FR2313773B3 - - Google Patents
Info
- Publication number
- FR2313773B3 FR2313773B3 FR7613744A FR7613744A FR2313773B3 FR 2313773 B3 FR2313773 B3 FR 2313773B3 FR 7613744 A FR7613744 A FR 7613744A FR 7613744 A FR7613744 A FR 7613744A FR 2313773 B3 FR2313773 B3 FR 2313773B3
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H10W76/157—
-
- H10W95/00—
-
- H10W72/5445—
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US05/583,463 US4109818A (en) | 1975-06-03 | 1975-06-03 | Hermetic sealing cover for a container for semiconductor devices |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR2313773A1 FR2313773A1 (fr) | 1976-12-31 |
| FR2313773B3 true FR2313773B3 (enExample) | 1979-03-16 |
Family
ID=24333198
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR7613744A Granted FR2313773A1 (fr) | 1975-06-03 | 1976-05-07 | Procede de fabrication d'un couvercle de fermeture etanche et hermetique pour un recipient a semi-conducteur, et couvercle obtenu par ce procede |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US4109818A (enExample) |
| JP (1) | JPS594859B2 (enExample) |
| CA (1) | CA1033471A (enExample) |
| DE (1) | DE2621184C3 (enExample) |
| FR (1) | FR2313773A1 (enExample) |
| GB (1) | GB1488331A (enExample) |
Families Citing this family (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4243729A (en) * | 1978-07-31 | 1981-01-06 | Semi-Alloys, Inc. | Metallic hermetic sealing cover for a container |
| US4192433A (en) * | 1979-01-19 | 1980-03-11 | Semi-Alloys, Inc. | Hermetic sealing cover for a container for semiconductor devices |
| US4190176A (en) * | 1979-01-23 | 1980-02-26 | Semi-Alloys, Inc. | Sealing cover unit for a container for a semiconductor device |
| US4303934A (en) * | 1979-08-30 | 1981-12-01 | Burr-Brown Research Corp. | Molded lead frame dual in line package including a hybrid circuit |
| US4291815B1 (en) * | 1980-02-19 | 1998-09-29 | Semiconductor Packaging Materi | Ceramic lid assembly for hermetic sealing of a semiconductor chip |
| US4331258A (en) * | 1981-03-05 | 1982-05-25 | Raychem Corporation | Sealing cover for an hermetically sealed container |
| JPS60124848A (ja) * | 1983-12-08 | 1985-07-03 | Hitachi Chem Co Ltd | 半導体類のパッケ−ジ構造 |
| US4874722A (en) * | 1987-04-16 | 1989-10-17 | Texas Instruments Incorporated | Process of packaging a semiconductor device with reduced stress forces |
| FR2615488B1 (fr) * | 1987-05-20 | 1990-05-18 | Aluminium Societe Alsacienne | Opercule pour la fermeture d'un recipient comprenant une zone de scellage en matiere thermoplastique, et procede pour la fabrication de cet opercule |
| JPH0793393B2 (ja) * | 1988-02-22 | 1995-10-09 | 株式会社東芝 | 半導体装置の金属製シェル |
| US5230759A (en) * | 1989-10-20 | 1993-07-27 | Fujitsu Limited | Process for sealing a semiconductor device |
| US5218510A (en) * | 1991-09-23 | 1993-06-08 | Bradford Company | Suspension packaging for static-sensitive products |
| JP3579740B2 (ja) * | 1998-04-18 | 2004-10-20 | Ｔｄｋ株式会社 | 電子部品の製造方法 |
| US6827232B1 (en) * | 1999-09-16 | 2004-12-07 | Tokai Kogyo Co., Ltd. | Resin case providing compatibility between air permeability and water proofing property, and mold for producing such case |
| US7442334B2 (en) * | 1999-09-16 | 2008-10-28 | Tokai Kogyo Co., Ltd. | Resin case in which gas-permeability and waterproof quality are compatible, and die for manufacturing such case |
| IL179204A0 (en) | 2006-11-13 | 2008-01-20 | Abraham Aharoni | Multi-phase interferometer |
| JP2009001754A (ja) * | 2007-06-25 | 2009-01-08 | Kagawa Univ | 接着構造、封止構造及びそれを用いた電子部品、接着方法並びに封止方法 |
| US9056470B2 (en) * | 2008-05-15 | 2015-06-16 | Hewlett-Packard Development Company, L.P. | Flexible circuit seal |
| US7993609B2 (en) * | 2008-12-30 | 2011-08-09 | Sterilucent, Inc. | Package for chemicals |
| US20160291269A1 (en) | 2015-04-01 | 2016-10-06 | Coriant Advanced Technology, LLC | Photonic integrated circuit chip packaging |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2887737A (en) * | 1954-07-12 | 1959-05-26 | Pittsburgh Plate Glass Co | Sealing means for glazing unit |
| US3120321A (en) * | 1962-09-27 | 1964-02-04 | Central States Can Corp | Container construction |
| US3190952A (en) * | 1963-02-21 | 1965-06-22 | Bitko Sheldon | Welded hermetic seal |
| FR2155233A5 (enExample) * | 1971-10-05 | 1973-05-18 | Toyo Seikan Kaisha Ltd | |
| US3874549A (en) * | 1972-05-26 | 1975-04-01 | Norman Hascoe | Hermetic sealing cover for a container for a semiconductor device |
| US3778683A (en) * | 1972-08-28 | 1973-12-11 | Gen Electric | Self-bonding capacitor case insulation |
| US3825148A (en) * | 1972-09-25 | 1974-07-23 | Gen Electric | Hermetic sealing system for plastic tank and cover |
-
1975
- 1975-06-03 US US05/583,463 patent/US4109818A/en not_active Expired - Lifetime
-
1976
- 1976-01-29 CA CA244,510A patent/CA1033471A/en not_active Expired
- 1976-02-03 GB GB4123/76A patent/GB1488331A/en not_active Expired
- 1976-05-07 FR FR7613744A patent/FR2313773A1/fr active Granted
- 1976-05-11 DE DE2621184A patent/DE2621184C3/de not_active Expired
- 1976-05-13 JP JP51053914A patent/JPS594859B2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| US4109818A (en) | 1978-08-29 |
| DE2621184B2 (de) | 1978-10-26 |
| CA1033471A (en) | 1978-06-20 |
| GB1488331A (en) | 1977-10-12 |
| DE2621184A1 (de) | 1976-12-23 |
| JPS594859B2 (ja) | 1984-02-01 |
| FR2313773A1 (fr) | 1976-12-31 |
| JPS51148360A (en) | 1976-12-20 |
| DE2621184C3 (de) | 1979-08-02 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| ST | Notification of lapse |