FR2158043B1 - - Google Patents

Info

Publication number
FR2158043B1
FR2158043B1 FR7238316A FR7238316A FR2158043B1 FR 2158043 B1 FR2158043 B1 FR 2158043B1 FR 7238316 A FR7238316 A FR 7238316A FR 7238316 A FR7238316 A FR 7238316A FR 2158043 B1 FR2158043 B1 FR 2158043B1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR7238316A
Other languages
French (fr)
Other versions
FR2158043A1 (index.php
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Publication of FR2158043A1 publication Critical patent/FR2158043A1/fr
Application granted granted Critical
Publication of FR2158043B1 publication Critical patent/FR2158043B1/fr
Expired legal-status Critical Current

Links

Classifications

    • H10W76/153—
    • H10W76/157—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]
    • H10W72/075—
    • H10W90/754—
FR7238316A 1971-10-30 1972-10-27 Expired FR2158043B1 (index.php)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP46085966A JPS5116258B2 (index.php) 1971-10-30 1971-10-30

Publications (2)

Publication Number Publication Date
FR2158043A1 FR2158043A1 (index.php) 1973-06-08
FR2158043B1 true FR2158043B1 (index.php) 1978-08-04

Family

ID=13873462

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7238316A Expired FR2158043B1 (index.php) 1971-10-30 1972-10-27

Country Status (4)

Country Link
JP (1) JPS5116258B2 (index.php)
CA (1) CA981800A (index.php)
DE (1) DE2252830C2 (index.php)
FR (1) FR2158043B1 (index.php)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5615059U (index.php) * 1979-07-11 1981-02-09
US4320438A (en) * 1980-05-15 1982-03-16 Cts Corporation Multi-layer ceramic package
FR2506075A1 (fr) * 1981-05-18 1982-11-19 Radiotechnique Compelec Procede d'assemblage d'un dispositif semi-conducteur et de son boitier de protection

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1305115A (fr) * 1960-11-10 1962-09-28 Rca Corp Microélément de circuit électronique et ses modes de réalisation
US3340602A (en) * 1965-02-01 1967-09-12 Philco Ford Corp Process for sealing
FR1543300A (fr) * 1967-08-11 1968-10-25 Radiotechnique Coprim Rtc Boîtier pour dispositif semi-conducteur à forte dissipation calorifique
FR1553893A (index.php) * 1967-11-28 1969-01-17
JPS4322387Y1 (index.php) * 1968-02-22 1968-09-19

Also Published As

Publication number Publication date
DE2252830A1 (de) 1973-05-30
DE2252830C2 (de) 1983-05-26
JPS5116258B2 (index.php) 1976-05-22
JPS4852178A (index.php) 1973-07-21
FR2158043A1 (index.php) 1973-06-08
CA981800A (en) 1976-01-13

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