FR2167327A1 - Copper - etching persulphate soln - stabilised with organic cpds - Google Patents

Copper - etching persulphate soln - stabilised with organic cpds

Info

Publication number
FR2167327A1
FR2167327A1 FR7201049A FR7201049A FR2167327A1 FR 2167327 A1 FR2167327 A1 FR 2167327A1 FR 7201049 A FR7201049 A FR 7201049A FR 7201049 A FR7201049 A FR 7201049A FR 2167327 A1 FR2167327 A1 FR 2167327A1
Authority
FR
France
Prior art keywords
persulphate
soln
etching
stabilised
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7201049A
Other languages
English (en)
French (fr)
Other versions
FR2167327B3 (enrdf_load_stackoverflow
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Gas Chemical Co Inc
Original Assignee
Mitsubishi Gas Chemical Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Gas Chemical Co Inc filed Critical Mitsubishi Gas Chemical Co Inc
Priority to FR7201049A priority Critical patent/FR2167327A1/fr
Publication of FR2167327A1 publication Critical patent/FR2167327A1/fr
Application granted granted Critical
Publication of FR2167327B3 publication Critical patent/FR2167327B3/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/067—Etchants
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/32—Alkaline compositions
    • C23F1/34—Alkaline compositions for etching copper or alloys thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • ing And Chemical Polishing (AREA)
FR7201049A 1972-01-13 1972-01-13 Copper - etching persulphate soln - stabilised with organic cpds Granted FR2167327A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR7201049A FR2167327A1 (en) 1972-01-13 1972-01-13 Copper - etching persulphate soln - stabilised with organic cpds

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7201049A FR2167327A1 (en) 1972-01-13 1972-01-13 Copper - etching persulphate soln - stabilised with organic cpds

Publications (2)

Publication Number Publication Date
FR2167327A1 true FR2167327A1 (en) 1973-08-24
FR2167327B3 FR2167327B3 (enrdf_load_stackoverflow) 1974-12-20

Family

ID=9091827

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7201049A Granted FR2167327A1 (en) 1972-01-13 1972-01-13 Copper - etching persulphate soln - stabilised with organic cpds

Country Status (1)

Country Link
FR (1) FR2167327A1 (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6294071B1 (en) 2000-01-07 2001-09-25 Huntsman Petrochemical Corporation Methods of forming copper solutions

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6294071B1 (en) 2000-01-07 2001-09-25 Huntsman Petrochemical Corporation Methods of forming copper solutions

Also Published As

Publication number Publication date
FR2167327B3 (enrdf_load_stackoverflow) 1974-12-20

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Legal Events

Date Code Title Description
ST Notification of lapse