FR2118101A1 - - Google Patents
Info
- Publication number
- FR2118101A1 FR2118101A1 FR7145100A FR7145100A FR2118101A1 FR 2118101 A1 FR2118101 A1 FR 2118101A1 FR 7145100 A FR7145100 A FR 7145100A FR 7145100 A FR7145100 A FR 7145100A FR 2118101 A1 FR2118101 A1 FR 2118101A1
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H10W72/30—
-
- H10W72/073—
-
- H10W72/07336—
-
- H10W72/07533—
-
- H10W72/352—
-
- H10W90/754—
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB5943670 | 1970-12-15 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR2118101A1 true FR2118101A1 (enExample) | 1972-07-28 |
| FR2118101B1 FR2118101B1 (enExample) | 1976-06-04 |
Family
ID=10483762
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR7145100A Expired FR2118101B1 (enExample) | 1970-12-15 | 1971-12-15 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US3786556A (enExample) |
| JP (1) | JPS5013630B1 (enExample) |
| FR (1) | FR2118101B1 (enExample) |
| GB (1) | GB1331980A (enExample) |
| IT (1) | IT943233B (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0201954A1 (en) * | 1985-04-22 | 1986-11-20 | Koninklijke Philips Electronics N.V. | Semiconductor device comprising a heat sink |
| EP0316026A1 (en) * | 1987-11-03 | 1989-05-17 | Presidenza Del Consiglio Dei Ministri - Ufficio Del Ministro Per Il Coordinamento Delle Iniziative Per La Ric.Ca Sc. E Tecn. | Procedure for soldering a semiconductor component (chip) to a supporting unit |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3979659A (en) * | 1975-01-30 | 1976-09-07 | Texas Instruments Incorporated | Automotive alternator rectifier bridges |
| JPS51123149A (en) * | 1975-04-19 | 1976-10-27 | Nitto Kogaku Kk | Zoom lens used for close photography |
| FR2431900A1 (fr) * | 1978-07-25 | 1980-02-22 | Thomson Csf | Systeme de soudure d'un laser a semiconducteur sur un socle metallique |
| US4463892A (en) * | 1980-02-28 | 1984-08-07 | Burroughs Corporation | Method for manufacturing IC packages |
| US4603805A (en) * | 1985-05-20 | 1986-08-05 | Motorola, Inc. | Method for enhancing the solderability of nickel layers |
| JPH03120789A (ja) * | 1989-10-03 | 1991-05-22 | Mitsubishi Electric Corp | プリント配線板への電子部品取付法 |
| WO2002058876A1 (de) * | 2001-01-26 | 2002-08-01 | Robert Bosch Gmbh | Verfahren zur herstellung einer verbindung, vorrichtung und leistungshalbleiterbauelement |
| JP2003334680A (ja) * | 2002-05-22 | 2003-11-25 | Suzuki Motor Corp | 溶接方法及びこれを用いて接合された構造体 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB851544A (en) * | 1957-10-28 | 1960-10-19 | English Electric Valve Co Ltd | Improvements in or relating to semi-conductor devices |
| GB1084028A (en) * | 1965-11-29 | 1967-09-20 | Standard Telephones Cables Ltd | A method of soldering a semiconductor chip to a backing plate |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3060553A (en) * | 1955-12-07 | 1962-10-30 | Motorola Inc | Method for making semiconductor device |
| US3204327A (en) * | 1957-10-28 | 1965-09-07 | Motorola Inc | Method for making semiconductor devices employing a hollow, slotted cylindrical jig and vertical mounting posts |
| US3217213A (en) * | 1961-06-02 | 1965-11-09 | Slater Electric Inc | Semiconductor diode construction with heat dissipating housing |
| US3411193A (en) * | 1965-08-31 | 1968-11-19 | Marshall Ind | Terminal leads for electrical devices |
| US3512051A (en) * | 1965-12-29 | 1970-05-12 | Burroughs Corp | Contacts for a semiconductor device |
| FR1519854A (fr) * | 1967-02-23 | 1968-04-05 | Radiotechnique Coprim Rtc | Embase composite, notamment pour dispositif semi-conducteur |
-
1970
- 1970-12-15 GB GB5943670A patent/GB1331980A/en not_active Expired
-
1971
- 1971-12-10 US US00206620A patent/US3786556A/en not_active Expired - Lifetime
- 1971-12-11 IT IT71052/71A patent/IT943233B/it active
- 1971-12-14 JP JP46100791A patent/JPS5013630B1/ja active Pending
- 1971-12-15 FR FR7145100A patent/FR2118101B1/fr not_active Expired
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB851544A (en) * | 1957-10-28 | 1960-10-19 | English Electric Valve Co Ltd | Improvements in or relating to semi-conductor devices |
| GB1084028A (en) * | 1965-11-29 | 1967-09-20 | Standard Telephones Cables Ltd | A method of soldering a semiconductor chip to a backing plate |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0201954A1 (en) * | 1985-04-22 | 1986-11-20 | Koninklijke Philips Electronics N.V. | Semiconductor device comprising a heat sink |
| EP0316026A1 (en) * | 1987-11-03 | 1989-05-17 | Presidenza Del Consiglio Dei Ministri - Ufficio Del Ministro Per Il Coordinamento Delle Iniziative Per La Ric.Ca Sc. E Tecn. | Procedure for soldering a semiconductor component (chip) to a supporting unit |
Also Published As
| Publication number | Publication date |
|---|---|
| IT943233B (it) | 1973-04-02 |
| DE2161945A1 (de) | 1972-07-13 |
| DE2161945B2 (de) | 1975-08-28 |
| FR2118101B1 (enExample) | 1976-06-04 |
| JPS5013630B1 (enExample) | 1975-05-21 |
| US3786556A (en) | 1974-01-22 |
| GB1331980A (en) | 1973-09-26 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| ST | Notification of lapse |