FR2121454A1 - - Google Patents
Info
- Publication number
- FR2121454A1 FR2121454A1 FR7101166A FR7101166A FR2121454A1 FR 2121454 A1 FR2121454 A1 FR 2121454A1 FR 7101166 A FR7101166 A FR 7101166A FR 7101166 A FR7101166 A FR 7101166A FR 2121454 A1 FR2121454 A1 FR 2121454A1
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/047—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads being parallel to the base
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR7101166A FR2121454B1 (fr) | 1971-01-14 | 1971-01-14 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR7101166A FR2121454B1 (fr) | 1971-01-14 | 1971-01-14 |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2121454A1 true FR2121454A1 (fr) | 1972-08-25 |
FR2121454B1 FR2121454B1 (fr) | 1977-01-28 |
Family
ID=9070288
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7101166A Expired FR2121454B1 (fr) | 1971-01-14 | 1971-01-14 |
Country Status (1)
Country | Link |
---|---|
FR (1) | FR2121454B1 (fr) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2204043A1 (fr) * | 1972-10-19 | 1974-05-17 | Radiotechnique Compelec | |
FR2436498A1 (fr) * | 1978-09-14 | 1980-04-11 | Isotronics Inc | Boitier plat entierement metallique pour des micro-circuits |
FR2436497A1 (fr) * | 1978-09-14 | 1980-04-11 | Isotronics Inc | Boitier plat entierement metallique possedant d'excellentes caracteristiques de transfert thermique |
FR2513012A1 (fr) * | 1981-09-16 | 1983-03-18 | Isotronics Inc | Boitier plat pour microcircuit et son procede de fabrication |
FR2539249A1 (fr) * | 1983-01-07 | 1984-07-13 | Europ Composants Electron | Boitier a dissipation thermique elevee notamment pour microelectronique |
EP0114917A2 (fr) * | 1982-12-29 | 1984-08-08 | Olin Corporation | Empaquetages pour semi-conducteurs |
EP2953163A3 (fr) * | 2014-06-04 | 2015-12-30 | NEC Space Technologies, Ltd. | Emballage et procede de fabrication d'emballage |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3190952A (en) * | 1963-02-21 | 1965-06-22 | Bitko Sheldon | Welded hermetic seal |
-
1971
- 1971-01-14 FR FR7101166A patent/FR2121454B1/fr not_active Expired
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3190952A (en) * | 1963-02-21 | 1965-06-22 | Bitko Sheldon | Welded hermetic seal |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2204043A1 (fr) * | 1972-10-19 | 1974-05-17 | Radiotechnique Compelec | |
FR2436498A1 (fr) * | 1978-09-14 | 1980-04-11 | Isotronics Inc | Boitier plat entierement metallique pour des micro-circuits |
FR2436497A1 (fr) * | 1978-09-14 | 1980-04-11 | Isotronics Inc | Boitier plat entierement metallique possedant d'excellentes caracteristiques de transfert thermique |
FR2513012A1 (fr) * | 1981-09-16 | 1983-03-18 | Isotronics Inc | Boitier plat pour microcircuit et son procede de fabrication |
EP0114917A2 (fr) * | 1982-12-29 | 1984-08-08 | Olin Corporation | Empaquetages pour semi-conducteurs |
EP0114917A3 (fr) * | 1982-12-29 | 1986-03-19 | Olin Corporation | Empaquetages pour semi-conducteurs |
FR2539249A1 (fr) * | 1983-01-07 | 1984-07-13 | Europ Composants Electron | Boitier a dissipation thermique elevee notamment pour microelectronique |
EP0114760A1 (fr) * | 1983-01-07 | 1984-08-01 | Xeram | Boîtier à dissipation thermique élevée, notamment pour microélectronique |
EP2953163A3 (fr) * | 2014-06-04 | 2015-12-30 | NEC Space Technologies, Ltd. | Emballage et procede de fabrication d'emballage |
CN105321887A (zh) * | 2014-06-04 | 2016-02-10 | 日本电气太空技术株式会社 | 封装体及用于制造封装体的方法 |
US9820400B2 (en) | 2014-06-04 | 2017-11-14 | Nec Space Technologies, Ltd. | Package and method for fabricating package |
CN105321887B (zh) * | 2014-06-04 | 2019-05-28 | 日本电气太空技术株式会社 | 封装体及用于制造封装体的方法 |
Also Published As
Publication number | Publication date |
---|---|
FR2121454B1 (fr) | 1977-01-28 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |