FR2183037A1 - - Google Patents

Info

Publication number
FR2183037A1
FR2183037A1 FR7315134A FR7315134A FR2183037A1 FR 2183037 A1 FR2183037 A1 FR 2183037A1 FR 7315134 A FR7315134 A FR 7315134A FR 7315134 A FR7315134 A FR 7315134A FR 2183037 A1 FR2183037 A1 FR 2183037A1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7315134A
Other versions
FR2183037B1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
Western Electric Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Western Electric Co Inc filed Critical Western Electric Co Inc
Publication of FR2183037A1 publication Critical patent/FR2183037A1/fr
Application granted granted Critical
Publication of FR2183037B1 publication Critical patent/FR2183037B1/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
    • H01L21/321—After treatment
    • H01L21/3213—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
    • H01L21/32133—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only
    • H01L21/32134—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only by liquid etching only
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F3/00—Electrolytic etching or polishing
    • C25F3/02—Etching
    • C25F3/08—Etching of refractory metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F7/00—Constructional parts, or assemblies thereof, of cells for electrolytic removal of material from objects; Servicing or operating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Weting (AREA)
FR7315134A 1972-05-04 1973-04-26 Expired FR2183037B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US25025872A 1972-05-04 1972-05-04

Publications (2)

Publication Number Publication Date
FR2183037A1 true FR2183037A1 (fr) 1973-12-14
FR2183037B1 FR2183037B1 (fr) 1976-04-09

Family

ID=22946995

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7315134A Expired FR2183037B1 (fr) 1972-05-04 1973-04-26

Country Status (6)

Country Link
US (1) US3785945A (fr)
JP (1) JPS4954240A (fr)
BE (1) BE798985A (fr)
DE (1) DE2321798A1 (fr)
FR (1) FR2183037B1 (fr)
GB (1) GB1425219A (fr)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4098659A (en) * 1977-07-13 1978-07-04 The United States Of America As Represented By The Secretary Of The Air Force Electrochemical milling process to prevent localized heating
JPS5496775A (en) * 1978-01-17 1979-07-31 Hitachi Ltd Method of forming circuit
US4629539A (en) * 1982-07-08 1986-12-16 Tdk Corporation Metal layer patterning method
US5374338A (en) * 1993-10-27 1994-12-20 International Business Machines Corporation Selective electroetch of copper and other metals
US20060021974A1 (en) * 2004-01-29 2006-02-02 Applied Materials, Inc. Method and composition for polishing a substrate
DE102004060507A1 (de) * 2004-12-16 2006-06-29 Forschungszentrum Karlsruhe Gmbh Verfahren zur elektrochemischen Abtragung von Refraktärmetallen oder -legierungen und Lösung zur Durchführung dieses Verfahrens
JP4900351B2 (ja) * 2008-09-19 2012-03-21 住友電気工業株式会社 構造体の製造方法および構造体の製造装置

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
NEANT *

Also Published As

Publication number Publication date
GB1425219A (en) 1976-02-18
US3785945A (en) 1974-01-15
JPS4954240A (fr) 1974-05-27
BE798985A (fr) 1973-08-31
DE2321798A1 (de) 1973-11-15
FR2183037B1 (fr) 1976-04-09

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Legal Events

Date Code Title Description
ST Notification of lapse