FR2024319A1 - - Google Patents
Info
- Publication number
- FR2024319A1 FR2024319A1 FR6939429A FR6939429A FR2024319A1 FR 2024319 A1 FR2024319 A1 FR 2024319A1 FR 6939429 A FR6939429 A FR 6939429A FR 6939429 A FR6939429 A FR 6939429A FR 2024319 A1 FR2024319 A1 FR 2024319A1
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/818—Bonding techniques
- H01L2224/81801—Soldering or alloying
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01013—Aluminum [Al]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01014—Silicon [Si]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01042—Molybdenum [Mo]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01074—Tungsten [W]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19041—Component type being a capacitor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/30107—Inductance
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Bipolar Transistors (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US77936068A | 1968-11-27 | 1968-11-27 |
Publications (1)
Publication Number | Publication Date |
---|---|
FR2024319A1 true FR2024319A1 (fr) | 1970-08-28 |
Family
ID=25116189
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR6939429A Withdrawn FR2024319A1 (fr) | 1968-11-27 | 1969-11-17 |
Country Status (3)
Country | Link |
---|---|
DE (1) | DE1954551A1 (fr) |
FR (1) | FR2024319A1 (fr) |
NL (1) | NL6914548A (fr) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2471048A1 (fr) * | 1979-12-07 | 1981-06-12 | Silicium Semiconducteur Ssc | Structure et procede de montage d'un composant semi-conducteur principal et d'un circuit auxiliaire |
EP0885457A2 (fr) * | 1995-11-08 | 1998-12-23 | Endgate Corporation | Procede d'elaboration d'une structure de circuit comportant une matrice de dispositifs montes en flip |
-
1969
- 1969-09-25 NL NL6914548A patent/NL6914548A/xx unknown
- 1969-10-30 DE DE19691954551 patent/DE1954551A1/de active Pending
- 1969-11-17 FR FR6939429A patent/FR2024319A1/fr not_active Withdrawn
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2471048A1 (fr) * | 1979-12-07 | 1981-06-12 | Silicium Semiconducteur Ssc | Structure et procede de montage d'un composant semi-conducteur principal et d'un circuit auxiliaire |
US4446478A (en) * | 1979-12-07 | 1984-05-01 | Le Silicium Semiconducteur Ssc | Assembly in a single case of a main power-switching semiconductor component and a destorage diode |
EP0885457A2 (fr) * | 1995-11-08 | 1998-12-23 | Endgate Corporation | Procede d'elaboration d'une structure de circuit comportant une matrice de dispositifs montes en flip |
EP0885457A4 (fr) * | 1995-11-08 | 2007-06-13 | Endwave Corp | Procede d'elaboration d'une structure de circuit comportant une matrice de dispositifs montes en flip |
Also Published As
Publication number | Publication date |
---|---|
DE1954551A1 (de) | 1970-06-11 |
NL6914548A (fr) | 1970-05-29 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |