FR2077332A7 - - Google Patents

Info

Publication number
FR2077332A7
FR2077332A7 FR7102461A FR7102461A FR2077332A7 FR 2077332 A7 FR2077332 A7 FR 2077332A7 FR 7102461 A FR7102461 A FR 7102461A FR 7102461 A FR7102461 A FR 7102461A FR 2077332 A7 FR2077332 A7 FR 2077332A7
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR7102461A
Other languages
French (fr)
Other versions
FR2077332B3 (de
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CBS Corp
Original Assignee
Westinghouse Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Westinghouse Electric Corp filed Critical Westinghouse Electric Corp
Publication of FR2077332A7 publication Critical patent/FR2077332A7/fr
Application granted granted Critical
Publication of FR2077332B3 publication Critical patent/FR2077332B3/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
    • H01L23/4824—Pads with extended contours, e.g. grid structure, branch structure, finger structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01015—Phosphorus [P]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01027—Cobalt [Co]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01032—Germanium [Ge]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01052—Tellurium [Te]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01058—Cerium [Ce]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30107—Inductance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Thyristors (AREA)
FR7102461A 1970-01-26 1971-01-26 Expired FR2077332B3 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US584870A 1970-01-26 1970-01-26
US7519970A 1970-09-24 1970-09-24

Publications (2)

Publication Number Publication Date
FR2077332A7 true FR2077332A7 (de) 1971-10-22
FR2077332B3 FR2077332B3 (de) 1973-10-19

Family

ID=26674840

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7102461A Expired FR2077332B3 (de) 1970-01-26 1971-01-26

Country Status (2)

Country Link
DE (1) DE2103146A1 (de)
FR (1) FR2077332B3 (de)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2191267A1 (de) * 1972-06-28 1974-02-01 Westinghouse Brake Semi Conduc
US3975754A (en) * 1973-12-12 1976-08-17 Societe Generale De Constructions Electriques Et Mecaniques (Alsthom) Power thyristor having a high triggering speed
EP0064231A2 (de) * 1981-04-30 1982-11-10 Kabushiki Kaisha Toshiba Kompressions-Halbleitervorrichtung
EP0066850A2 (de) * 1981-06-05 1982-12-15 Hitachi, Ltd. Halbleiterschaltungsanordnung
EP0260471A1 (de) * 1986-09-16 1988-03-23 BBC Brown Boveri AG Leistungs-Halbleiterbauelement
EP0324929A2 (de) * 1987-12-03 1989-07-26 Mitsubishi Denki Kabushiki Kaisha Halbleiteranordnung vom Druckverbindungstyp
EP0470899A1 (de) * 1990-08-07 1992-02-12 Auxilec Diode mit Elektroden und Gehäuse zusammengesetzt ohne Lötmittel oder Fassung und Gleichrichterbrücke verwirklicht mit solchen Dioden
EP0646960A1 (de) * 1993-10-01 1995-04-05 Koninklijke Philips Electronics N.V. Halbleiteranordnung mit einem Halbleiterelement ausgestaltet in einer Mesastruktur
EP0685886A1 (de) * 1994-05-31 1995-12-06 Kabushiki Kaisha Toshiba Halbleiteranordnung vom gemischten MOS-Typ

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56131955A (en) * 1980-09-01 1981-10-15 Hitachi Ltd Semiconductor device

Cited By (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2191267A1 (de) * 1972-06-28 1974-02-01 Westinghouse Brake Semi Conduc
US3975754A (en) * 1973-12-12 1976-08-17 Societe Generale De Constructions Electriques Et Mecaniques (Alsthom) Power thyristor having a high triggering speed
EP0064231A2 (de) * 1981-04-30 1982-11-10 Kabushiki Kaisha Toshiba Kompressions-Halbleitervorrichtung
EP0064231A3 (en) * 1981-04-30 1984-12-19 Kabushiki Kaisha Toshiba Compression-type semiconductor device
EP0066850A2 (de) * 1981-06-05 1982-12-15 Hitachi, Ltd. Halbleiterschaltungsanordnung
EP0066850A3 (en) * 1981-06-05 1983-08-17 Hitachi, Ltd. Semiconductor switching device
US4862239A (en) * 1986-09-16 1989-08-29 Bbc Brown Boveri Ag Power semiconductor component
EP0260471A1 (de) * 1986-09-16 1988-03-23 BBC Brown Boveri AG Leistungs-Halbleiterbauelement
CH670334A5 (de) * 1986-09-16 1989-05-31 Bbc Brown Boveri & Cie
EP0324929A3 (de) * 1987-12-03 1990-01-10 Mitsubishi Denki Kabushiki Kaisha Halbleiteranordnung vom Druckverbindungstyp
EP0324929A2 (de) * 1987-12-03 1989-07-26 Mitsubishi Denki Kabushiki Kaisha Halbleiteranordnung vom Druckverbindungstyp
US5047836A (en) * 1987-12-03 1991-09-10 Mitsubishi Denki Kabushiki Kaisha Temperature compensating contact to avoid misregistration
EP0470899A1 (de) * 1990-08-07 1992-02-12 Auxilec Diode mit Elektroden und Gehäuse zusammengesetzt ohne Lötmittel oder Fassung und Gleichrichterbrücke verwirklicht mit solchen Dioden
FR2665817A1 (fr) * 1990-08-07 1992-02-14 Auxilec Diode a electrode et a boitier assembles sans soudure ni sertissage, et pont redresseur realise avec de telles diodes.
US5206793A (en) * 1990-08-07 1993-04-27 Auxilec Diode with electrodes and case assembled without soldering or crimping, and rectifier bridge made with such diodes
EP0646960A1 (de) * 1993-10-01 1995-04-05 Koninklijke Philips Electronics N.V. Halbleiteranordnung mit einem Halbleiterelement ausgestaltet in einer Mesastruktur
BE1007589A3 (nl) * 1993-10-01 1995-08-16 Philips Electronics Nv Halfgeleiderinrichting met in mesa-structuur aangebracht halfgeleiderelement.
US5569952A (en) * 1993-10-01 1996-10-29 U.S. Philips Corporation Semiconductor device with a semiconductor element provided in a mesa structure
EP0685886A1 (de) * 1994-05-31 1995-12-06 Kabushiki Kaisha Toshiba Halbleiteranordnung vom gemischten MOS-Typ
US5539232A (en) * 1994-05-31 1996-07-23 Kabushiki Kaisha Toshiba MOS composite type semiconductor device

Also Published As

Publication number Publication date
DE2103146A1 (de) 1971-08-05
FR2077332B3 (de) 1973-10-19

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Legal Events

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ST Notification of lapse