FR2217906A1 - - Google Patents

Info

Publication number
FR2217906A1
FR2217906A1 FR7305330A FR7305330A FR2217906A1 FR 2217906 A1 FR2217906 A1 FR 2217906A1 FR 7305330 A FR7305330 A FR 7305330A FR 7305330 A FR7305330 A FR 7305330A FR 2217906 A1 FR2217906 A1 FR 2217906A1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7305330A
Other languages
French (fr)
Other versions
FR2217906B3 (de
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Radiall SA
Original Assignee
Radiall SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Radiall SA filed Critical Radiall SA
Priority to FR7305330A priority Critical patent/FR2217906B3/fr
Publication of FR2217906A1 publication Critical patent/FR2217906A1/fr
Application granted granted Critical
Publication of FR2217906B3 publication Critical patent/FR2217906B3/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/041—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by using a die for cutting the conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0113—Female die used for patterning or transferring, e.g. temporary substrate having recessed pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
FR7305330A 1973-02-15 1973-02-15 Expired FR2217906B3 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR7305330A FR2217906B3 (de) 1973-02-15 1973-02-15

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7305330A FR2217906B3 (de) 1973-02-15 1973-02-15

Publications (2)

Publication Number Publication Date
FR2217906A1 true FR2217906A1 (de) 1974-09-06
FR2217906B3 FR2217906B3 (de) 1976-02-13

Family

ID=9114874

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7305330A Expired FR2217906B3 (de) 1973-02-15 1973-02-15

Country Status (1)

Country Link
FR (1) FR2217906B3 (de)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2455422A1 (fr) * 1979-04-23 1980-11-21 Castanet Raymond Dispositif pour l'obtention de circuits imprimes
EP0323673A1 (de) * 1987-12-29 1989-07-12 Walker Scientific Europe B.V. Vorrichtung und Verfahren zum Stanzen einer Folie oder von solchem bahnähnlichen Material
EP1737282A1 (de) * 2004-03-31 2006-12-27 Mitsubishi Cable Industries, Ltd. Leiterplatte, herstellungsverfahren dafür und verbindungsbox mit leiterplatte

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2455422A1 (fr) * 1979-04-23 1980-11-21 Castanet Raymond Dispositif pour l'obtention de circuits imprimes
EP0323673A1 (de) * 1987-12-29 1989-07-12 Walker Scientific Europe B.V. Vorrichtung und Verfahren zum Stanzen einer Folie oder von solchem bahnähnlichen Material
WO1989006184A1 (en) * 1987-12-29 1989-07-13 Walker Scientific Europe B.V. Apparatus and method for punching a foil or such sheet-like material
EP1737282A1 (de) * 2004-03-31 2006-12-27 Mitsubishi Cable Industries, Ltd. Leiterplatte, herstellungsverfahren dafür und verbindungsbox mit leiterplatte
EP1737282A4 (de) * 2004-03-31 2010-05-05 Mitsubishi Cable Ind Ltd Leiterplatte, herstellungsverfahren dafür und verbindungsbox mit leiterplatte

Also Published As

Publication number Publication date
FR2217906B3 (de) 1976-02-13

Similar Documents

Publication Publication Date Title
AU476761B2 (de)
AU465372B2 (de)
AU474593B2 (de)
AU474511B2 (de)
AU474838B2 (de)
AU471343B2 (de)
AU465453B2 (de)
AU465434B2 (de)
AU450229B2 (de)
AU476714B2 (de)
AR201229Q (de)
AU476696B2 (de)
AU466283B2 (de)
AU472848B2 (de)
FR2217906A1 (de)
AU477823B2 (de)
AU447540B2 (de)
AU461342B2 (de)
AU471461B2 (de)
AR210729A1 (de)
AU476873B1 (de)
AU477824B2 (de)
AR200256A1 (de)
AU1891376A (de)
BG19046A1 (de)

Legal Events

Date Code Title Description
ST Notification of lapse