FR2333831A1 - Compositions de resines epoxy pour encapsuler des dispositifs semi-conducteurs - Google Patents
Compositions de resines epoxy pour encapsuler des dispositifs semi-conducteursInfo
- Publication number
- FR2333831A1 FR2333831A1 FR7531584A FR7531584A FR2333831A1 FR 2333831 A1 FR2333831 A1 FR 2333831A1 FR 7531584 A FR7531584 A FR 7531584A FR 7531584 A FR7531584 A FR 7531584A FR 2333831 A1 FR2333831 A1 FR 2333831A1
- Authority
- FR
- France
- Prior art keywords
- compositions
- semiconductor devices
- epoxy resins
- encapsulating semiconductor
- encapsulating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12083874A JPS5146877A (ja) | 1974-10-18 | 1974-10-18 | Toranjisutafushojushisoseibutsu |
| JP12082974A JPS5146878A (ja) | 1974-10-18 | 1974-10-18 | Toranjisutafushojushisoseibutsu |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR2333831A1 true FR2333831A1 (fr) | 1977-07-01 |
| FR2333831B1 FR2333831B1 (US20070167544A1-20070719-C00007.png) | 1978-04-14 |
Family
ID=26458340
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR7531584A Granted FR2333831A1 (fr) | 1974-10-18 | 1975-10-15 | Compositions de resines epoxy pour encapsuler des dispositifs semi-conducteurs |
Country Status (4)
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4248920A (en) * | 1978-04-26 | 1981-02-03 | Tokyo Shibaura Denki Kabushiki Kaisha | Resin-sealed semiconductor device |
| US4176142A (en) * | 1978-05-22 | 1979-11-27 | Western Electric Company, Inc. | Powder coating composition |
| US4282136A (en) * | 1979-04-09 | 1981-08-04 | Hunt Earl R | Flame retardant epoxy molding compound method and encapsulated device |
| DE3442131A1 (de) * | 1984-11-17 | 1986-05-22 | Messerschmitt-Bölkow-Blohm GmbH, 8012 Ottobrunn | Verfahren zum einkapseln von mikroelektronischen halbleiter- und schichtschaltungen |
| JPH01141908A (ja) * | 1987-11-30 | 1989-06-02 | Dainippon Ink & Chem Inc | 活性エネルギー線硬化性樹脂組成物 |
| KR910008560B1 (ko) * | 1988-02-15 | 1991-10-19 | 주식회사 럭키 | 반도체 봉지용 에폭시 수지 조성물 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1903098A1 (de) * | 1968-01-26 | 1970-06-11 | Dexter Corp | Einkapselungsmassen fuer Halbleiter |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1050678A (US20070167544A1-20070719-C00007.png) * | 1963-05-02 | |||
| NL6504681A (US20070167544A1-20070719-C00007.png) * | 1965-04-13 | 1965-06-25 | ||
| US3838094A (en) * | 1973-04-23 | 1974-09-24 | Nat Semiconductor Corp | Molding composition and molded product |
-
1975
- 1975-10-07 GB GB41085/75A patent/GB1528203A/en not_active Expired
- 1975-10-08 DE DE2545471A patent/DE2545471C3/de not_active Expired
- 1975-10-15 FR FR7531584A patent/FR2333831A1/fr active Granted
- 1975-10-15 US US05/622,729 patent/US4013612A/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1903098A1 (de) * | 1968-01-26 | 1970-06-11 | Dexter Corp | Einkapselungsmassen fuer Halbleiter |
Also Published As
| Publication number | Publication date |
|---|---|
| US4013612A (en) | 1977-03-22 |
| GB1528203A (en) | 1978-10-11 |
| DE2545471C3 (de) | 1982-01-21 |
| DE2545471B2 (de) | 1981-04-16 |
| DE2545471A1 (de) | 1976-04-22 |
| FR2333831B1 (US20070167544A1-20070719-C00007.png) | 1978-04-14 |
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