FR2168023A1 - - Google Patents

Info

Publication number
FR2168023A1
FR2168023A1 FR7301057A FR7301057A FR2168023A1 FR 2168023 A1 FR2168023 A1 FR 2168023A1 FR 7301057 A FR7301057 A FR 7301057A FR 7301057 A FR7301057 A FR 7301057A FR 2168023 A1 FR2168023 A1 FR 2168023A1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7301057A
Other languages
French (fr)
Other versions
FR2168023B1 (US20080293856A1-20081127-C00127.png
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Gloeilampenfabrieken NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Gloeilampenfabrieken NV filed Critical Philips Gloeilampenfabrieken NV
Publication of FR2168023A1 publication Critical patent/FR2168023A1/fr
Application granted granted Critical
Publication of FR2168023B1 publication Critical patent/FR2168023B1/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/4985—Flexible insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/58—Fixed connections for rigid printed circuits or like structures characterised by the terminals terminals for insertion into holes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/818—Bonding techniques
    • H01L2224/81801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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    • H01L2924/01015—Phosphorus [P]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01023—Vanadium [V]
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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
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    • H01—ELECTRIC ELEMENTS
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    • H01L2924/01033—Arsenic [As]
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    • H01L2924/01039—Yttrium [Y]
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    • H01L2924/01—Chemical elements
    • H01L2924/01042—Molybdenum [Mo]
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0105—Tin [Sn]
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    • H01—ELECTRIC ELEMENTS
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01057—Lanthanum [La]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01067—Holmium [Ho]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01075—Rhenium [Re]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01076—Osmium [Os]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1301—Thyristor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19043—Component type being a resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Wire Bonding (AREA)
  • Installation Of Indoor Wiring (AREA)
FR7301057A 1972-01-12 1973-01-12 Expired FR2168023B1 (US20080293856A1-20081127-C00127.png)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB139072A GB1403371A (en) 1972-01-12 1972-01-12 Semiconductor device arrangements
GB2102972 1972-05-05

Publications (2)

Publication Number Publication Date
FR2168023A1 true FR2168023A1 (US20080293856A1-20081127-C00127.png) 1973-08-24
FR2168023B1 FR2168023B1 (US20080293856A1-20081127-C00127.png) 1976-05-14

Family

ID=26236698

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7301057A Expired FR2168023B1 (US20080293856A1-20081127-C00127.png) 1972-01-12 1973-01-12

Country Status (8)

Country Link
US (1) US3875478A (US20080293856A1-20081127-C00127.png)
JP (1) JPS4882777A (US20080293856A1-20081127-C00127.png)
CA (1) CA966589A (US20080293856A1-20081127-C00127.png)
DE (1) DE2301214A1 (US20080293856A1-20081127-C00127.png)
FR (1) FR2168023B1 (US20080293856A1-20081127-C00127.png)
GB (1) GB1403371A (US20080293856A1-20081127-C00127.png)
IT (1) IT977585B (US20080293856A1-20081127-C00127.png)
NL (1) NL7300216A (US20080293856A1-20081127-C00127.png)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2624666A1 (de) * 1975-06-02 1976-12-23 Molex Inc Mehrlagige schaltkreisanordnung und verfahren zur herstellung derselben

Families Citing this family (32)

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US4038678A (en) * 1976-10-04 1977-07-26 Texas Instruments Incorporated Power transistor and thyristor adapter
US4295183A (en) * 1979-06-29 1981-10-13 International Business Machines Corporation Thin film metal package for LSI chips
US4254446A (en) * 1979-08-30 1981-03-03 Peoples Ric L Modular, hybrid integrated circuit assembly
US4544989A (en) * 1980-06-30 1985-10-01 Sharp Kabushiki Kaisha Thin assembly for wiring substrate
DE3173301D1 (en) * 1980-08-06 1986-02-06 Terry Roy Jackson Electrical power supply having a variable output
US4413308A (en) * 1981-08-31 1983-11-01 Bell Telephone Laboratories, Incorporated Printed wiring board construction
US4439815A (en) * 1982-02-01 1984-03-27 International Telephone And Telegraph Corporation Printed circuit assembly for a card file packaging system
US4570337A (en) * 1982-04-19 1986-02-18 Olin Corporation Method of assembling a chip carrier
US4851615A (en) * 1982-04-19 1989-07-25 Olin Corporation Printed circuit board
US4866571A (en) * 1982-06-21 1989-09-12 Olin Corporation Semiconductor package
US5014159A (en) * 1982-04-19 1991-05-07 Olin Corporation Semiconductor package
US4827377A (en) * 1982-08-30 1989-05-02 Olin Corporation Multi-layer circuitry
US4682414A (en) * 1982-08-30 1987-07-28 Olin Corporation Multi-layer circuitry
US4677528A (en) * 1984-05-31 1987-06-30 Motorola, Inc. Flexible printed circuit board having integrated circuit die or the like affixed thereto
DE3426278A1 (de) * 1984-07-17 1986-01-30 Schroff Gmbh, 7541 Straubenhardt Leiterplatte
US4853491A (en) * 1984-10-03 1989-08-01 Olin Corporation Chip carrier
US4783697A (en) * 1985-01-07 1988-11-08 Motorola, Inc. Leadless chip carrier for RF power transistors or the like
IT1203535B (it) * 1986-02-10 1989-02-15 Marelli Autronica Procedimento per la realizzazione del collegamento meccanico ed elettrico fra due corpi in particolare tra la membrana ed il sopporto di un sensore di pressione a film spesso e dispositivi realizzati con tale procedimento
US4779164A (en) * 1986-12-12 1988-10-18 Menzies Jr L William Surface mounted decoupling capacitor
US5659153A (en) * 1995-03-03 1997-08-19 International Business Machines Corporation Thermoformed three dimensional wiring module
US5982635A (en) * 1996-10-23 1999-11-09 Concept Manufacturing, Incorporated Signal adaptor board for a pin grid array
US6351034B1 (en) 1998-06-01 2002-02-26 Micron Technology, Inc. Clip chip carrier
US6184469B1 (en) * 1998-06-25 2001-02-06 Mario W. Conti Two joined insulated ribbon conductors
US6301124B1 (en) 1999-02-04 2001-10-09 Dell Usa, L.P. Computer chassis identification method
DE10329102A1 (de) * 2003-06-27 2005-01-27 eupec Europäische Gesellschaft für Leistungshalbleiter mbH Halbleitermodul
DE102005005897B3 (de) * 2005-02-09 2006-05-18 Siemens Ag Schaltungsmodul
JP2006331989A (ja) * 2005-05-30 2006-12-07 Toshiba Corp フレキシブルフラットケーブル、プリント回路配線基板、及び電子機器
JP4828884B2 (ja) * 2005-07-26 2011-11-30 株式会社東芝 プリント回路配線基板、及び電子機器
US7536906B2 (en) * 2006-06-19 2009-05-26 John C. Burke Tell-tale for boat sail
DE202007002940U1 (de) * 2007-02-28 2007-04-26 Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH Elektronisches Bauteil und elektrischer Schaltungsträger
US9376057B2 (en) * 2014-02-27 2016-06-28 Nissan North America, Inc. Lighting structure
JP6443632B2 (ja) * 2015-12-16 2018-12-26 株式会社オートネットワーク技術研究所 回路構成体、及び電気接続箱

Citations (4)

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Publication number Priority date Publication date Assignee Title
US3200468A (en) * 1961-03-17 1965-08-17 Clevite Corp Method and means for contacting and mounting semiconductor devices
FR1571222A (US20080293856A1-20081127-C00127.png) * 1967-06-30 1969-06-13
US3483308A (en) * 1968-10-24 1969-12-09 Texas Instruments Inc Modular packages for semiconductor devices
FR2137934A1 (US20080293856A1-20081127-C00127.png) * 1971-05-19 1972-12-29 Philips Nv

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US3325704A (en) * 1964-07-31 1967-06-13 Texas Instruments Inc High frequency coaxial transistor package
US3323022A (en) * 1965-08-23 1967-05-30 Motorola Inc Package for discrete and integrated circuit components
US3390308A (en) * 1966-03-31 1968-06-25 Itt Multiple chip integrated circuit assembly
US3662230A (en) * 1968-06-25 1972-05-09 Texas Instruments Inc A semiconductor interconnecting system using conductive patterns bonded to thin flexible insulating films

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3200468A (en) * 1961-03-17 1965-08-17 Clevite Corp Method and means for contacting and mounting semiconductor devices
FR1571222A (US20080293856A1-20081127-C00127.png) * 1967-06-30 1969-06-13
US3483308A (en) * 1968-10-24 1969-12-09 Texas Instruments Inc Modular packages for semiconductor devices
FR2137934A1 (US20080293856A1-20081127-C00127.png) * 1971-05-19 1972-12-29 Philips Nv

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
REVUE US "ELECTRONICS" VOL. 40, NO. 15, 24 JUILLET 1967, "IC RIBBONS" PAGES 36-38 *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2624666A1 (de) * 1975-06-02 1976-12-23 Molex Inc Mehrlagige schaltkreisanordnung und verfahren zur herstellung derselben

Also Published As

Publication number Publication date
US3875478A (en) 1975-04-01
GB1403371A (en) 1975-08-28
JPS4882777A (US20080293856A1-20081127-C00127.png) 1973-11-05
DE2301214A1 (de) 1973-08-02
FR2168023B1 (US20080293856A1-20081127-C00127.png) 1976-05-14
NL7300216A (US20080293856A1-20081127-C00127.png) 1973-07-16
CA966589A (en) 1975-04-22
IT977585B (it) 1974-09-20

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