FR2183037A1 - - Google Patents
Info
- Publication number
- FR2183037A1 FR2183037A1 FR7315134A FR7315134A FR2183037A1 FR 2183037 A1 FR2183037 A1 FR 2183037A1 FR 7315134 A FR7315134 A FR 7315134A FR 7315134 A FR7315134 A FR 7315134A FR 2183037 A1 FR2183037 A1 FR 2183037A1
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/3213—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
- H01L21/32133—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only
- H01L21/32134—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only by liquid etching only
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- C25F3/00—Electrolytic etching or polishing
- C25F3/02—Etching
- C25F3/08—Etching of refractory metals
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- C25F7/00—Constructional parts, or assemblies thereof, of cells for electrolytic removal of material from objects; Servicing or operating
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Weting (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US25025872A | 1972-05-04 | 1972-05-04 |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2183037A1 true FR2183037A1 (US06633782-20031014-M00005.png) | 1973-12-14 |
FR2183037B1 FR2183037B1 (US06633782-20031014-M00005.png) | 1976-04-09 |
Family
ID=22946995
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7315134A Expired FR2183037B1 (US06633782-20031014-M00005.png) | 1972-05-04 | 1973-04-26 |
Country Status (6)
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4098659A (en) * | 1977-07-13 | 1978-07-04 | The United States Of America As Represented By The Secretary Of The Air Force | Electrochemical milling process to prevent localized heating |
JPS5496775A (en) * | 1978-01-17 | 1979-07-31 | Hitachi Ltd | Method of forming circuit |
US4629539A (en) * | 1982-07-08 | 1986-12-16 | Tdk Corporation | Metal layer patterning method |
US5374338A (en) * | 1993-10-27 | 1994-12-20 | International Business Machines Corporation | Selective electroetch of copper and other metals |
US20060021974A1 (en) * | 2004-01-29 | 2006-02-02 | Applied Materials, Inc. | Method and composition for polishing a substrate |
DE102004060507A1 (de) * | 2004-12-16 | 2006-06-29 | Forschungszentrum Karlsruhe Gmbh | Verfahren zur elektrochemischen Abtragung von Refraktärmetallen oder -legierungen und Lösung zur Durchführung dieses Verfahrens |
JP4900351B2 (ja) * | 2008-09-19 | 2012-03-21 | 住友電気工業株式会社 | 構造体の製造方法および構造体の製造装置 |
-
1972
- 1972-05-04 US US00250258A patent/US3785945A/en not_active Expired - Lifetime
-
1973
- 1973-04-26 FR FR7315134A patent/FR2183037B1/fr not_active Expired
- 1973-04-30 DE DE2321798A patent/DE2321798A1/de active Pending
- 1973-05-01 GB GB2060373A patent/GB1425219A/en not_active Expired
- 1973-05-02 BE BE130647A patent/BE798985A/xx unknown
- 1973-05-02 JP JP48048599A patent/JPS4954240A/ja active Pending
Non-Patent Citations (1)
Title |
---|
NEANT * |
Also Published As
Publication number | Publication date |
---|---|
FR2183037B1 (US06633782-20031014-M00005.png) | 1976-04-09 |
DE2321798A1 (de) | 1973-11-15 |
GB1425219A (en) | 1976-02-18 |
JPS4954240A (US06633782-20031014-M00005.png) | 1974-05-27 |
BE798985A (fr) | 1973-08-31 |
US3785945A (en) | 1974-01-15 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |