FR2307376A1 - Colonne de thyristors - Google Patents

Colonne de thyristors

Info

Publication number
FR2307376A1
FR2307376A1 FR7609202A FR7609202A FR2307376A1 FR 2307376 A1 FR2307376 A1 FR 2307376A1 FR 7609202 A FR7609202 A FR 7609202A FR 7609202 A FR7609202 A FR 7609202A FR 2307376 A1 FR2307376 A1 FR 2307376A1
Authority
FR
France
Prior art keywords
thyristor
stack
static
elements
invertors
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7609202A
Other languages
English (en)
Other versions
FR2307376B1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of FR2307376A1 publication Critical patent/FR2307376A1/fr
Application granted granted Critical
Publication of FR2307376B1 publication Critical patent/FR2307376B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L23/4012—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws for stacked arrangements of a plurality of semiconductor devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/11—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/117—Stacked arrangements of devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Rectifiers (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
FR7609202A 1975-04-07 1976-03-30 Colonne de thyristors Granted FR2307376A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2515046A DE2515046C3 (de) 1975-04-07 1975-04-07 Thyristorsäule

Publications (2)

Publication Number Publication Date
FR2307376A1 true FR2307376A1 (fr) 1976-11-05
FR2307376B1 FR2307376B1 (fr) 1979-02-02

Family

ID=5943225

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7609202A Granted FR2307376A1 (fr) 1975-04-07 1976-03-30 Colonne de thyristors

Country Status (8)

Country Link
JP (1) JPS51123079A (fr)
AT (1) AT338380B (fr)
BE (1) BE840381A (fr)
CH (1) CH590560A5 (fr)
DE (1) DE2515046C3 (fr)
FR (1) FR2307376A1 (fr)
IN (1) IN143133B (fr)
SE (1) SE7601879L (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0066808A2 (fr) * 1981-05-28 1982-12-15 Kabushiki Kaisha Toshiba Dispositif de haute tension à refroidissement à l'eau

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH629913A5 (de) * 1977-07-12 1982-05-14 Asea Ab Fluessigkeitsgekuehltes thyristorventil.
CH661151A5 (de) * 1980-06-03 1987-06-30 Mitsubishi Electric Corp Halbleiterelementstapel.
FR2524760B1 (fr) * 1982-03-30 1986-10-10 Auxilec Piece de maintien pour semiconducteur, et dispositif de puissance a semiconducteur comportant une telle piece
DE19805820A1 (de) * 1998-02-13 1999-08-19 Asea Brown Boveri Halbleiter-Spannstapel
DE19937671B4 (de) * 1999-08-10 2011-04-21 Siemens Ag Luftgekühlte Stromrichter-Brückenschaltung

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4721093U (fr) * 1971-03-09 1972-11-09

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
NEANT *

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0066808A2 (fr) * 1981-05-28 1982-12-15 Kabushiki Kaisha Toshiba Dispositif de haute tension à refroidissement à l'eau
EP0066808A3 (en) * 1981-05-28 1985-04-17 Kabushiki Kaisha Toshiba Water-cooled high voltage device

Also Published As

Publication number Publication date
AT338380B (de) 1977-08-25
JPS51123079A (en) 1976-10-27
IN143133B (fr) 1977-10-08
SE7601879L (sv) 1976-10-08
DE2515046C3 (de) 1980-03-20
ATA104176A (de) 1976-12-15
DE2515046A1 (de) 1976-10-14
CH590560A5 (fr) 1977-08-15
DE2515046B2 (de) 1979-07-05
BE840381A (fr) 1976-08-02
FR2307376B1 (fr) 1979-02-02

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Legal Events

Date Code Title Description
ST Notification of lapse