FR2263603A1 - Encapsulating PN-junction in silicone rubber - by stacking semiconductor wafers with PTFE spacers in clamping frame - Google Patents
Encapsulating PN-junction in silicone rubber - by stacking semiconductor wafers with PTFE spacers in clamping frameInfo
- Publication number
- FR2263603A1 FR2263603A1 FR7506520A FR7506520A FR2263603A1 FR 2263603 A1 FR2263603 A1 FR 2263603A1 FR 7506520 A FR7506520 A FR 7506520A FR 7506520 A FR7506520 A FR 7506520A FR 2263603 A1 FR2263603 A1 FR 2263603A1
- Authority
- FR
- France
- Prior art keywords
- junction
- silicone rubber
- semiconductor wafers
- encapsulating
- clamping frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title abstract 4
- 235000012431 wafers Nutrition 0.000 title abstract 3
- 239000004810 polytetrafluoroethylene Substances 0.000 title abstract 2
- 229920001343 polytetrafluoroethylene Polymers 0.000 title abstract 2
- 229920002379 silicone rubber Polymers 0.000 title abstract 2
- 239000004945 silicone rubber Substances 0.000 title abstract 2
- 125000006850 spacer group Chemical group 0.000 title abstract 2
- 230000015556 catabolic process Effects 0.000 abstract 1
- 239000000428 dust Substances 0.000 abstract 1
- 239000011810 insulating material Substances 0.000 abstract 1
- 230000002093 peripheral effect Effects 0.000 abstract 1
- 239000004033 plastic Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
- H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3157—Partial encapsulation or coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01015—Phosphorus [P]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01023—Vanadium [V]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01047—Silver [Ag]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01058—Cerium [Ce]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1203—Rectifying Diode
- H01L2924/12036—PN diode
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CH299574A CH570045A5 (enrdf_load_html_response) | 1974-03-04 | 1974-03-04 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR2263603A1 true FR2263603A1 (en) | 1975-10-03 |
| FR2263603B1 FR2263603B1 (enrdf_load_html_response) | 1980-11-07 |
Family
ID=4246277
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR7506520A Granted FR2263603A1 (en) | 1974-03-04 | 1975-03-03 | Encapsulating PN-junction in silicone rubber - by stacking semiconductor wafers with PTFE spacers in clamping frame |
Country Status (3)
| Country | Link |
|---|---|
| CH (1) | CH570045A5 (enrdf_load_html_response) |
| DE (2) | DE2414163A1 (enrdf_load_html_response) |
| FR (1) | FR2263603A1 (enrdf_load_html_response) |
-
1974
- 1974-03-04 CH CH299574A patent/CH570045A5/xx not_active IP Right Cessation
- 1974-03-23 DE DE2414163A patent/DE2414163A1/de not_active Withdrawn
- 1974-03-23 DE DE19757540835U patent/DE7540835U/de not_active Expired
-
1975
- 1975-03-03 FR FR7506520A patent/FR2263603A1/fr active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| CH570045A5 (enrdf_load_html_response) | 1975-11-28 |
| DE7540835U (de) | 1976-04-22 |
| FR2263603B1 (enrdf_load_html_response) | 1980-11-07 |
| DE2414163A1 (de) | 1975-09-11 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| ST | Notification of lapse |