FR2224875B1 - - Google Patents

Info

Publication number
FR2224875B1
FR2224875B1 FR7311980A FR7311980A FR2224875B1 FR 2224875 B1 FR2224875 B1 FR 2224875B1 FR 7311980 A FR7311980 A FR 7311980A FR 7311980 A FR7311980 A FR 7311980A FR 2224875 B1 FR2224875 B1 FR 2224875B1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR7311980A
Other languages
French (fr)
Other versions
FR2224875A1 (ko
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thales SA
Original Assignee
Thomson CSF SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thomson CSF SA filed Critical Thomson CSF SA
Priority to FR7311980A priority Critical patent/FR2224875B1/fr
Priority to BE142753A priority patent/BE813190A/xx
Priority to DE2415893A priority patent/DE2415893A1/de
Priority to IT4998674A priority patent/IT1011209B/it
Priority to GB1485174A priority patent/GB1454836A/en
Priority to JP3705174A priority patent/JPS49131385A/ja
Publication of FR2224875A1 publication Critical patent/FR2224875A1/fr
Priority to FR7441523A priority patent/FR2295571A2/fr
Priority to BE162648A priority patent/BE836525R/fr
Priority to DE19752556904 priority patent/DE2556904A1/de
Application granted granted Critical
Publication of FR2224875B1 publication Critical patent/FR2224875B1/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/08—Cooling, heating or ventilating arrangements
    • H01C1/082—Cooling, heating or ventilating arrangements using forced fluid flow
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1301—Thyristor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19043—Component type being a resistor

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Die Bonding (AREA)
FR7311980A 1973-04-03 1973-04-03 Expired FR2224875B1 (ko)

Priority Applications (9)

Application Number Priority Date Filing Date Title
FR7311980A FR2224875B1 (ko) 1973-04-03 1973-04-03
DE2415893A DE2415893A1 (de) 1973-04-03 1974-04-02 Kuehlvorrichtung
IT4998674A IT1011209B (it) 1973-04-03 1974-04-02 Dispositivo di raffreddamento per componenti a forte dissipazione termica
BE142753A BE813190A (fr) 1973-04-03 1974-04-02 Dispositif de refroidissement pour composants a forte dissipation thermique
GB1485174A GB1454836A (en) 1973-04-03 1974-04-03 Cooling device for components which dissipate a large amount of heat
JP3705174A JPS49131385A (ko) 1973-04-03 1974-04-03
FR7441523A FR2295571A2 (fr) 1973-04-03 1974-12-17 Dispositif de refroidissement pour composants a forte dissipation thermique
BE162648A BE836525R (fr) 1973-04-03 1975-12-11 Dispositif de refroidissement pour composants a forte dissipation thermique
DE19752556904 DE2556904A1 (de) 1973-04-03 1975-12-17 Kuehlvorrichtung fuer bauteile mit hoher verlustwaerme

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7311980A FR2224875B1 (ko) 1973-04-03 1973-04-03

Publications (2)

Publication Number Publication Date
FR2224875A1 FR2224875A1 (ko) 1974-10-31
FR2224875B1 true FR2224875B1 (ko) 1978-10-27

Family

ID=9117343

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7311980A Expired FR2224875B1 (ko) 1973-04-03 1973-04-03

Country Status (6)

Country Link
JP (1) JPS49131385A (ko)
BE (1) BE813190A (ko)
DE (1) DE2415893A1 (ko)
FR (1) FR2224875B1 (ko)
GB (1) GB1454836A (ko)
IT (1) IT1011209B (ko)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5722449Y2 (ko) * 1977-12-28 1982-05-15
CH659735A5 (de) * 1982-05-13 1987-02-13 Bbc Brown Boveri & Cie Kuehlkoerper zur fluessigkeitskuehlung von leistungshalbleiterelementen.
US4965658A (en) * 1988-12-29 1990-10-23 York International Corporation System for mounting and cooling power semiconductor devices
US5099311A (en) * 1991-01-17 1992-03-24 The United States Of America As Represented By The United States Department Of Energy Microchannel heat sink assembly
DE4217289C2 (de) * 1992-05-25 1996-08-29 Mannesmann Ag Fluidgekühlte Leistungstransistoranordnung
DE4217598A1 (de) * 1992-05-27 1993-12-02 Siemens Nixdorf Inf Syst Einbausystem für auf Leiterplatten montierte hochintegrierte, gehäuselose Bausteine
DE4217599C2 (de) * 1992-05-27 1994-08-25 Siemens Nixdorf Inf Syst Einbausystem für auf Leiterplatten montierte, hochintegrierte, gehäuselose Bausteine
DE4327895A1 (de) * 1993-08-19 1995-02-23 Abb Management Ag Stromrichtermodul
US7228888B2 (en) * 2005-10-13 2007-06-12 International Business Machines Corporation Rotatable liquid reservoir for computer cooling
CN102105980B (zh) * 2008-07-25 2013-07-24 皇家飞利浦电子股份有限公司 用于冷却半导体管芯的冷却装置
JP2010114121A (ja) * 2008-11-04 2010-05-20 Daikin Ind Ltd 電装部品の放熱器

Also Published As

Publication number Publication date
BE813190A (fr) 1974-07-31
JPS49131385A (ko) 1974-12-17
IT1011209B (it) 1977-01-20
DE2415893A1 (de) 1974-10-17
GB1454836A (en) 1976-11-03
FR2224875A1 (ko) 1974-10-31

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Legal Events

Date Code Title Description
ST Notification of lapse