FR2137001A1 - - Google Patents

Info

Publication number
FR2137001A1
FR2137001A1 FR7116971A FR7116971A FR2137001A1 FR 2137001 A1 FR2137001 A1 FR 2137001A1 FR 7116971 A FR7116971 A FR 7116971A FR 7116971 A FR7116971 A FR 7116971A FR 2137001 A1 FR2137001 A1 FR 2137001A1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
FR7116971A
Other languages
French (fr)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thales SA
Original Assignee
Thomson CSF SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thomson CSF SA filed Critical Thomson CSF SA
Priority to FR7116971A priority Critical patent/FR2137001A1/fr
Publication of FR2137001A1 publication Critical patent/FR2137001A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]

Landscapes

  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
FR7116971A 1971-05-11 1971-05-11 Withdrawn FR2137001A1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR7116971A FR2137001A1 (de) 1971-05-11 1971-05-11

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7116971A FR2137001A1 (de) 1971-05-11 1971-05-11

Publications (1)

Publication Number Publication Date
FR2137001A1 true FR2137001A1 (de) 1972-12-29

Family

ID=9076821

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7116971A Withdrawn FR2137001A1 (de) 1971-05-11 1971-05-11

Country Status (1)

Country Link
FR (1) FR2137001A1 (de)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2524247A1 (fr) * 1982-03-23 1983-09-30 Thomson Csf Procede de fabrication de circuits imprimes avec support metallique rigide conducteur individuel
FR2571921A1 (fr) * 1984-10-11 1986-04-18 Teradyne Inc Dissipateur de chaleur pour composants electroniques avec substrat en ceramique
EP0368133A2 (de) * 1988-11-05 1990-05-16 Semikron Elektronik Gmbh Trägerkörper zur elektrisch isolierten Anordnung von Bauteilen

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2524247A1 (fr) * 1982-03-23 1983-09-30 Thomson Csf Procede de fabrication de circuits imprimes avec support metallique rigide conducteur individuel
EP0090696A1 (de) * 1982-03-23 1983-10-05 Thomson-Csf Verfahren zur Herstellung gedruckter Leiterplatten mit leitfähigem starrem individuellem metallischem Träger
US4616413A (en) * 1982-03-23 1986-10-14 Thomson-Csf Process for manufacturing printed circuits with an individual rigid conductive metallic support
FR2571921A1 (fr) * 1984-10-11 1986-04-18 Teradyne Inc Dissipateur de chaleur pour composants electroniques avec substrat en ceramique
EP0368133A2 (de) * 1988-11-05 1990-05-16 Semikron Elektronik Gmbh Trägerkörper zur elektrisch isolierten Anordnung von Bauteilen
EP0368133A3 (de) * 1988-11-05 1990-11-22 Semikron Elektronik Gmbh Trägerkörper zur elektrisch isolierten Anordnung von Bauteilen

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Legal Events

Date Code Title Description
ST Notification of lapse