FR2249519A1 - - Google Patents
Info
- Publication number
- FR2249519A1 FR2249519A1 FR7338233A FR7338233A FR2249519A1 FR 2249519 A1 FR2249519 A1 FR 2249519A1 FR 7338233 A FR7338233 A FR 7338233A FR 7338233 A FR7338233 A FR 7338233A FR 2249519 A1 FR2249519 A1 FR 2249519A1
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0092—Treatment of the terminal leads as a separate operation
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
- H05K2201/10984—Component carrying a connection agent, e.g. solder, adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/0415—Small preforms other than balls, e.g. discs, cylinders or pillars
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR7338233A FR2249519B1 (en) | 1973-03-08 | 1973-03-08 | |
JP9981173A JPS49100793A (en) | 1972-09-12 | 1973-09-06 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR7338233A FR2249519B1 (en) | 1973-03-08 | 1973-03-08 |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2249519A1 true FR2249519A1 (en) | 1975-05-23 |
FR2249519B1 FR2249519B1 (en) | 1976-10-01 |
Family
ID=9126966
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7338233A Expired FR2249519B1 (en) | 1972-09-12 | 1973-03-08 |
Country Status (1)
Country | Link |
---|---|
FR (1) | FR2249519B1 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0130643A1 (en) * | 1983-06-24 | 1985-01-09 | Weld-Equip B.V. | Device for soldering an element to a print substrate |
EP0513425A1 (en) * | 1990-02-22 | 1992-11-19 | ISHII, Mitoshi | Method of bending lead of electric part and bender therefor |
-
1973
- 1973-03-08 FR FR7338233A patent/FR2249519B1/fr not_active Expired
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0130643A1 (en) * | 1983-06-24 | 1985-01-09 | Weld-Equip B.V. | Device for soldering an element to a print substrate |
EP0513425A1 (en) * | 1990-02-22 | 1992-11-19 | ISHII, Mitoshi | Method of bending lead of electric part and bender therefor |
Also Published As
Publication number | Publication date |
---|---|
FR2249519B1 (en) | 1976-10-01 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |