FR2139862A1 - - Google Patents

Info

Publication number
FR2139862A1
FR2139862A1 FR7216117A FR7216117A FR2139862A1 FR 2139862 A1 FR2139862 A1 FR 2139862A1 FR 7216117 A FR7216117 A FR 7216117A FR 7216117 A FR7216117 A FR 7216117A FR 2139862 A1 FR2139862 A1 FR 2139862A1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7216117A
Other languages
French (fr)
Other versions
FR2139862B1 (enEXAMPLES
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Corp
Original Assignee
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Corp filed Critical Siemens Corp
Publication of FR2139862A1 publication Critical patent/FR2139862A1/fr
Application granted granted Critical
Publication of FR2139862B1 publication Critical patent/FR2139862B1/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body (electrodes)
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    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
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    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
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    • H01L2224/29101—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of less than 400°C
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    • H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y10S148/00—Metal treatment
    • Y10S148/02—Contacts, special

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Die Bonding (AREA)
  • Thyristors (AREA)
  • Electrodes Of Semiconductors (AREA)
FR7216117A 1971-05-06 1972-05-05 Expired FR2139862B1 (enEXAMPLES)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19712122487 DE2122487A1 (de) 1971-05-06 1971-05-06 Halbleiterbauelement mit Aluminiumkontakt
US24912672A 1972-05-01 1972-05-01
US40170573 US3877061A (en) 1971-05-06 1973-09-28 Semiconductor component with mixed aluminum silver electrode

Publications (2)

Publication Number Publication Date
FR2139862A1 true FR2139862A1 (enEXAMPLES) 1973-01-12
FR2139862B1 FR2139862B1 (enEXAMPLES) 1980-03-14

Family

ID=27183408

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7216117A Expired FR2139862B1 (enEXAMPLES) 1971-05-06 1972-05-05

Country Status (6)

Country Link
US (1) US3877061A (enEXAMPLES)
CH (1) CH537095A (enEXAMPLES)
DE (1) DE2122487A1 (enEXAMPLES)
FR (1) FR2139862B1 (enEXAMPLES)
GB (1) GB1378218A (enEXAMPLES)
NL (1) NL7206120A (enEXAMPLES)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3136730A1 (de) * 1981-09-16 1983-03-31 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Halbleiterdiode
US4953003A (en) * 1987-05-21 1990-08-28 Siemens Aktiengesellschaft Power semiconductor device
EP2528092A1 (en) * 2011-05-27 2012-11-28 ABB Research Ltd. Semiconductor device
EP2673803B1 (en) 2011-02-08 2021-04-14 ABB Power Grids Switzerland AG Power semiconductor module and method to produce a power semiconductor module
EP3306663A1 (en) * 2016-10-05 2018-04-11 ABB Schweiz AG Sic-on-si-based semiconductor module with short circuit failure mode

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3492546A (en) * 1964-07-27 1970-01-27 Raytheon Co Contact for semiconductor device
US3716765A (en) * 1966-03-14 1973-02-13 Hughes Aircraft Co Semiconductor device with protective glass sealing
DE1614928A1 (de) * 1966-07-19 1970-12-23 Solitron Devices Verfahren zur Kontaktierung von Halbleiter-Bauelementen
US3513361A (en) * 1968-05-09 1970-05-19 Westinghouse Electric Corp Flat package electrical device
US3639811A (en) * 1970-11-19 1972-02-01 Fairchild Camera Instr Co Semiconductor with bonded electrical contact

Also Published As

Publication number Publication date
FR2139862B1 (enEXAMPLES) 1980-03-14
NL7206120A (enEXAMPLES) 1972-11-08
US3877061A (en) 1975-04-08
DE2122487A1 (de) 1972-11-16
CH537095A (de) 1973-06-29
GB1378218A (en) 1974-12-27

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