FR2284190B1 - - Google Patents

Info

Publication number
FR2284190B1
FR2284190B1 FR7521491A FR7521491A FR2284190B1 FR 2284190 B1 FR2284190 B1 FR 2284190B1 FR 7521491 A FR7521491 A FR 7521491A FR 7521491 A FR7521491 A FR 7521491A FR 2284190 B1 FR2284190 B1 FR 2284190B1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR7521491A
Other versions
FR2284190A1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of FR2284190A1 publication Critical patent/FR2284190A1/fr
Application granted granted Critical
Publication of FR2284190B1 publication Critical patent/FR2284190B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/142—Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5383—Multilayer substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/818—Bonding techniques
    • H01L2224/81801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
FR7521491A 1974-09-06 1975-07-04 Assemblage fonctionnel pour systemes electroniques complexes et son procede de fabrication Granted FR2284190A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/503,883 US3952231A (en) 1974-09-06 1974-09-06 Functional package for complex electronic systems with polymer-metal laminates and thermal transposer

Publications (2)

Publication Number Publication Date
FR2284190A1 FR2284190A1 (fr) 1976-04-02
FR2284190B1 true FR2284190B1 (fr) 1978-03-17

Family

ID=24003911

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7521491A Granted FR2284190A1 (fr) 1974-09-06 1975-07-04 Assemblage fonctionnel pour systemes electroniques complexes et son procede de fabrication

Country Status (7)

Country Link
US (1) US3952231A (fr)
JP (1) JPS5147264A (fr)
CA (1) CA1037615A (fr)
DE (1) DE2536316C2 (fr)
FR (1) FR2284190A1 (fr)
GB (1) GB1491627A (fr)
IT (1) IT1041939B (fr)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4074342A (en) * 1974-12-20 1978-02-14 International Business Machines Corporation Electrical package for lsi devices and assembly process therefor
US4472762A (en) * 1980-09-25 1984-09-18 Texas Instruments Incorporated Electronic circuit interconnection system
US4385202A (en) * 1980-09-25 1983-05-24 Texas Instruments Incorporated Electronic circuit interconnection system
US4546406A (en) * 1980-09-25 1985-10-08 Texas Instruments Incorporated Electronic circuit interconnection system
US4377316A (en) * 1981-02-27 1983-03-22 International Business Machines Corporation High density interconnection means for chip carriers
DE3123620A1 (de) * 1981-06-13 1983-01-05 Telefonbau Und Normalzeit Gmbh, 6000 Frankfurt Anordnung zum verbinden eines speichers mit einer steuereinrichtung
FR2529416B1 (fr) * 1982-06-25 1985-11-29 Carpano & Pons Procede de transmission de donnees sous forme serie et dispositif pour la mise en oeuvre de ce procede
US4591659A (en) * 1983-12-22 1986-05-27 Trw Inc. Multilayer printed circuit board structure
US4689110A (en) * 1983-12-22 1987-08-25 Trw Inc. Method of fabricating multilayer printed circuit board structure
JPS62108593A (ja) * 1985-11-06 1987-05-19 日本電気株式会社 多層配線基板
US4788627A (en) * 1986-06-06 1988-11-29 Tektronix, Inc. Heat sink device using composite metal alloy
FR2616997B1 (fr) * 1987-06-16 1989-08-25 Thomson Csf Support pour circuit imprime, formant drain thermique a dilatation controlee, et procede de fabrication
JPH02237197A (ja) * 1989-03-10 1990-09-19 Hitachi Ltd 多層回路基板及びその製造方法並びにその用途
DE4132947C2 (de) * 1991-10-04 1998-11-26 Export Contor Ausenhandelsgese Elektronische Schaltungsanordnung
US5305186A (en) * 1993-01-27 1994-04-19 International Business Machines Corporation Power carrier with selective thermal performance
FR2716769B1 (fr) * 1994-02-28 1996-05-15 Peugeot Dispositif de commande et de contrôle d'un moteur électronique, support utilisable dans un tel dispositif et utilisation de ce support pour la réalisation d'une batterie d'éléments d'accumulateurs électriques.
JP2000331835A (ja) * 1999-05-21 2000-11-30 Taiyo Yuden Co Ltd 積層電子部品及び回路モジュール
US20020185726A1 (en) * 2001-06-06 2002-12-12 North Mark T. Heat pipe thermal management of high potential electronic chip packages
US6519157B1 (en) * 2001-10-23 2003-02-11 Nlight Photonics Corporation System and method for mounting a stack-up structure
US7064963B2 (en) * 2004-04-01 2006-06-20 Delphi Technologies, Inc. Multi-substrate circuit assembly
DE102004019431A1 (de) * 2004-04-19 2005-11-10 Siemens Ag Hybrider Leiterplattenaufbau zur kompakten Aufbautechnik von elektrischen Bauelementen
EP1916884B1 (fr) * 2006-10-27 2011-04-06 Agie Charmilles SA Unité de carte de circuit imprimé et procédé de sa production
AT12319U1 (de) * 2009-07-10 2012-03-15 Austria Tech & System Tech Verfahren zum herstellen einer aus wenigstens zwei leiterplattenbereichen bestehenden leiterplatte sowie leiterplatte
CN105570848B (zh) * 2015-12-02 2016-11-30 宁波凯耀电器制造有限公司 一种复合型led线路板及制作方法
GB2549128B (en) * 2016-04-06 2019-06-12 Ge Aviat Systems Ltd Power control system with improved thermal performance

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3300686A (en) * 1963-07-30 1967-01-24 Ibm Compatible packaging of miniaturized circuit modules
US3593070A (en) * 1968-12-17 1971-07-13 Texas Instruments Inc Submount for semiconductor assembly
US3705332A (en) * 1970-06-25 1972-12-05 Howard L Parks Electrical circuit packaging structure and method of fabrication thereof
US3808474A (en) * 1970-10-29 1974-04-30 Texas Instruments Inc Semiconductor devices
US3757175A (en) * 1971-01-06 1973-09-04 Soo Kim Chang Tor chips mounted on a single substrate composite integrated circuits with coplnaar connections to semiconduc
US3728589A (en) * 1971-04-16 1973-04-17 Rca Corp Semiconductor assembly
US3726002A (en) * 1971-08-27 1973-04-10 Ibm Process for forming a multi-layer glass-metal module adaptable for integral mounting to a dissimilar refractory substrate
US3719860A (en) * 1971-09-30 1973-03-06 Burroughs Corp Circuit component mounting with cooling plate
US3774078A (en) * 1972-03-29 1973-11-20 Massachusetts Inst Technology Thermally integrated electronic assembly with tapered heat conductor
US3764856A (en) * 1972-05-17 1973-10-09 Massachusetts Inst Technology Heat transfer in electronic equipment
US3777220A (en) * 1972-06-30 1973-12-04 Ibm Circuit panel and method of construction
JPS5531637B2 (fr) * 1972-07-27 1980-08-19
US3777221A (en) * 1972-12-18 1973-12-04 Ibm Multi-layer circuit package

Also Published As

Publication number Publication date
JPS5147264A (fr) 1976-04-22
US3952231A (en) 1976-04-20
IT1041939B (it) 1980-01-10
DE2536316C2 (de) 1982-10-28
DE2536316A1 (de) 1976-03-18
FR2284190A1 (fr) 1976-04-02
CA1037615A (fr) 1978-08-29
GB1491627A (en) 1977-11-09

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Legal Events

Date Code Title Description
ST Notification of lapse