FR2307375A1 - Dispositif semi-conducteur enrobe de verre - Google Patents

Dispositif semi-conducteur enrobe de verre

Info

Publication number
FR2307375A1
FR2307375A1 FR7610131A FR7610131A FR2307375A1 FR 2307375 A1 FR2307375 A1 FR 2307375A1 FR 7610131 A FR7610131 A FR 7610131A FR 7610131 A FR7610131 A FR 7610131A FR 2307375 A1 FR2307375 A1 FR 2307375A1
Authority
FR
France
Prior art keywords
semiconductor device
glass coated
coated semiconductor
glass
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7610131A
Other languages
English (en)
Other versions
FR2307375B1 (fr
Inventor
Kensuke Suzuki
Takeshi Sasaki
Mitsuyuki Matsuzaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP4129475A external-priority patent/JPS51122377A/ja
Priority claimed from JP50041293A external-priority patent/JPS51122376A/ja
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of FR2307375A1 publication Critical patent/FR2307375A1/fr
Application granted granted Critical
Publication of FR2307375B1 publication Critical patent/FR2307375B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • H—ELECTRICITY
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/291—Oxides or nitrides or carbides, e.g. ceramics, glass
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    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
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    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3157—Partial encapsulation or coating
    • H01L23/3171—Partial encapsulation or coating the coating being directly applied to the semiconductor body, e.g. passivation layer
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/492—Bases or plates or solder therefor
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
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    • H01L2924/01005—Boron [B]
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    • H01L2924/01006—Carbon [C]
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    • H01L2924/01051—Antimony [Sb]
    • H—ELECTRICITY
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    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
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    • H01L2924/01078—Platinum [Pt]
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    • H01L2924/01079—Gold [Au]
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    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]
    • H—ELECTRICITY
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    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1203—Rectifying Diode
    • H01L2924/12036—PN diode
    • H—ELECTRICITY
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    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Die Bonding (AREA)
  • Wire Bonding (AREA)
  • Electrodes Of Semiconductors (AREA)
FR7610131A 1975-04-07 1976-04-07 Dispositif semi-conducteur enrobe de verre Granted FR2307375A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP4129475A JPS51122377A (en) 1975-04-07 1975-04-07 Manufacturing method of glass sealed semiconductor
JP50041293A JPS51122376A (en) 1975-04-07 1975-04-07 Method of manufacture of glass sealed semiconductor

Publications (2)

Publication Number Publication Date
FR2307375A1 true FR2307375A1 (fr) 1976-11-05
FR2307375B1 FR2307375B1 (fr) 1978-10-13

Family

ID=26380864

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7610131A Granted FR2307375A1 (fr) 1975-04-07 1976-04-07 Dispositif semi-conducteur enrobe de verre

Country Status (5)

Country Link
US (1) US4059837A (fr)
DE (1) DE2614851A1 (fr)
FR (1) FR2307375A1 (fr)
GB (1) GB1506125A (fr)
NL (1) NL163674C (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2387498A1 (fr) * 1977-04-15 1978-11-10 Hitachi Ltd Dispositif de jonction composite comportant une structure composite de fibres de carbone noyees dans une matrice de cuivre
DE3122387A1 (de) * 1981-06-05 1982-12-23 Deutsche Itt Industries Gmbh, 7800 Freiburg "glasumhuellte halbleiterdiode und verfahren zur herstellung"

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS531469A (en) * 1976-06-26 1978-01-09 Hitachi Ltd Glass seal type semiconductor device
JPS54978A (en) * 1977-06-06 1979-01-06 Hitachi Ltd Semiconductor device of glass seal type
DE3005301C2 (de) * 1980-02-13 1985-11-21 Telefunken electronic GmbH, 7100 Heilbronn Varaktor- oder Mischerdiode
DE3005302C2 (de) * 1980-02-13 1985-12-12 Telefunken electronic GmbH, 7100 Heilbronn Varaktor- oder Mischerdiode
US4987476A (en) * 1988-02-01 1991-01-22 General Instrument Corporation Brazed glass pre-passivated chip rectifier
US5248902A (en) * 1991-08-30 1993-09-28 General Instrument Corporation Surface mounting diode
US6111316A (en) * 1997-08-29 2000-08-29 Motorola, Inc. Electronic component encapsulated in a glass tube
US20060038302A1 (en) * 2004-08-19 2006-02-23 Kejun Zeng Thermal fatigue resistant tin-lead-silver solder
DE102010062346A1 (de) * 2010-12-02 2012-06-06 Robert Bosch Gmbh Elektronische Baugruppe sowie Verfahren zu deren Herstellung
US11584673B2 (en) * 2017-07-31 2023-02-21 Corning Incorporated Laminate article having a non-glass core and glass envelope and methods thereof

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3032695A (en) * 1957-03-20 1962-05-01 Bosch Gmbh Robert Alloyed junction semiconductive device
US3237272A (en) * 1965-07-06 1966-03-01 Motorola Inc Method of making semiconductor device
US3365628A (en) * 1965-09-16 1968-01-23 Texas Instruments Inc Metallic contacts for semiconductor devices
US3913127A (en) * 1971-10-01 1975-10-14 Hitachi Ltd Glass encapsulated semiconductor device containing cylindrical stack of semiconductor pellets
US3930306A (en) * 1974-04-24 1976-01-06 General Instrument Corporation Process for attaching a lead member to a semiconductor device

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
NEANT *

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2387498A1 (fr) * 1977-04-15 1978-11-10 Hitachi Ltd Dispositif de jonction composite comportant une structure composite de fibres de carbone noyees dans une matrice de cuivre
DE3122387A1 (de) * 1981-06-05 1982-12-23 Deutsche Itt Industries Gmbh, 7800 Freiburg "glasumhuellte halbleiterdiode und verfahren zur herstellung"

Also Published As

Publication number Publication date
NL163674C (nl) 1980-09-15
GB1506125A (en) 1978-04-05
FR2307375B1 (fr) 1978-10-13
US4059837A (en) 1977-11-22
NL7603580A (nl) 1976-10-11
NL163674B (nl) 1980-04-15
DE2614851A1 (de) 1976-10-21

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