FR2121454A1 - - Google Patents

Info

Publication number
FR2121454A1
FR2121454A1 FR7101166A FR7101166A FR2121454A1 FR 2121454 A1 FR2121454 A1 FR 2121454A1 FR 7101166 A FR7101166 A FR 7101166A FR 7101166 A FR7101166 A FR 7101166A FR 2121454 A1 FR2121454 A1 FR 2121454A1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7101166A
Other languages
French (fr)
Other versions
FR2121454B1 (enExample
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thales SA
Original Assignee
Le Materiel Telephonique Thomson CSF
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Le Materiel Telephonique Thomson CSF filed Critical Le Materiel Telephonique Thomson CSF
Priority to FR7101166A priority Critical patent/FR2121454B1/fr
Publication of FR2121454A1 publication Critical patent/FR2121454A1/fr
Application granted granted Critical
Publication of FR2121454B1 publication Critical patent/FR2121454B1/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/13—Containers comprising a conductive base serving as an interconnection
    • H10W76/134—Containers comprising a conductive base serving as an interconnection having other interconnections parallel to the conductive base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/60—Seals
FR7101166A 1971-01-14 1971-01-14 Expired FR2121454B1 (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR7101166A FR2121454B1 (enExample) 1971-01-14 1971-01-14

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7101166A FR2121454B1 (enExample) 1971-01-14 1971-01-14

Publications (2)

Publication Number Publication Date
FR2121454A1 true FR2121454A1 (enExample) 1972-08-25
FR2121454B1 FR2121454B1 (enExample) 1977-01-28

Family

ID=9070288

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7101166A Expired FR2121454B1 (enExample) 1971-01-14 1971-01-14

Country Status (1)

Country Link
FR (1) FR2121454B1 (enExample)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2204043A1 (enExample) * 1972-10-19 1974-05-17 Radiotechnique Compelec
FR2436498A1 (fr) * 1978-09-14 1980-04-11 Isotronics Inc Boitier plat entierement metallique pour des micro-circuits
FR2436497A1 (fr) * 1978-09-14 1980-04-11 Isotronics Inc Boitier plat entierement metallique possedant d'excellentes caracteristiques de transfert thermique
FR2513012A1 (fr) * 1981-09-16 1983-03-18 Isotronics Inc Boitier plat pour microcircuit et son procede de fabrication
FR2539249A1 (fr) * 1983-01-07 1984-07-13 Europ Composants Electron Boitier a dissipation thermique elevee notamment pour microelectronique
EP0114917A3 (en) * 1982-12-29 1986-03-19 Olin Corporation Semiconductor packages
EP2953163A3 (en) * 2014-06-04 2015-12-30 NEC Space Technologies, Ltd. Package and method for fabricating package

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3190952A (en) * 1963-02-21 1965-06-22 Bitko Sheldon Welded hermetic seal

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3190952A (en) * 1963-02-21 1965-06-22 Bitko Sheldon Welded hermetic seal

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2204043A1 (enExample) * 1972-10-19 1974-05-17 Radiotechnique Compelec
FR2436498A1 (fr) * 1978-09-14 1980-04-11 Isotronics Inc Boitier plat entierement metallique pour des micro-circuits
FR2436497A1 (fr) * 1978-09-14 1980-04-11 Isotronics Inc Boitier plat entierement metallique possedant d'excellentes caracteristiques de transfert thermique
FR2513012A1 (fr) * 1981-09-16 1983-03-18 Isotronics Inc Boitier plat pour microcircuit et son procede de fabrication
EP0114917A3 (en) * 1982-12-29 1986-03-19 Olin Corporation Semiconductor packages
FR2539249A1 (fr) * 1983-01-07 1984-07-13 Europ Composants Electron Boitier a dissipation thermique elevee notamment pour microelectronique
EP0114760A1 (fr) * 1983-01-07 1984-08-01 Xeram Boîtier à dissipation thermique élevée, notamment pour microélectronique
EP2953163A3 (en) * 2014-06-04 2015-12-30 NEC Space Technologies, Ltd. Package and method for fabricating package
CN105321887A (zh) * 2014-06-04 2016-02-10 日本电气太空技术株式会社 封装体及用于制造封装体的方法
US9820400B2 (en) 2014-06-04 2017-11-14 Nec Space Technologies, Ltd. Package and method for fabricating package
CN105321887B (zh) * 2014-06-04 2019-05-28 日本电气太空技术株式会社 封装体及用于制造封装体的方法

Also Published As

Publication number Publication date
FR2121454B1 (enExample) 1977-01-28

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Legal Events

Date Code Title Description
ST Notification of lapse