FR2099452B1 - - Google Patents

Info

Publication number
FR2099452B1
FR2099452B1 FR7126056A FR7126056A FR2099452B1 FR 2099452 B1 FR2099452 B1 FR 2099452B1 FR 7126056 A FR7126056 A FR 7126056A FR 7126056 A FR7126056 A FR 7126056A FR 2099452 B1 FR2099452 B1 FR 2099452B1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR7126056A
Other versions
FR2099452A1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of FR2099452A1 publication Critical patent/FR2099452A1/fr
Application granted granted Critical
Publication of FR2099452B1 publication Critical patent/FR2099452B1/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/291—Oxides or nitrides or carbides, e.g. ceramics, glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1306—Field-effect transistor [FET]
    • H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S257/00—Active solid-state devices, e.g. transistors, solid-state diodes
    • Y10S257/906—Dram with capacitor electrodes used for accessing, e.g. bit line is capacitor plate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/953—Making radiation resistant device

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Bipolar Transistors (AREA)
  • Formation Of Insulating Films (AREA)
FR7126056A 1970-07-18 1971-07-16 Expired FR2099452B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2035703A DE2035703C3 (de) 1970-07-18 1970-07-18 Verfahren zur Verbesserung der Strahlungsresistenz von Siliziumtransistoren mit Siliziumoxiddeckschicht

Publications (2)

Publication Number Publication Date
FR2099452A1 FR2099452A1 (fr) 1972-03-17
FR2099452B1 true FR2099452B1 (fr) 1977-01-28

Family

ID=5777150

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7126056A Expired FR2099452B1 (fr) 1970-07-18 1971-07-16

Country Status (5)

Country Link
US (1) US3829961A (fr)
DE (1) DE2035703C3 (fr)
FR (1) FR2099452B1 (fr)
GB (1) GB1310449A (fr)
NL (1) NL7109041A (fr)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4043836A (en) * 1976-05-03 1977-08-23 General Electric Company Method of manufacturing semiconductor devices
US4163156A (en) * 1976-05-19 1979-07-31 International Business Machines Corporation Method of modifying the performance characteristics of a Josephson junction
JPS5395581A (en) * 1977-02-02 1978-08-21 Hitachi Ltd Manufacture for semiconductor device
US4184896A (en) * 1978-06-06 1980-01-22 The United States Of America As Represented By The Secretary Of The Air Force Surface barrier tailoring of semiconductor devices utilizing scanning electron microscope produced ionizing radiation
US4172228A (en) * 1978-06-30 1979-10-23 Nasa Method for analyzing radiation sensitivity of integrated circuits
US4903094A (en) * 1986-08-26 1990-02-20 General Electric Company Memory cell structure having radiation hardness
US9061143B2 (en) * 2011-10-14 2015-06-23 Sumitomo Heavy Industries, Ltd. Charged particle beam irradiation system and charged particle beam irradiation planning method
CN108362988B (zh) * 2018-02-09 2020-12-29 哈尔滨工业大学 一种抑制双极晶体管低剂量率增强效应的方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3430043A (en) * 1965-10-08 1969-02-25 Atomic Energy Commission Minimum ionization particle detector produced by gamma ray irradiation
US3570112A (en) * 1967-12-01 1971-03-16 Nat Defence Canada Radiation hardening of insulated gate field effect transistors

Also Published As

Publication number Publication date
DE2035703C3 (de) 1974-07-11
DE2035703B2 (de) 1973-12-13
FR2099452A1 (fr) 1972-03-17
NL7109041A (fr) 1972-01-20
US3829961A (en) 1974-08-20
DE2035703A1 (de) 1972-01-27
GB1310449A (en) 1973-03-21

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Legal Events

Date Code Title Description
ST Notification of lapse