FR2029549A1 - - Google Patents
Info
- Publication number
- FR2029549A1 FR2029549A1 FR7002753A FR7002753A FR2029549A1 FR 2029549 A1 FR2029549 A1 FR 2029549A1 FR 7002753 A FR7002753 A FR 7002753A FR 7002753 A FR7002753 A FR 7002753A FR 2029549 A1 FR2029549 A1 FR 2029549A1
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0055—After-treatment, e.g. cleaning or desmearing of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09572—Solder filled plated through-hole in the final product
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/08—Treatments involving gases
- H05K2203/083—Evaporation or sublimation of a compound, e.g. gas bubble generating agent
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/08—Treatments involving gases
- H05K2203/085—Using vacuum or low pressure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Manufacture Of Switches (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US79468669A | 1969-01-28 | 1969-01-28 | |
US201970A | 1970-01-12 | 1970-01-12 |
Publications (1)
Publication Number | Publication Date |
---|---|
FR2029549A1 true FR2029549A1 (fr) | 1970-10-23 |
Family
ID=26669799
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7002753A Withdrawn FR2029549A1 (fr) | 1969-01-28 | 1970-01-27 |
Country Status (6)
Country | Link |
---|---|
US (1) | US3755890A (fr) |
JP (1) | JPS5019173B1 (fr) |
BE (1) | BE745068A (fr) |
DE (1) | DE2003473A1 (fr) |
FR (1) | FR2029549A1 (fr) |
GB (1) | GB1302514A (fr) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3836388A (en) * | 1972-10-18 | 1974-09-17 | Western Electric Co | Distributing a fluid evenly over the surface of an article |
US3895137A (en) * | 1973-12-03 | 1975-07-15 | Fmc Corp | Method of plating articles having small clearances or crevices |
US3934060A (en) * | 1973-12-19 | 1976-01-20 | Motorola, Inc. | Method for forming a deposited silicon dioxide layer on a semiconductor wafer |
DE2537444C2 (de) * | 1974-09-16 | 1982-10-21 | International Business Machines Corp., 10504 Armonk, N.Y. | Verfahren zum Stabilisieren von Laminaten |
JPS51146661U (fr) * | 1975-05-19 | 1976-11-25 | ||
US4402998A (en) * | 1982-01-04 | 1983-09-06 | Western Electric Co., Inc. | Method for providing an adherent electroless metal coating on an epoxy surface |
KR900003157B1 (ko) * | 1986-04-02 | 1990-05-09 | 가부시끼가이샤 히다찌세이샤꾸쇼 | 스루호울 도금의 전처리 방법 |
GB2210818A (en) * | 1987-10-10 | 1989-06-21 | Plessey Co Plc | A process for soldering a component to a printed circuit board |
US5447758A (en) * | 1993-10-18 | 1995-09-05 | Pelletier; Andree | PVC sheet screen printing process |
US6051169A (en) * | 1997-08-27 | 2000-04-18 | International Business Machines Corporation | Vacuum baking process |
US6187652B1 (en) * | 1998-09-14 | 2001-02-13 | Fujitsu Limited | Method of fabrication of multiple-layer high density substrate |
JP3967239B2 (ja) * | 2001-09-20 | 2007-08-29 | 株式会社フジクラ | 充填金属部付き部材の製造方法及び充填金属部付き部材 |
JP5801047B2 (ja) * | 2010-01-19 | 2015-10-28 | 有限会社ヨコタテクニカ | リフロー半田付け装置及び方法 |
CN112654163A (zh) * | 2020-12-25 | 2021-04-13 | 悦虎晶芯电路(苏州)股份有限公司 | 一种清理l异形槽孔拐角纤维丝毛刺的方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3029473A (en) * | 1959-05-25 | 1962-04-17 | Riverside Plastics Corp | Vacuum post-curing of infusible plastic material |
US3528173A (en) * | 1966-08-15 | 1970-09-15 | Andrew S Gall | Making circuit boards |
US3413392A (en) * | 1966-10-17 | 1968-11-26 | Du Pont | Hot pressing process |
-
1970
- 1970-01-12 US US00002019A patent/US3755890A/en not_active Expired - Lifetime
- 1970-01-22 GB GB322070A patent/GB1302514A/en not_active Expired
- 1970-01-27 DE DE19702003473 patent/DE2003473A1/de active Pending
- 1970-01-27 FR FR7002753A patent/FR2029549A1/fr not_active Withdrawn
- 1970-01-28 BE BE745068A patent/BE745068A/fr not_active IP Right Cessation
- 1970-01-28 JP JP45007636A patent/JPS5019173B1/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
DE2003473A1 (de) | 1970-08-27 |
US3755890A (en) | 1973-09-04 |
BE745068A (fr) | 1970-07-01 |
GB1302514A (fr) | 1973-01-10 |
JPS5019173B1 (fr) | 1975-07-04 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
CD | Change of name or company name | ||
TP | Transmission of property | ||
ST | Notification of lapse |