FR2188305A1 - - Google Patents
Info
- Publication number
- FR2188305A1 FR2188305A1 FR7320046A FR7320046A FR2188305A1 FR 2188305 A1 FR2188305 A1 FR 2188305A1 FR 7320046 A FR7320046 A FR 7320046A FR 7320046 A FR7320046 A FR 7320046A FR 2188305 A1 FR2188305 A1 FR 2188305A1
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
- H01L23/4334—Auxiliary members in encapsulations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IT2521672A IT960675B (it) | 1972-06-03 | 1972-06-03 | Assemblaggio per produzione di circuiti integrati con conteni tore di resina |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2188305A1 true FR2188305A1 (fr) | 1974-01-18 |
FR2188305B1 FR2188305B1 (fr) | 1976-06-11 |
Family
ID=11216032
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7320046A Expired FR2188305B1 (fr) | 1972-06-03 | 1973-06-01 |
Country Status (3)
Country | Link |
---|---|
DE (1) | DE2328107A1 (fr) |
FR (1) | FR2188305B1 (fr) |
IT (1) | IT960675B (fr) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2503932A1 (fr) * | 1981-04-08 | 1982-10-15 | Thomson Csf | Boitiers a cosses plates pour composants semi-conducteurs de moyenne puissance et procede de fabrication |
EP0095223A2 (fr) * | 1982-05-26 | 1983-11-30 | ASM Fico Tooling B.V. | Cadre de connexion |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2014777A1 (fr) * | 1968-07-30 | 1970-04-17 | Philips Nv | |
FR2015702A1 (fr) * | 1968-08-15 | 1970-04-30 | Texas Instruments Inc | |
FR2083471A1 (fr) * | 1970-03-20 | 1971-12-17 | Amp Inc |
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1972
- 1972-06-03 IT IT2521672A patent/IT960675B/it active
-
1973
- 1973-06-01 FR FR7320046A patent/FR2188305B1/fr not_active Expired
- 1973-06-01 DE DE19732328107 patent/DE2328107A1/de active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2014777A1 (fr) * | 1968-07-30 | 1970-04-17 | Philips Nv | |
FR2015702A1 (fr) * | 1968-08-15 | 1970-04-30 | Texas Instruments Inc | |
FR2083471A1 (fr) * | 1970-03-20 | 1971-12-17 | Amp Inc |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2503932A1 (fr) * | 1981-04-08 | 1982-10-15 | Thomson Csf | Boitiers a cosses plates pour composants semi-conducteurs de moyenne puissance et procede de fabrication |
EP0063070A1 (fr) * | 1981-04-08 | 1982-10-20 | Thomson-Csf | Boîtiers à cosses plates pour composants semiconducteurs de moyenne puissance, et procédé de fabrication |
EP0095223A2 (fr) * | 1982-05-26 | 1983-11-30 | ASM Fico Tooling B.V. | Cadre de connexion |
EP0095223A3 (en) * | 1982-05-26 | 1984-01-04 | Asm-Fico Tooling B.V. | A lead frame |
Also Published As
Publication number | Publication date |
---|---|
IT960675B (it) | 1973-11-30 |
FR2188305B1 (fr) | 1976-06-11 |
DE2328107A1 (de) | 1974-01-17 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |