FR2176036A1 - - Google Patents
Info
- Publication number
- FR2176036A1 FR2176036A1 FR7309091A FR7309091A FR2176036A1 FR 2176036 A1 FR2176036 A1 FR 2176036A1 FR 7309091 A FR7309091 A FR 7309091A FR 7309091 A FR7309091 A FR 7309091A FR 2176036 A1 FR2176036 A1 FR 2176036A1
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/04—Electroplating with moving electrodes
- C25D5/06—Brush or pad plating
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US23459072A | 1972-03-14 | 1972-03-14 |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2176036A1 true FR2176036A1 (enrdf_load_stackoverflow) | 1973-10-26 |
FR2176036B3 FR2176036B3 (enrdf_load_stackoverflow) | 1976-03-12 |
Family
ID=22882007
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7309091A Expired FR2176036B3 (enrdf_load_stackoverflow) | 1972-03-14 | 1973-03-14 |
Country Status (5)
Country | Link |
---|---|
US (1) | US3779887A (enrdf_load_stackoverflow) |
JP (1) | JPS492728A (enrdf_load_stackoverflow) |
BR (1) | BR7301786D0 (enrdf_load_stackoverflow) |
CA (1) | CA989770A (enrdf_load_stackoverflow) |
FR (1) | FR2176036B3 (enrdf_load_stackoverflow) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0003680A1 (en) * | 1978-02-09 | 1979-08-22 | Weldex A.G. | Method for brush electroplating, electrode and electrolyte therefor |
US6524462B1 (en) | 1998-04-06 | 2003-02-25 | Technology Development Associate Operations Limited | Method of providing conductive tracks on a printed circuit and apparatus for use in carrying out the method |
US6939447B2 (en) | 1998-04-06 | 2005-09-06 | Tdao Limited | Method of providing conductive tracks on a printed circuit and apparatus for use in carrying out the method |
Families Citing this family (37)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1555334A (en) * | 1975-06-13 | 1979-11-07 | Imi Ltd | Electrodeposition cell |
US4406761A (en) * | 1980-05-01 | 1983-09-27 | Kabushiki Kaisha Kobe Seiko Sho | Method of descaling metal sheets |
FI834686A0 (fi) * | 1983-12-20 | 1983-12-20 | Niinivaara Ensi Kyoesti Juhani | Foerfarande foer undervattensrening och -belaeggning |
JPS61219526A (ja) * | 1985-03-25 | 1986-09-29 | Agency Of Ind Science & Technol | 電解砥粒複合研磨装置用電極工具 |
US4609450A (en) * | 1985-03-26 | 1986-09-02 | Agency Of Industrial Science And Technology | Combined electrolytic-abrasive polishing apparatus |
ATE46197T1 (de) * | 1986-04-25 | 1989-09-15 | Poligrat Gmbh | Verfahren und vorrichtung zum elektrochemischen polieren und beizen. |
JP2831713B2 (ja) * | 1988-08-19 | 1998-12-02 | マルイ鍍金工業株式会社 | 電解処理用筆具 |
JPH0322968U (enrdf_load_stackoverflow) * | 1989-07-13 | 1991-03-11 | ||
JPH0575057U (ja) * | 1992-03-13 | 1993-10-12 | 日本精工株式会社 | 衝撃吸収式ステアリングコラム装置 |
US5225059A (en) * | 1992-08-03 | 1993-07-06 | W. R. Associates | Apparatus for single anode brush electroplating |
US5324406A (en) * | 1992-09-10 | 1994-06-28 | Tosoh Smd, Inc. | Automatic brush plating machine |
US5409593A (en) * | 1993-12-03 | 1995-04-25 | Sifco Industries, Inc. | Method and apparatus for selective electroplating using soluble anodes |
US5772012A (en) * | 1996-05-08 | 1998-06-30 | Corpex Technologies, Inc. | Flexible decontamination apparatus |
US5776330A (en) * | 1996-05-08 | 1998-07-07 | Corpex Technologies, Inc. | Electrolytic decontamination methods and apparatus |
US6176992B1 (en) * | 1998-11-03 | 2001-01-23 | Nutool, Inc. | Method and apparatus for electro-chemical mechanical deposition |
US6413388B1 (en) * | 2000-02-23 | 2002-07-02 | Nutool Inc. | Pad designs and structures for a versatile materials processing apparatus |
US7425250B2 (en) | 1998-12-01 | 2008-09-16 | Novellus Systems, Inc. | Electrochemical mechanical processing apparatus |
US7427337B2 (en) * | 1998-12-01 | 2008-09-23 | Novellus Systems, Inc. | System for electropolishing and electrochemical mechanical polishing |
US6902659B2 (en) * | 1998-12-01 | 2005-06-07 | Asm Nutool, Inc. | Method and apparatus for electro-chemical mechanical deposition |
US6673216B2 (en) * | 1999-08-31 | 2004-01-06 | Semitool, Inc. | Apparatus for providing electrical and fluid communication to a rotating microelectronic workpiece during electrochemical processing |
IT1311147B1 (it) * | 1999-11-04 | 2002-03-04 | Edk Res Ag | Macchina per pulizia localizzata con cella, elettrolitica e/o adultrasuoni, di decapaggio e/o lucidatura |
US6478936B1 (en) * | 2000-05-11 | 2002-11-12 | Nutool Inc. | Anode assembly for plating and planarizing a conductive layer |
US7754061B2 (en) | 2000-08-10 | 2010-07-13 | Novellus Systems, Inc. | Method for controlling conductor deposition on predetermined portions of a wafer |
US6921551B2 (en) | 2000-08-10 | 2005-07-26 | Asm Nutool, Inc. | Plating method and apparatus for controlling deposition on predetermined portions of a workpiece |
US20040170753A1 (en) * | 2000-12-18 | 2004-09-02 | Basol Bulent M. | Electrochemical mechanical processing using low temperature process environment |
US7172497B2 (en) * | 2001-01-05 | 2007-02-06 | Asm Nutool, Inc. | Fabrication of semiconductor interconnect structures |
US6572755B2 (en) * | 2001-04-11 | 2003-06-03 | Speedfam-Ipec Corporation | Method and apparatus for electrochemically depositing a material onto a workpiece surface |
US7238092B2 (en) * | 2001-09-28 | 2007-07-03 | Novellus Systems, Inc. | Low-force electrochemical mechanical processing method and apparatus |
US20050040049A1 (en) * | 2002-09-20 | 2005-02-24 | Rimma Volodarsky | Anode assembly for plating and planarizing a conductive layer |
US7648622B2 (en) | 2004-02-27 | 2010-01-19 | Novellus Systems, Inc. | System and method for electrochemical mechanical polishing |
JP4628931B2 (ja) * | 2005-11-04 | 2011-02-09 | 日東工器株式会社 | 雄雌部材アセンブリ |
US8500985B2 (en) | 2006-07-21 | 2013-08-06 | Novellus Systems, Inc. | Photoresist-free metal deposition |
US8197307B1 (en) * | 2009-03-19 | 2012-06-12 | Kenneth Luna | Surface polishing system |
US9249521B2 (en) | 2011-11-04 | 2016-02-02 | Integran Technologies Inc. | Flow-through consumable anodes |
AU355903S (en) * | 2014-05-12 | 2014-06-13 | Electrolytic brush | |
AU355902S (en) * | 2014-05-12 | 2014-06-13 | Electrolytic brush | |
US20240375200A1 (en) * | 2021-09-17 | 2024-11-14 | Ensitech Ip Pty Ltd | Electrochemical treatment device |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL68330C (enrdf_load_stackoverflow) * | 1950-11-03 | |||
GB760016A (en) * | 1953-09-11 | 1956-10-31 | Glacier Co Ltd | Improvements in or relating to electroplating |
FR1483598A (enrdf_load_stackoverflow) * | 1965-07-12 | 1967-09-06 |
-
1972
- 1972-03-14 US US00234590A patent/US3779887A/en not_active Expired - Lifetime
- 1972-07-18 JP JP47071335A patent/JPS492728A/ja active Pending
-
1973
- 1973-02-21 CA CA164,236A patent/CA989770A/en not_active Expired
- 1973-03-13 BR BR178673A patent/BR7301786D0/pt unknown
- 1973-03-14 FR FR7309091A patent/FR2176036B3/fr not_active Expired
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0003680A1 (en) * | 1978-02-09 | 1979-08-22 | Weldex A.G. | Method for brush electroplating, electrode and electrolyte therefor |
WO1979000608A1 (en) * | 1978-02-09 | 1979-08-23 | Kemwell Ltd | Electrotreating a metal surface |
US6524462B1 (en) | 1998-04-06 | 2003-02-25 | Technology Development Associate Operations Limited | Method of providing conductive tracks on a printed circuit and apparatus for use in carrying out the method |
US6939447B2 (en) | 1998-04-06 | 2005-09-06 | Tdao Limited | Method of providing conductive tracks on a printed circuit and apparatus for use in carrying out the method |
US6949171B2 (en) | 1998-04-06 | 2005-09-27 | Tdao Limited | Method of providing conductive tracks on a printed circuit and apparatus for use in carrying out the method |
Also Published As
Publication number | Publication date |
---|---|
CA989770A (en) | 1976-05-25 |
JPS492728A (enrdf_load_stackoverflow) | 1974-01-11 |
FR2176036B3 (enrdf_load_stackoverflow) | 1976-03-12 |
BR7301786D0 (pt) | 1975-09-02 |
US3779887A (en) | 1973-12-18 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |