FR2060924A5 - - Google Patents

Info

Publication number
FR2060924A5
FR2060924A5 FR7032127A FR7032127A FR2060924A5 FR 2060924 A5 FR2060924 A5 FR 2060924A5 FR 7032127 A FR7032127 A FR 7032127A FR 7032127 A FR7032127 A FR 7032127A FR 2060924 A5 FR2060924 A5 FR 2060924A5
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR7032127A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of FR2060924A5 publication Critical patent/FR2060924A5/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/04—Heating appliances
    • B23K3/047—Heating appliances electric
    • B23K3/0471—Heating appliances electric using resistance rod or bar, e.g. carbon silica
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
FR7032127A 1969-09-02 1970-08-10 Expired FR2060924A5 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US85439669A 1969-09-02 1969-09-02

Publications (1)

Publication Number Publication Date
FR2060924A5 true FR2060924A5 (fr) 1971-06-18

Family

ID=25318579

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7032127A Expired FR2060924A5 (fr) 1969-09-02 1970-08-10

Country Status (4)

Country Link
US (1) US3576969A (fr)
DE (1) DE2042024A1 (fr)
FR (1) FR2060924A5 (fr)
GB (1) GB1289026A (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2356140A1 (de) * 1972-11-09 1974-05-22 Cii Honeywell Bull Vorrichtung zum anloeten von integrierten schaltungsplaettchen an einem substrat
FR2321585A1 (fr) * 1975-08-21 1977-03-18 Applied Power Inc Turbomachine

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3731866A (en) * 1971-01-04 1973-05-08 Cogar Corp Apparatus for removing and replacing multi-pinned components mounted on circuit boards
US3786228A (en) * 1971-12-15 1974-01-15 Roesch K Inc Electric soldering iron tip
US3765590A (en) * 1972-05-08 1973-10-16 Fairchild Camera Instr Co Structure for simultaneously attaching a plurality of semiconductor dice to their respective package leads
US4315128A (en) * 1978-04-07 1982-02-09 Kulicke And Soffa Industries Inc. Electrically heated bonding tool for the manufacture of semiconductor devices
US4583676A (en) * 1982-05-03 1986-04-22 Motorola, Inc. Method of wire bonding a semiconductor die and apparatus therefor
US4518110A (en) * 1982-09-22 1985-05-21 Control Data Corporation Device for soldering/desoldering apertured lendless packages
US4637542A (en) * 1982-09-22 1987-01-20 Control Data Corporation Process for soldering and desoldering apertured leadless packages
DE3722726A1 (de) * 1987-07-09 1989-01-19 Productech Gmbh Geheizter stempel
US4828162A (en) * 1988-02-29 1989-05-09 Hughes Aircraft Company Moving jaw reflow soldering head
US4967058A (en) * 1988-04-13 1990-10-30 Kabushiki Kaisha Toshiba Power heating member
US4835847A (en) * 1988-04-20 1989-06-06 International Business Machines Corp. Method and apparatus for mounting a flexible film electronic device carrier on a substrate
US5010227A (en) * 1989-02-15 1991-04-23 Todd Thomas W Soldering apparatus and method of using the same
JPH0669610B2 (ja) * 1989-03-14 1994-09-07 カシオ計算機株式会社 ヒータチップおよびこれを用いたボンディング方法
ATE120678T1 (de) * 1990-07-13 1995-04-15 Siemens Ag Keramischer lötbügel.
US5278393A (en) * 1992-06-29 1994-01-11 Henry Kim Electrically heated desoldering unit having adjustable stop means preventing circuit board damage for desoldering electronic components having rows of leads
US5603857A (en) * 1995-02-24 1997-02-18 Assembly Technologies International, Inc. Handheld electric heater for removing or replacing surface-mounted integrated circuits from a circuit board
US6288365B1 (en) * 1999-05-18 2001-09-11 Mcammond Matthew J. Soldering assembly
US10537031B2 (en) 2017-03-22 2020-01-14 Service Support Specialties, Inc. Reflow soldering apparatus, system and method

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2474312A (en) * 1946-09-21 1949-06-28 Polychrome Corp Stylus
US2606987A (en) * 1949-06-14 1952-08-12 Thomas W Winstead Heat sealing element for thermo-plastic film
US3146692A (en) * 1959-06-11 1964-09-01 Roll A Grill Corp Of America Direct-contact glass plate toaster
US3105136A (en) * 1960-02-02 1963-09-24 Ashenfard Samuel Heat exchange system and heating element therefor
US3136878A (en) * 1960-06-23 1964-06-09 Itt Soldering iron
US3230338A (en) * 1962-07-02 1966-01-18 Ibm Selective heating apparatus
US3382564A (en) * 1965-09-27 1968-05-14 Gen Dynamics Corp Soldering apparatus and method for microelectronic circuits
US3478191A (en) * 1967-01-23 1969-11-11 Sprague Electric Co Thermal print head

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2356140A1 (de) * 1972-11-09 1974-05-22 Cii Honeywell Bull Vorrichtung zum anloeten von integrierten schaltungsplaettchen an einem substrat
FR2321585A1 (fr) * 1975-08-21 1977-03-18 Applied Power Inc Turbomachine

Also Published As

Publication number Publication date
DE2042024A1 (de) 1971-03-04
GB1289026A (fr) 1972-09-13
US3576969A (en) 1971-05-04

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Legal Events

Date Code Title Description
ST Notification of lapse