FR2324107A1 - Colonne d'elements semi-conducteurs - Google Patents

Colonne d'elements semi-conducteurs

Info

Publication number
FR2324107A1
FR2324107A1 FR7528163A FR7528163A FR2324107A1 FR 2324107 A1 FR2324107 A1 FR 2324107A1 FR 7528163 A FR7528163 A FR 7528163A FR 7528163 A FR7528163 A FR 7528163A FR 2324107 A1 FR2324107 A1 FR 2324107A1
Authority
FR
France
Prior art keywords
diodes
wings
stack
column
diode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7528163A
Other languages
English (en)
French (fr)
Other versions
FR2324107B1 (enExample
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Merlin Gerin SA
Original Assignee
Merlin Gerin SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Merlin Gerin SA filed Critical Merlin Gerin SA
Priority to FR7528163A priority Critical patent/FR2324107A1/fr
Publication of FR2324107A1 publication Critical patent/FR2324107A1/fr
Application granted granted Critical
Publication of FR2324107B1 publication Critical patent/FR2324107B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/44—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements the complete device being wholly immersed in a fluid other than air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H33/00—High-tension or heavy-current switches with arc-extinguishing or arc-preventing means
    • H01H33/02—Details
    • H01H33/59—Circuit arrangements not adapted to a particular application of the switch and not otherwise provided for, e.g. for ensuring operation of the switch at a predetermined point in the AC cycle
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L23/4012—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws for stacked arrangements of a plurality of semiconductor devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group subclass H10D
    • H01L25/074—Stacked arrangements of non-apertured devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Rectifiers (AREA)
FR7528163A 1975-09-12 1975-09-12 Colonne d'elements semi-conducteurs Granted FR2324107A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR7528163A FR2324107A1 (fr) 1975-09-12 1975-09-12 Colonne d'elements semi-conducteurs

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7528163A FR2324107A1 (fr) 1975-09-12 1975-09-12 Colonne d'elements semi-conducteurs

Publications (2)

Publication Number Publication Date
FR2324107A1 true FR2324107A1 (fr) 1977-04-08
FR2324107B1 FR2324107B1 (enExample) 1979-03-23

Family

ID=9159964

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7528163A Granted FR2324107A1 (fr) 1975-09-12 1975-09-12 Colonne d'elements semi-conducteurs

Country Status (1)

Country Link
FR (1) FR2324107A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0046825B1 (fr) * 1980-09-01 1984-11-28 ATELIERS DE CONSTRUCTIONS ELECTRIQUES DE CHARLEROI (ACEC) Société Anonyme Procédé de fabrication d'un ensemble d'éléments électriques enserrés entre des masses refroidies et ensemble fabriqué selon ce procédé

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1072447A (fr) * 1952-11-20 1954-09-13 Siemens Ag Redresseur sec
FR1470169A (fr) * 1965-03-02 1967-02-17 Brown Disjoncteurs pour puissances élevées, avec emploi de valves à semi-conducteurs

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1072447A (fr) * 1952-11-20 1954-09-13 Siemens Ag Redresseur sec
FR1470169A (fr) * 1965-03-02 1967-02-17 Brown Disjoncteurs pour puissances élevées, avec emploi de valves à semi-conducteurs

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0046825B1 (fr) * 1980-09-01 1984-11-28 ATELIERS DE CONSTRUCTIONS ELECTRIQUES DE CHARLEROI (ACEC) Société Anonyme Procédé de fabrication d'un ensemble d'éléments électriques enserrés entre des masses refroidies et ensemble fabriqué selon ce procédé

Also Published As

Publication number Publication date
FR2324107B1 (enExample) 1979-03-23

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Legal Events

Date Code Title Description
ST Notification of lapse