FR2193301A1 - - Google Patents
Info
- Publication number
- FR2193301A1 FR2193301A1 FR7314824A FR7314824A FR2193301A1 FR 2193301 A1 FR2193301 A1 FR 2193301A1 FR 7314824 A FR7314824 A FR 7314824A FR 7314824 A FR7314824 A FR 7314824A FR 2193301 A1 FR2193301 A1 FR 2193301A1
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/063—Lamination of preperforated insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
- H05K2203/308—Sacrificial means, e.g. for temporarily filling a space for making a via or a cavity or for making rigid-flexible PCBs
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Adhesives Or Adhesive Processes (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US27219872A | 1972-07-17 | 1972-07-17 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR2193301A1 true FR2193301A1 (en:Method) | 1974-02-15 |
| FR2193301B1 FR2193301B1 (en:Method) | 1977-02-04 |
Family
ID=23038817
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR7314824A Expired FR2193301B1 (en:Method) | 1972-07-17 | 1973-04-24 |
Country Status (8)
| Country | Link |
|---|---|
| JP (1) | JPS4951561A (en:Method) |
| BE (1) | BE797750A (en:Method) |
| CA (1) | CA990413A (en:Method) |
| DE (1) | DE2333445A1 (en:Method) |
| FR (1) | FR2193301B1 (en:Method) |
| GB (1) | GB1419027A (en:Method) |
| IT (1) | IT991068B (en:Method) |
| NL (1) | NL7304482A (en:Method) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3322772C2 (de) * | 1983-06-24 | 1986-05-22 | Didier-Werke Ag, 6200 Wiesbaden | Verbundfolie zum Auskleiden von Flüssigkeitsbehältern |
| CN208159008U (zh) * | 2015-08-10 | 2018-11-27 | 株式会社村田制作所 | 树脂多层基板 |
| CN107529294A (zh) * | 2017-09-27 | 2017-12-29 | 生益电子股份有限公司 | 一种pcb的制作方法及pcb |
-
1973
- 1973-02-21 CA CA164,219A patent/CA990413A/en not_active Expired
- 1973-03-01 GB GB991173A patent/GB1419027A/en not_active Expired
- 1973-03-30 NL NL7304482A patent/NL7304482A/xx not_active Application Discontinuation
- 1973-04-04 BE BE129623A patent/BE797750A/xx unknown
- 1973-04-24 FR FR7314824A patent/FR2193301B1/fr not_active Expired
- 1973-06-15 JP JP6700473A patent/JPS4951561A/ja active Pending
- 1973-06-30 DE DE19732333445 patent/DE2333445A1/de active Pending
- 1973-07-09 IT IT2636073A patent/IT991068B/it active
Also Published As
| Publication number | Publication date |
|---|---|
| IT991068B (it) | 1975-07-30 |
| GB1419027A (en) | 1975-12-24 |
| NL7304482A (en:Method) | 1974-01-21 |
| JPS4951561A (en:Method) | 1974-05-18 |
| DE2333445A1 (de) | 1974-01-31 |
| FR2193301B1 (en:Method) | 1977-02-04 |
| BE797750A (nl) | 1973-10-04 |
| CA990413A (en) | 1976-06-01 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| ST | Notification of lapse |