FR2295674A1 - Ensemble compose formant circuit electrique ou electronique et procede de realisation d'un tel ensemble - Google Patents

Ensemble compose formant circuit electrique ou electronique et procede de realisation d'un tel ensemble

Info

Publication number
FR2295674A1
FR2295674A1 FR7538338A FR7538338A FR2295674A1 FR 2295674 A1 FR2295674 A1 FR 2295674A1 FR 7538338 A FR7538338 A FR 7538338A FR 7538338 A FR7538338 A FR 7538338A FR 2295674 A1 FR2295674 A1 FR 2295674A1
Authority
FR
France
Prior art keywords
assembly
electrical
making
electronic circuit
assembly composed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
FR7538338A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CBS Corp
Original Assignee
Westinghouse Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Westinghouse Electric Corp filed Critical Westinghouse Electric Corp
Publication of FR2295674A1 publication Critical patent/FR2295674A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/7076—Coupling devices for connection between PCB and component, e.g. display

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Combinations Of Printed Boards (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Multi-Conductor Connections (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
FR7538338A 1974-12-16 1975-12-15 Ensemble compose formant circuit electrique ou electronique et procede de realisation d'un tel ensemble Withdrawn FR2295674A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/533,405 US4059849A (en) 1974-12-16 1974-12-16 Interconnected module

Publications (1)

Publication Number Publication Date
FR2295674A1 true FR2295674A1 (fr) 1976-07-16

Family

ID=24125815

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7538338A Withdrawn FR2295674A1 (fr) 1974-12-16 1975-12-15 Ensemble compose formant circuit electrique ou electronique et procede de realisation d'un tel ensemble

Country Status (8)

Country Link
US (1) US4059849A (fr)
JP (1) JPS5530317B2 (fr)
CA (1) CA1042541A (fr)
DE (1) DE2556638A1 (fr)
FR (1) FR2295674A1 (fr)
GB (1) GB1481590A (fr)
IT (1) IT1056351B (fr)
NL (1) NL7513617A (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2747876A1 (fr) * 1996-04-18 1997-10-24 Int Rectifier Corp Repartition des composants d'un systeme de commande de moteur

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5734782Y2 (fr) * 1976-12-10 1982-07-31
US4426689A (en) 1979-03-12 1984-01-17 International Business Machines Corporation Vertical semiconductor integrated circuit chip packaging
US4245184A (en) * 1979-03-23 1981-01-13 Westinghouse Electric Corp. AC Solid-state circuit breaker
US4328530A (en) * 1980-06-30 1982-05-04 International Business Machines Corporation Multiple layer, ceramic carrier for high switching speed VLSI chips
US4504821A (en) * 1982-01-15 1985-03-12 General Electric Company Integrated circuit board system and an integrated circuit board assembly for application thereto
JPS59123975U (ja) * 1983-02-09 1984-08-21 トーマス・アンド・ベツツ・コーポレーション ジヤンパ用線材
DE3406528A1 (de) * 1984-02-23 1985-08-29 Brown, Boveri & Cie Ag, 6800 Mannheim Leistungshalbleitermodul
JPS6111240A (ja) * 1984-06-28 1986-01-18 積水化学工業株式会社 被覆樹脂体およびその製造方法
US5191404A (en) * 1989-12-20 1993-03-02 Digital Equipment Corporation High density memory array packaging
US5113314A (en) * 1991-01-24 1992-05-12 Hewlett-Packard Company High-speed, high-density chip mounting
DE4136355A1 (de) * 1991-11-05 1993-05-06 Smt & Hybrid Gmbh, O-8010 Dresden, De Verfahren und anordnung zur dreidimensionalen montage von elektronischen bauteilen und sensoren
US5241454A (en) * 1992-01-22 1993-08-31 International Business Machines Corporation Mutlilayered flexible circuit package
JPH08264950A (ja) * 1995-03-27 1996-10-11 Hitachi Ltd 電子部品の実装体
JP3768908B2 (ja) * 2001-03-27 2006-04-19 キヤノン株式会社 電子放出素子、電子源、画像形成装置
US6653831B2 (en) * 2001-11-20 2003-11-25 Gentex Corporation Magnetometer having a dynamically adjustable bias setting and electronic vehicle compass incorporating the same
US6609915B2 (en) * 2001-11-30 2003-08-26 Fci Americas Technology Interconnect for electrically connecting a multichip module to a circuit substrate and processes for making and using same
US7005584B2 (en) * 2004-02-13 2006-02-28 Honeywell International Inc. Compact navigation device assembly
US20140185214A1 (en) * 2012-12-31 2014-07-03 Zhen Jia Stacked power module for graphics processing unit

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA680949A (en) * 1964-02-25 J. Kinsella John Module wafer and connector therefor
US2907926A (en) * 1955-12-09 1959-10-06 Ibm Electrical circuit assembly
US2978612A (en) * 1956-07-27 1961-04-04 Illinois Tool Works Modularized radio receiver
US3087096A (en) * 1960-01-18 1963-04-23 Gen Dynamics Corp Wafer parametron
US3614541A (en) * 1969-04-08 1971-10-19 North American Rockwell Package for an electronic assembly

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2747876A1 (fr) * 1996-04-18 1997-10-24 Int Rectifier Corp Repartition des composants d'un systeme de commande de moteur

Also Published As

Publication number Publication date
NL7513617A (nl) 1976-06-18
DE2556638A1 (de) 1976-07-01
CA1042541A (fr) 1978-11-14
US4059849A (en) 1977-11-22
JPS5530317B2 (fr) 1980-08-09
IT1056351B (it) 1982-01-30
JPS5186765A (fr) 1976-07-29
GB1481590A (en) 1977-08-03

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Legal Events

Date Code Title Description
ST Notification of lapse
AR Application made for restoration
DI Inadmissibility of an action of restoration