-leistungswandler mit festmaterial- und gasisolierung
US10122292B2 (en) * 2015-05-28 2018-11-06 Nr Electric Co., Ltd Converter valve

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1314016A (fr) * 1960-11-28 1963-01-04 Westinghouse Electric Corp Blindage de piles de redresseurs secs haute-tension
CH438466A (de) * 1966-05-17 1967-06-30 Bbc Brown Boveri & Cie In eine Druckgaskapselung eingebaute Funkenstrecke
DE1563403B2 (de) * 1966-09-15 1977-02-17 Siemens AG, 1000 Berlin und 8000 München Steuerbarer hochspannungsstromrichter
US3497726A (en) * 1966-12-19 1970-02-24 Westinghouse Electric Corp Firing circuits for series-connected thyristors
DE1914790A1 (de) * 1969-03-22 1970-10-01 Siemens Ag Fluessigkeitsgekuehlte Baugruppe mit Scheibenzellen
DE2160302C3 (de) * 1971-12-04 1975-07-17 Siemens Ag Kühldose zum Einbau in Scheibenzellenstapel
DE2348207A1 (de) * 1973-09-25 1975-04-17 Siemens Ag Thyristorsaeule

Also Published As

Publication number Publication date
DE2609512C2 (de) 1982-11-25
BE852099A (fr) 1977-07-01
ATA975376A (de) 1978-11-15
JPS5820553B2 (ja) 1983-04-23
DE2609512A1 (de) 1978-01-26
JPS52107543A (en) 1977-09-09
AT350668B (de) 1979-06-11
US4077057A (en) 1978-02-28
SU852187A3 (ru) 1981-07-30
SE7701762L (sv) 1977-09-09
CA1075370A (en) 1980-04-08
SE432322B (sv) 1984-03-26
FR2344130A1 (fr) 1977-10-07
GB1544064A (en) 1979-04-11

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Legal Events

Date Code Title Description
ST Notification of lapse