FR2198264B1 - - Google Patents
Info
- Publication number
- FR2198264B1 FR2198264B1 FR7331009A FR7331009A FR2198264B1 FR 2198264 B1 FR2198264 B1 FR 2198264B1 FR 7331009 A FR7331009 A FR 7331009A FR 7331009 A FR7331009 A FR 7331009A FR 2198264 B1 FR2198264 B1 FR 2198264B1
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/019—Manufacture or treatment of bond pads
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
- H10W74/43—Encapsulations, e.g. protective coatings characterised by their materials comprising oxides, nitrides or carbides, e.g. ceramics or glasses
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/551—Materials of bond wires
- H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
- H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/59—Bond pads specially adapted therefor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
- H10W72/951—Materials of bond pads
- H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
- H10W72/981—Auxiliary members, e.g. spacers
- H10W72/983—Reinforcing structures, e.g. collars
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE2243011A DE2243011C3 (de) | 1972-09-01 | 1972-09-01 | Verfahren zum Herstellen eines Thermokompressionskontaktes |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR2198264A1 FR2198264A1 (enExample) | 1974-03-29 |
| FR2198264B1 true FR2198264B1 (enExample) | 1978-03-24 |
Family
ID=5855205
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR7331009A Expired FR2198264B1 (enExample) | 1972-09-01 | 1973-08-28 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US3843428A (enExample) |
| JP (1) | JPS4992979A (enExample) |
| AU (1) | AU5964273A (enExample) |
| DE (1) | DE2243011C3 (enExample) |
| FR (1) | FR2198264B1 (enExample) |
| IT (1) | IT995236B (enExample) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4066485A (en) * | 1977-01-21 | 1978-01-03 | Rca Corporation | Method of fabricating a semiconductor device |
| FR2510307A1 (fr) * | 1981-07-24 | 1983-01-28 | Hitachi Ltd | Dispositif a semi-conducteurs et procede de fabrication d'un tel dispositif |
| US4705204A (en) * | 1985-03-01 | 1987-11-10 | Mitsubishi Denki Kabushiki Kaisha | Method of ball forming for wire bonding |
| JP2000133672A (ja) * | 1998-10-28 | 2000-05-12 | Seiko Epson Corp | 半導体装置及びその製造方法、回路基板並びに電子機器 |
-
1972
- 1972-09-01 DE DE2243011A patent/DE2243011C3/de not_active Expired
-
1973
- 1973-07-18 US US00380327A patent/US3843428A/en not_active Expired - Lifetime
- 1973-08-27 AU AU59642/73A patent/AU5964273A/en not_active Expired
- 1973-08-28 IT IT28265/73A patent/IT995236B/it active
- 1973-08-28 FR FR7331009A patent/FR2198264B1/fr not_active Expired
- 1973-08-31 JP JP48097395A patent/JPS4992979A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| DE2243011A1 (de) | 1974-03-07 |
| AU5964273A (en) | 1975-02-27 |
| DE2243011B2 (de) | 1981-06-25 |
| DE2243011C3 (de) | 1982-04-01 |
| JPS4992979A (enExample) | 1974-09-04 |
| US3843428A (en) | 1974-10-22 |
| IT995236B (it) | 1975-11-10 |
| FR2198264A1 (enExample) | 1974-03-29 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| ST | Notification of lapse |