FR2168023B1 - - Google Patents
Info
- Publication number
- FR2168023B1 FR2168023B1 FR7301057A FR7301057A FR2168023B1 FR 2168023 B1 FR2168023 B1 FR 2168023B1 FR 7301057 A FR7301057 A FR 7301057A FR 7301057 A FR7301057 A FR 7301057A FR 2168023 B1 FR2168023 B1 FR 2168023B1
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/4985—Flexible insulating substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
- H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
- H01R12/58—Fixed connections for rigid printed circuits or like structures characterised by the terminals terminals for insertion into holes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/818—Bonding techniques
- H01L2224/81801—Soldering or alloying
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01013—Aluminum [Al]
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- H—ELECTRICITY
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01015—Phosphorus [P]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01019—Potassium [K]
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- H01—ELECTRIC ELEMENTS
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01023—Vanadium [V]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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- H01L2924/01029—Copper [Cu]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01039—Yttrium [Y]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01042—Molybdenum [Mo]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01047—Silver [Ag]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/0105—Tin [Sn]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01057—Lanthanum [La]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01067—Holmium [Ho]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01074—Tungsten [W]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01075—Rhenium [Re]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01076—Osmium [Os]
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1301—Thyristor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19043—Component type being a resistor
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Installation Of Indoor Wiring (AREA)
- Wire Bonding (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB139072A GB1403371A (en) | 1972-01-12 | 1972-01-12 | Semiconductor device arrangements |
GB2102972 | 1972-05-05 |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2168023A1 FR2168023A1 (fr) | 1973-08-24 |
FR2168023B1 true FR2168023B1 (fr) | 1976-05-14 |
Family
ID=26236698
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7301057A Expired FR2168023B1 (fr) | 1972-01-12 | 1973-01-12 |
Country Status (8)
Country | Link |
---|---|
US (1) | US3875478A (fr) |
JP (1) | JPS4882777A (fr) |
CA (1) | CA966589A (fr) |
DE (1) | DE2301214A1 (fr) |
FR (1) | FR2168023B1 (fr) |
GB (1) | GB1403371A (fr) |
IT (1) | IT977585B (fr) |
NL (1) | NL7300216A (fr) |
Families Citing this family (33)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4015328A (en) * | 1975-06-02 | 1977-04-05 | Mcdonough Cletus G | Multilayered circuit assembly including an eyelet for making weldable connections and a method of making said assembly |
US4038678A (en) * | 1976-10-04 | 1977-07-26 | Texas Instruments Incorporated | Power transistor and thyristor adapter |
US4295183A (en) * | 1979-06-29 | 1981-10-13 | International Business Machines Corporation | Thin film metal package for LSI chips |
US4254446A (en) * | 1979-08-30 | 1981-03-03 | Peoples Ric L | Modular, hybrid integrated circuit assembly |
US4544989A (en) * | 1980-06-30 | 1985-10-01 | Sharp Kabushiki Kaisha | Thin assembly for wiring substrate |
US4814631A (en) * | 1980-08-06 | 1989-03-21 | Jackson Terry R | Electrical power supply having a variable output |
US4413308A (en) * | 1981-08-31 | 1983-11-01 | Bell Telephone Laboratories, Incorporated | Printed wiring board construction |
US4439815A (en) * | 1982-02-01 | 1984-03-27 | International Telephone And Telegraph Corporation | Printed circuit assembly for a card file packaging system |
US5014159A (en) * | 1982-04-19 | 1991-05-07 | Olin Corporation | Semiconductor package |
US4570337A (en) * | 1982-04-19 | 1986-02-18 | Olin Corporation | Method of assembling a chip carrier |
US4851615A (en) * | 1982-04-19 | 1989-07-25 | Olin Corporation | Printed circuit board |
US4866571A (en) * | 1982-06-21 | 1989-09-12 | Olin Corporation | Semiconductor package |
US4682414A (en) * | 1982-08-30 | 1987-07-28 | Olin Corporation | Multi-layer circuitry |
US4827377A (en) * | 1982-08-30 | 1989-05-02 | Olin Corporation | Multi-layer circuitry |
US4677528A (en) * | 1984-05-31 | 1987-06-30 | Motorola, Inc. | Flexible printed circuit board having integrated circuit die or the like affixed thereto |
DE3426278C2 (de) * | 1984-07-17 | 1987-02-26 | Schroff Gmbh, 7541 Straubenhardt | Leiterplatte |
US4853491A (en) * | 1984-10-03 | 1989-08-01 | Olin Corporation | Chip carrier |
US4783697A (en) * | 1985-01-07 | 1988-11-08 | Motorola, Inc. | Leadless chip carrier for RF power transistors or the like |
IT1203535B (it) * | 1986-02-10 | 1989-02-15 | Marelli Autronica | Procedimento per la realizzazione del collegamento meccanico ed elettrico fra due corpi in particolare tra la membrana ed il sopporto di un sensore di pressione a film spesso e dispositivi realizzati con tale procedimento |
US4779164A (en) * | 1986-12-12 | 1988-10-18 | Menzies Jr L William | Surface mounted decoupling capacitor |
US5659153A (en) * | 1995-03-03 | 1997-08-19 | International Business Machines Corporation | Thermoformed three dimensional wiring module |
US5982635A (en) * | 1996-10-23 | 1999-11-09 | Concept Manufacturing, Incorporated | Signal adaptor board for a pin grid array |
US6351034B1 (en) | 1998-06-01 | 2002-02-26 | Micron Technology, Inc. | Clip chip carrier |
US6184469B1 (en) * | 1998-06-25 | 2001-02-06 | Mario W. Conti | Two joined insulated ribbon conductors |
US6301124B1 (en) | 1999-02-04 | 2001-10-09 | Dell Usa, L.P. | Computer chassis identification method |
DE10329102A1 (de) * | 2003-06-27 | 2005-01-27 | eupec Europäische Gesellschaft für Leistungshalbleiter mbH | Halbleitermodul |
DE102005005897B3 (de) * | 2005-02-09 | 2006-05-18 | Siemens Ag | Schaltungsmodul |
JP2006331989A (ja) * | 2005-05-30 | 2006-12-07 | Toshiba Corp | フレキシブルフラットケーブル、プリント回路配線基板、及び電子機器 |
JP4828884B2 (ja) * | 2005-07-26 | 2011-11-30 | 株式会社東芝 | プリント回路配線基板、及び電子機器 |
US7536906B2 (en) * | 2006-06-19 | 2009-05-26 | John C. Burke | Tell-tale for boat sail |
DE202007002940U1 (de) * | 2007-02-28 | 2007-04-26 | Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH | Elektronisches Bauteil und elektrischer Schaltungsträger |
US9376057B2 (en) * | 2014-02-27 | 2016-06-28 | Nissan North America, Inc. | Lighting structure |
JP6443632B2 (ja) * | 2015-12-16 | 2018-12-26 | 株式会社オートネットワーク技術研究所 | 回路構成体、及び電気接続箱 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1180067C2 (de) * | 1961-03-17 | 1970-03-12 | Elektronik M B H | Verfahren zum gleichzeitigen Kontaktieren mehrerer Halbleiteranordnungen |
US3325704A (en) * | 1964-07-31 | 1967-06-13 | Texas Instruments Inc | High frequency coaxial transistor package |
US3323022A (en) * | 1965-08-23 | 1967-05-30 | Motorola Inc | Package for discrete and integrated circuit components |
US3390308A (en) * | 1966-03-31 | 1968-06-25 | Itt | Multiple chip integrated circuit assembly |
US3474297A (en) * | 1967-06-30 | 1969-10-21 | Texas Instruments Inc | Interconnection system for complex semiconductor arrays |
US3662230A (en) * | 1968-06-25 | 1972-05-09 | Texas Instruments Inc | A semiconductor interconnecting system using conductive patterns bonded to thin flexible insulating films |
US3483308A (en) * | 1968-10-24 | 1969-12-09 | Texas Instruments Inc | Modular packages for semiconductor devices |
DE2124887C3 (de) * | 1971-05-19 | 1980-04-17 | Philips Patentverwaltung Gmbh, 2000 Hamburg | Elektrisches Bauelement, vorzugsweise Halbleiterbauelement, mit Folienkontaktierung |
-
1972
- 1972-01-12 GB GB139072A patent/GB1403371A/en not_active Expired
-
1973
- 1973-01-08 NL NL7300216A patent/NL7300216A/xx unknown
- 1973-01-09 IT IT6702873A patent/IT977585B/it active
- 1973-01-10 CA CA160,971A patent/CA966589A/en not_active Expired
- 1973-01-11 JP JP556973A patent/JPS4882777A/ja active Pending
- 1973-01-11 DE DE2301214A patent/DE2301214A1/de active Pending
- 1973-01-12 US US32320473 patent/US3875478A/en not_active Expired - Lifetime
- 1973-01-12 FR FR7301057A patent/FR2168023B1/fr not_active Expired
Also Published As
Publication number | Publication date |
---|---|
NL7300216A (fr) | 1973-07-16 |
JPS4882777A (fr) | 1973-11-05 |
CA966589A (en) | 1975-04-22 |
DE2301214A1 (de) | 1973-08-02 |
FR2168023A1 (fr) | 1973-08-24 |
US3875478A (en) | 1975-04-01 |
IT977585B (it) | 1974-09-20 |
GB1403371A (en) | 1975-08-28 |
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Date | Code | Title | Description |
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ST | Notification of lapse |