FR2317850A1 - Printed circuit board tinning machine - has alloy melted by radiation from heater above travelling board - Google Patents

Printed circuit board tinning machine - has alloy melted by radiation from heater above travelling board

Info

Publication number
FR2317850A1
FR2317850A1 FR7521922A FR7521922A FR2317850A1 FR 2317850 A1 FR2317850 A1 FR 2317850A1 FR 7521922 A FR7521922 A FR 7521922A FR 7521922 A FR7521922 A FR 7521922A FR 2317850 A1 FR2317850 A1 FR 2317850A1
Authority
FR
France
Prior art keywords
board
radiation
printed circuit
circuit board
tinning machine
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7521922A
Other languages
French (fr)
Other versions
FR2317850B3 (en
Inventor
Michel Machet
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Institut de Recherches de la Siderurgie Francaise IRSID
Original Assignee
Institut de Recherches de la Siderurgie Francaise IRSID
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Institut de Recherches de la Siderurgie Francaise IRSID filed Critical Institut de Recherches de la Siderurgie Francaise IRSID
Priority to FR7521922A priority Critical patent/FR2317850A1/en
Publication of FR2317850A1 publication Critical patent/FR2317850A1/en
Application granted granted Critical
Publication of FR2317850B3 publication Critical patent/FR2317850B3/fr
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/005—Soldering by means of radiant energy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J49/00—Particle spectrometers or separator tubes
    • H01J49/02—Details
    • H01J49/10—Ion sources; Ion guns
    • H01J49/14—Ion sources; Ion guns using particle bombardment, e.g. ionisation chambers
    • H01J49/142—Ion sources; Ion guns using particle bombardment, e.g. ionisation chambers using a solid target which is not previously vapourised
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/043—Reflowing of solder coated conductors, not during connection of components, e.g. reflowing solder paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3473—Plating of solder

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

The tinning machine for printed circuits, melts alloy (based on tin) on the top of the printed circuit board as it is carried beneath a heating station. The board (19) is carried by an endless conveyor belt (4) driven by an electric motor and passing around two rollers (5, 6). The heating element (17) consists of a resistance wire wound on a suitable rod and extends across the conveyor belt which itself extends the width of the table supporting the machine components. The alloy is melted by radiation from the heating element. The belt is held taut by a weight suspended from it beneath the table.
FR7521922A 1975-07-11 1975-07-11 Printed circuit board tinning machine - has alloy melted by radiation from heater above travelling board Granted FR2317850A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR7521922A FR2317850A1 (en) 1975-07-11 1975-07-11 Printed circuit board tinning machine - has alloy melted by radiation from heater above travelling board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7521922A FR2317850A1 (en) 1975-07-11 1975-07-11 Printed circuit board tinning machine - has alloy melted by radiation from heater above travelling board

Publications (2)

Publication Number Publication Date
FR2317850A1 true FR2317850A1 (en) 1977-02-04
FR2317850B3 FR2317850B3 (en) 1979-04-20

Family

ID=9157857

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7521922A Granted FR2317850A1 (en) 1975-07-11 1975-07-11 Printed circuit board tinning machine - has alloy melted by radiation from heater above travelling board

Country Status (1)

Country Link
FR (1) FR2317850A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2505367A1 (en) * 1981-05-08 1982-11-12 Lignes Telegraph Telephon Plating conducting layer placed on dielectric - used for multilayer circuit for hybrid circuit
CN116351750A (en) * 2023-04-07 2023-06-30 江苏金韦尔机械有限公司 PVB diaphragm heating forming device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2505367A1 (en) * 1981-05-08 1982-11-12 Lignes Telegraph Telephon Plating conducting layer placed on dielectric - used for multilayer circuit for hybrid circuit
CN116351750A (en) * 2023-04-07 2023-06-30 江苏金韦尔机械有限公司 PVB diaphragm heating forming device
CN116351750B (en) * 2023-04-07 2023-10-31 江苏金韦尔机械有限公司 PVB diaphragm heating forming device

Also Published As

Publication number Publication date
FR2317850B3 (en) 1979-04-20

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Legal Events

Date Code Title Description
ST Notification of lapse