FR2219612A1 - - Google Patents

Info

Publication number
FR2219612A1
FR2219612A1 FR7306216A FR7306216A FR2219612A1 FR 2219612 A1 FR2219612 A1 FR 2219612A1 FR 7306216 A FR7306216 A FR 7306216A FR 7306216 A FR7306216 A FR 7306216A FR 2219612 A1 FR2219612 A1 FR 2219612A1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
FR7306216A
Other languages
French (fr)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BOUYER PAUL FR
Original Assignee
BOUYER PAUL FR
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BOUYER PAUL FR filed Critical BOUYER PAUL FR
Priority to FR7306216A priority Critical patent/FR2219612A1/fr
Publication of FR2219612A1 publication Critical patent/FR2219612A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
FR7306216A 1973-02-22 1973-02-22 Withdrawn FR2219612A1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR7306216A FR2219612A1 (de) 1973-02-22 1973-02-22

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7306216A FR2219612A1 (de) 1973-02-22 1973-02-22

Publications (1)

Publication Number Publication Date
FR2219612A1 true FR2219612A1 (de) 1974-09-20

Family

ID=9115228

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7306216A Withdrawn FR2219612A1 (de) 1973-02-22 1973-02-22

Country Status (1)

Country Link
FR (1) FR2219612A1 (de)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0051024A2 (de) * 1980-10-24 1982-05-05 Fujitsu Limited Gehäuse für elektronische Nachrichteneinrichtungen
WO1997029623A1 (en) * 1996-02-09 1997-08-14 3Com Ireland Electronic device enclosure
GB2325571A (en) * 1996-02-09 1998-11-25 3Com Ireland Electronic device enclosure
WO2008124981A1 (fr) 2007-04-17 2008-10-23 Huawei Technologies Co., Ltd. Procédé de dissipation de chaleur pour des boîtes enfichables dans une armoire et appareil de guidage d'air
WO2016124006A1 (zh) * 2015-02-06 2016-08-11 中兴通讯股份有限公司 一种导风插箱及机柜
WO2020035542A1 (fr) * 2018-08-17 2020-02-20 Latelec Baie avionique à cloison de séparation souple

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0051024A2 (de) * 1980-10-24 1982-05-05 Fujitsu Limited Gehäuse für elektronische Nachrichteneinrichtungen
EP0051024A3 (en) * 1980-10-24 1984-09-12 Fujitsu Limited Shelf unit for electronic communication devices
WO1997029623A1 (en) * 1996-02-09 1997-08-14 3Com Ireland Electronic device enclosure
GB2325571A (en) * 1996-02-09 1998-11-25 3Com Ireland Electronic device enclosure
WO2008124981A1 (fr) 2007-04-17 2008-10-23 Huawei Technologies Co., Ltd. Procédé de dissipation de chaleur pour des boîtes enfichables dans une armoire et appareil de guidage d'air
EP2071910A1 (de) * 2007-04-17 2009-06-17 Huawei Technologies Co., Ltd. Verfahren zur wärmeableitung für einsteckkästen im gehäuse und luftleitvorrichtung
EP2071910A4 (de) * 2007-04-17 2009-08-26 Huawei Tech Co Ltd Verfahren zur wärmeableitung für einsteckkästen im gehäuse und luftleitvorrichtung
WO2016124006A1 (zh) * 2015-02-06 2016-08-11 中兴通讯股份有限公司 一种导风插箱及机柜
WO2020035542A1 (fr) * 2018-08-17 2020-02-20 Latelec Baie avionique à cloison de séparation souple
FR3085100A1 (fr) * 2018-08-17 2020-02-21 Latelec Baie avionique a cloison de separation souple

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Legal Events

Date Code Title Description
ST Notification of lapse