FR2313845B3 - - Google Patents
Info
- Publication number
- FR2313845B3 FR2313845B3 FR7616993A FR7616993A FR2313845B3 FR 2313845 B3 FR2313845 B3 FR 2313845B3 FR 7616993 A FR7616993 A FR 7616993A FR 7616993 A FR7616993 A FR 7616993A FR 2313845 B3 FR2313845 B3 FR 2313845B3
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/045—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads having an insulating passage through the base
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/03—Covers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S220/00—Receptacles
- Y10S220/29—Welded seam
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- Packaging Frangible Articles (AREA)
- Casings For Electric Apparatus (AREA)
- Container Filling Or Packaging Operations (AREA)
- Containers And Plastic Fillers For Packaging (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US05/584,105 US4015071A (en) | 1975-06-05 | 1975-06-05 | Microelectronic circuit case |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2313845A1 FR2313845A1 (fr) | 1976-12-31 |
FR2313845B3 true FR2313845B3 (fr) | 1979-02-23 |
Family
ID=24335956
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7616993A Granted FR2313845A1 (fr) | 1975-06-05 | 1976-06-04 | Boitier pour circuit micro-electronique |
Country Status (9)
Country | Link |
---|---|
US (1) | US4015071A (fr) |
CA (1) | CA1052896A (fr) |
CH (1) | CH612295A5 (fr) |
DE (1) | DE2625315A1 (fr) |
FR (1) | FR2313845A1 (fr) |
GB (1) | GB1510914A (fr) |
IL (1) | IL49604A (fr) |
NO (1) | NO141584C (fr) |
SE (1) | SE410675B (fr) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4624379A (en) * | 1985-02-04 | 1986-11-25 | Smithco Engineering | Lethal service header box |
FR2702921B1 (fr) * | 1993-03-17 | 1995-06-09 | Sextant Avionique | Boîtier électronique renforcé. |
JP2734364B2 (ja) * | 1993-12-30 | 1998-03-30 | 日本電気株式会社 | 半導体装置 |
US5477009A (en) * | 1994-03-21 | 1995-12-19 | Motorola, Inc. | Resealable multichip module and method therefore |
US20060262452A1 (en) * | 2005-05-18 | 2006-11-23 | Samsung Electronics Co., Ltd. | Method of making hermetically sealed hard disk drive by encapulation |
DE102012106643B8 (de) * | 2012-07-23 | 2014-03-27 | Progress-Werk Oberkirch Ag | Verfahren zum Herstellen eines Druckbehälters sowie derartiger Druckbehälter |
US8939314B1 (en) | 2013-07-30 | 2015-01-27 | Progress-Werk-Oberkirch AG | Method for producing a pressure vessel and pressure vessel |
EP3105399B1 (fr) | 2014-02-03 | 2023-07-05 | V-Glass, Inc. | Système de joint hermétique flexible pour ensemble de panneaux de verre plat |
US10319654B1 (en) * | 2017-12-01 | 2019-06-11 | Cubic Corporation | Integrated chip scale packages |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US1857505A (en) * | 1928-03-21 | 1932-05-10 | Smith Corp A O | Method of butt welding by means of alpha flashing electric arc |
US2285609A (en) * | 1941-09-26 | 1942-06-09 | Oiljak Mfg Company Inc | Method of making bomb burster tubes |
US2880383A (en) * | 1956-10-05 | 1959-03-31 | Motorola Inc | High frequency transistor package |
US2968713A (en) * | 1958-10-20 | 1961-01-17 | Gen Motors Corp | Weld assembly |
US3195026A (en) * | 1962-09-21 | 1965-07-13 | Westinghouse Electric Corp | Hermetically enclosed semiconductor device |
US3190952A (en) * | 1963-02-21 | 1965-06-22 | Bitko Sheldon | Welded hermetic seal |
-
1975
- 1975-06-05 US US05/584,105 patent/US4015071A/en not_active Expired - Lifetime
-
1976
- 1976-05-19 IL IL49604A patent/IL49604A/xx unknown
- 1976-05-20 SE SE7605710A patent/SE410675B/xx unknown
- 1976-05-26 NO NO761792A patent/NO141584C/no unknown
- 1976-06-02 GB GB22818/76A patent/GB1510914A/en not_active Expired
- 1976-06-03 DE DE19762625315 patent/DE2625315A1/de not_active Withdrawn
- 1976-06-04 CH CH714276A patent/CH612295A5/xx not_active IP Right Cessation
- 1976-06-04 CA CA254,118A patent/CA1052896A/fr not_active Expired
- 1976-06-04 FR FR7616993A patent/FR2313845A1/fr active Granted
Also Published As
Publication number | Publication date |
---|---|
US4015071A (en) | 1977-03-29 |
GB1510914A (en) | 1978-05-17 |
CA1052896A (fr) | 1979-04-17 |
NO141584B (no) | 1979-12-27 |
SE410675B (sv) | 1979-10-22 |
NO141584C (no) | 1980-04-09 |
DE2625315A1 (de) | 1976-12-23 |
CH612295A5 (fr) | 1979-07-13 |
NO761792L (fr) | 1976-12-07 |
IL49604A (en) | 1978-07-31 |
FR2313845A1 (fr) | 1976-12-31 |
SE7605710L (sv) | 1976-12-06 |
IL49604A0 (en) | 1976-07-30 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |