FR2217803A1 - - Google Patents
Info
- Publication number
- FR2217803A1 FR2217803A1 FR7404648A FR7404648A FR2217803A1 FR 2217803 A1 FR2217803 A1 FR 2217803A1 FR 7404648 A FR7404648 A FR 7404648A FR 7404648 A FR7404648 A FR 7404648A FR 2217803 A1 FR2217803 A1 FR 2217803A1
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3468—Applying molten solder
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/818—Bonding techniques
- H01L2224/81801—Soldering or alloying
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01019—Potassium [K]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01047—Silver [Ag]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/0105—Tin [Sn]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01074—Tungsten [W]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01075—Rhenium [Re]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/017—Glass ceramic coating, e.g. formed on inorganic substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09727—Varying width along a single conductor; Conductors or pads having different widths
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/0989—Coating free areas, e.g. areas other than pads or lands free of solder resist
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/099—Coating over pads, e.g. solder resist partly over pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10674—Flip chip
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10719—Land grid array [LGA]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/044—Solder dip coating, i.e. coating printed conductors, e.g. pads by dipping in molten solder or by wave soldering
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Wire Bonding (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19732307325 DE2307325C3 (de) | 1973-02-14 | Schichtschaltung mit mindestens einem Lotpodest zum Anlöten von Halbleiterbausteinen |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2217803A1 true FR2217803A1 (fr) | 1974-09-06 |
FR2217803B1 FR2217803B1 (fr) | 1977-09-30 |
Family
ID=5871919
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7404648A Expired FR2217803B1 (fr) | 1973-02-14 | 1974-02-12 |
Country Status (8)
Country | Link |
---|---|
US (1) | US3887760A (fr) |
JP (1) | JPS49113163A (fr) |
BE (1) | BE811023A (fr) |
FR (1) | FR2217803B1 (fr) |
GB (1) | GB1416671A (fr) |
IT (1) | IT1007283B (fr) |
LU (1) | LU69375A1 (fr) |
NL (1) | NL7401644A (fr) |
Families Citing this family (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5429239B2 (fr) * | 1974-12-04 | 1979-09-21 | ||
JPS5185377A (ja) * | 1975-01-24 | 1976-07-26 | Hitachi Ltd | Shusekikairobuhinnoseiho |
JPS5441102B2 (fr) * | 1975-03-04 | 1979-12-06 | ||
JPS5365973A (en) * | 1976-11-25 | 1978-06-12 | Mitsubishi Electric Corp | Method of producing hyb ic |
FR2473834A1 (fr) * | 1980-01-11 | 1981-07-17 | Thomson Csf | Procede de soudure automatique de microcomposants sur un circuit imprime, et circuit imprime equipe ainsi realise |
JPS5724775U (fr) * | 1980-07-17 | 1982-02-08 | ||
US4466184A (en) * | 1981-04-21 | 1984-08-21 | General Dynamics, Pomona Division | Method of making pressure point contact system |
JPS5829640B2 (ja) * | 1981-07-23 | 1983-06-23 | 松下電器産業株式会社 | リ−ド線を有しない回路素子の印刷配線板への取付方法 |
JPS5916174U (ja) * | 1982-07-20 | 1984-01-31 | 三洋電機株式会社 | 電気部品の取付け構造 |
US4610062A (en) * | 1982-12-02 | 1986-09-09 | Honeywell Inc. | Method of making an acoustic microphone |
US4605987A (en) * | 1983-12-22 | 1986-08-12 | Motorola, Inc. | Method of controlling printed circuit board solder fillets and printed circuit boards including solder fillet control patterns |
JPS6153934U (fr) * | 1984-09-11 | 1986-04-11 | ||
JP2575109B2 (ja) * | 1985-11-08 | 1997-01-22 | ソニー株式会社 | プリント配線基板 |
US4836435A (en) * | 1986-05-12 | 1989-06-06 | International Business Machines Corporation | Component self alignment |
US4851966A (en) * | 1986-11-10 | 1989-07-25 | Motorola, Inc. | Method and apparatus of printed circuit board assembly with optimal placement of components |
JPS63302595A (ja) * | 1987-06-02 | 1988-12-09 | Murata Mfg Co Ltd | チップ部品の取付構造 |
US4937934A (en) * | 1989-02-10 | 1990-07-03 | Rockwell International Corporation | Installation of surface mount components on printed wiring boards |
US5056215A (en) * | 1990-12-10 | 1991-10-15 | Delco Electronics Corporation | Method of providing standoff pillars |
US5220200A (en) * | 1990-12-10 | 1993-06-15 | Delco Electronics Corporation | Provision of substrate pillars to maintain chip standoff |
US5352629A (en) * | 1993-01-19 | 1994-10-04 | General Electric Company | Process for self-alignment and planarization of semiconductor chips attached by solder die adhesive to multi-chip modules |
EP0644587B1 (fr) * | 1993-09-01 | 2002-07-24 | Kabushiki Kaisha Toshiba | Procédé de fabrication d'un assemblage de dispositif à semi-conducteur |
US5902686A (en) * | 1996-11-21 | 1999-05-11 | Mcnc | Methods for forming an intermetallic region between a solder bump and an under bump metallurgy layer and related structures |
US6259608B1 (en) * | 1999-04-05 | 2001-07-10 | Delphi Technologies, Inc. | Conductor pattern for surface mount devices and method therefor |
KR20010017187A (ko) * | 1999-08-09 | 2001-03-05 | 윤종용 | 인쇄 회로 기판 및 이 인쇄 회로 기판의 스크린 프린팅을 위한마스크 |
US20060196857A1 (en) * | 2005-03-03 | 2006-09-07 | Samtec, Inc. | Methods of manufacturing electrical contacts having solder stops |
US7172438B2 (en) * | 2005-03-03 | 2007-02-06 | Samtec, Inc. | Electrical contacts having solder stops |
JP2008277340A (ja) * | 2007-04-25 | 2008-11-13 | Denso Corp | 配線金属板 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3495133A (en) * | 1965-06-18 | 1970-02-10 | Ibm | Circuit structure including semiconductive chip devices joined to a substrate by solder contacts |
-
1974
- 1974-01-11 GB GB150374A patent/GB1416671A/en not_active Expired
- 1974-02-04 US US439116A patent/US3887760A/en not_active Expired - Lifetime
- 1974-02-06 NL NL7401644A patent/NL7401644A/xx not_active Application Discontinuation
- 1974-02-08 IT IT20285/74A patent/IT1007283B/it active
- 1974-02-12 LU LU69375A patent/LU69375A1/xx unknown
- 1974-02-12 FR FR7404648A patent/FR2217803B1/fr not_active Expired
- 1974-02-14 BE BE140900A patent/BE811023A/fr unknown
- 1974-02-14 JP JP49018114A patent/JPS49113163A/ja active Pending
Non-Patent Citations (1)
Title |
---|
NEANT * |
Also Published As
Publication number | Publication date |
---|---|
BE811023A (fr) | 1974-05-29 |
US3887760A (en) | 1975-06-03 |
GB1416671A (en) | 1975-12-03 |
LU69375A1 (fr) | 1974-05-29 |
JPS49113163A (fr) | 1974-10-29 |
IT1007283B (it) | 1976-10-30 |
DE2307325B2 (de) | 1975-09-04 |
FR2217803B1 (fr) | 1977-09-30 |
DE2307325A1 (de) | 1974-09-05 |
NL7401644A (fr) | 1974-08-16 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |