FR2049170B2 - - Google Patents
Info
- Publication number
- FR2049170B2 FR2049170B2 FR7021109A FR7021109A FR2049170B2 FR 2049170 B2 FR2049170 B2 FR 2049170B2 FR 7021109 A FR7021109 A FR 7021109A FR 7021109 A FR7021109 A FR 7021109A FR 2049170 B2 FR2049170 B2 FR 2049170B2
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5383—Multilayer substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
- H05K3/4061—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in inorganic insulating substrates
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Compositions Of Oxide Ceramics (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US83191169A | 1969-06-10 | 1969-06-10 | |
| US83480369A | 1969-06-19 | 1969-06-19 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR2049170A2 FR2049170A2 (ko) | 1971-03-26 |
| FR2049170B2 true FR2049170B2 (ko) | 1973-02-02 |
Family
ID=27125475
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR7021109A Expired FR2049170B2 (ko) | 1969-06-10 | 1970-06-09 |
Country Status (4)
| Country | Link |
|---|---|
| CA (1) | CA942433A (ko) |
| DE (1) | DE2028605A1 (ko) |
| FR (1) | FR2049170B2 (ko) |
| GB (1) | GB1313537A (ko) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2531302A1 (fr) * | 1982-07-30 | 1984-02-03 | Xerox Corp | Procedes de formation d'un circuit electrique a haute densite et d'elements d'interconnexion pour le circuit |
| JP3210503B2 (ja) * | 1993-09-30 | 2001-09-17 | 株式会社東芝 | マルチチップモジュールおよびその製造方法 |
| US10272836B2 (en) | 2017-06-28 | 2019-04-30 | Honda Motor Co., Ltd. | Smart functional leather for steering wheel and dash board |
| US10742061B2 (en) | 2017-06-28 | 2020-08-11 | Honda Motor Co., Ltd. | Smart functional leather for recharging a portable electronic device |
| US10953793B2 (en) | 2017-06-28 | 2021-03-23 | Honda Motor Co., Ltd. | Haptic function leather component and method of making the same |
| US11665830B2 (en) | 2017-06-28 | 2023-05-30 | Honda Motor Co., Ltd. | Method of making smart functional leather |
| US10682952B2 (en) | 2017-06-28 | 2020-06-16 | Honda Motor Co., Ltd. | Embossed smart functional premium natural leather |
| US11751337B2 (en) | 2019-04-26 | 2023-09-05 | Honda Motor Co., Ltd. | Wireless power of in-mold electronics and the application within a vehicle |
-
1970
- 1970-06-09 FR FR7021109A patent/FR2049170B2/fr not_active Expired
- 1970-06-09 CA CA085,064A patent/CA942433A/en not_active Expired
- 1970-06-10 DE DE19702028605 patent/DE2028605A1/de active Pending
- 1970-06-10 GB GB2820770A patent/GB1313537A/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| CA942433A (en) | 1974-02-19 |
| DE2028605A1 (ko) | 1970-12-17 |
| GB1313537A (en) | 1973-04-11 |
| FR2049170A2 (ko) | 1971-03-26 |