FR2023215B1 - - Google Patents
Info
- Publication number
- FR2023215B1 FR2023215B1 FR6939042A FR6939042A FR2023215B1 FR 2023215 B1 FR2023215 B1 FR 2023215B1 FR 6939042 A FR6939042 A FR 6939042A FR 6939042 A FR6939042 A FR 6939042A FR 2023215 B1 FR2023215 B1 FR 2023215B1
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/69—Inorganic materials
- H10P14/692—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses
- H10P14/6938—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses the material containing at least one metal element, e.g. metal oxides, metal oxynitrides or metal oxycarbides
- H10P14/6939—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses the material containing at least one metal element, e.g. metal oxides, metal oxynitrides or metal oxycarbides characterised by the metal
- H10P14/69396—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses the material containing at least one metal element, e.g. metal oxides, metal oxynitrides or metal oxycarbides characterised by the metal the material containing at least one rare earth metal element, e.g. oxides of lanthanides, scandium or yttrium
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/01—Manufacture or treatment
- H10D64/013—Manufacture or treatment of electrodes having a conductor capacitively coupled to a semiconductor by an insulator
- H10D64/01302—Manufacture or treatment of electrodes having a conductor capacitively coupled to a semiconductor by an insulator the insulator being formed after the semiconductor body, the semiconductor being silicon
- H10D64/01332—Making the insulator
- H10D64/01336—Making the insulator on single crystalline silicon, e.g. chemical oxidation using a liquid
- H10D64/0134—Making the insulator on single crystalline silicon, e.g. chemical oxidation using a liquid with a treatment, e.g. annealing, after the formation of the insulator and before the formation of the conductor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/01—Manufacture or treatment
- H10D64/013—Manufacture or treatment of electrodes having a conductor capacitively coupled to a semiconductor by an insulator
- H10D64/01302—Manufacture or treatment of electrodes having a conductor capacitively coupled to a semiconductor by an insulator the insulator being formed after the semiconductor body, the semiconductor being silicon
- H10D64/01332—Making the insulator
- H10D64/01336—Making the insulator on single crystalline silicon, e.g. chemical oxidation using a liquid
- H10D64/01342—Making the insulator on single crystalline silicon, e.g. chemical oxidation using a liquid by deposition, e.g. evaporation, ALD or laser deposition
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/60—Electrodes characterised by their materials
- H10D64/66—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes
- H10D64/68—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes characterised by the insulator, e.g. by the gate insulator
- H10D64/681—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes characterised by the insulator, e.g. by the gate insulator having a compositional variation, e.g. multilayered
- H10D64/685—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes characterised by the insulator, e.g. by the gate insulator having a compositional variation, e.g. multilayered being perpendicular to the channel plane
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D99/00—Subject matter not provided for in other groups of this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/66—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials
- H10P14/662—Laminate layers, e.g. stacks of alternating high-k metal oxides
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/69—Inorganic materials
- H10P14/692—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses
- H10P14/6921—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses containing silicon
- H10P14/69215—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses containing silicon the material being a silicon oxide, e.g. SiO2
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/69—Inorganic materials
- H10P14/694—Inorganic materials composed of nitrides
- H10P14/6943—Inorganic materials composed of nitrides containing silicon
- H10P14/69433—Inorganic materials composed of nitrides containing silicon the material being a silicon nitride not containing oxygen, e.g. SixNy or SixByNz
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/60—Electrodes characterised by their materials
- H10D64/66—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes
- H10D64/68—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes characterised by the insulator, e.g. by the gate insulator
- H10D64/691—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes characterised by the insulator, e.g. by the gate insulator comprising metallic compounds, e.g. metal oxides or metal silicates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/60—Electrodes characterised by their materials
- H10D64/66—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes
- H10D64/68—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes characterised by the insulator, e.g. by the gate insulator
- H10D64/693—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes characterised by the insulator, e.g. by the gate insulator the insulator comprising nitrogen, e.g. nitrides, oxynitrides or nitrogen-doped materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/63—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the formation processes
- H10P14/6326—Deposition processes
- H10P14/6328—Deposition from the gas or vapour phase
- H10P14/6329—Deposition from the gas or vapour phase using physical ablation of a target, e.g. physical vapour deposition or pulsed laser deposition
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/63—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the formation processes
- H10P14/6326—Deposition processes
- H10P14/6328—Deposition from the gas or vapour phase
- H10P14/6334—Deposition from the gas or vapour phase using decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8257868 | 1968-11-13 | ||
| JP8360669 | 1969-10-21 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR2023215A1 FR2023215A1 (https=) | 1970-08-07 |
| FR2023215B1 true FR2023215B1 (https=) | 1975-10-10 |
Family
ID=26423612
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR6939042A Expired FR2023215B1 (https=) | 1968-11-13 | 1969-11-13 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US3663870A (https=) |
| DE (1) | DE1956964A1 (https=) |
| FR (1) | FR2023215B1 (https=) |
| GB (1) | GB1282135A (https=) |
Families Citing this family (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3731163A (en) * | 1972-03-22 | 1973-05-01 | United Aircraft Corp | Low voltage charge storage memory element |
| DE3131958A1 (de) * | 1981-08-13 | 1983-02-24 | Solarex Corp., 14001 Rockville, Md. | Verfahren zur bildung eines antireflektionsueberzuges auf der oberflaeche von sonnenenergiezellen. |
| EP0139764B1 (en) * | 1983-03-31 | 1989-10-18 | Matsushita Electric Industrial Co., Ltd. | Method of manufacturing thin-film integrated devices |
| AU638812B2 (en) * | 1990-04-16 | 1993-07-08 | Digital Equipment Corporation | A method of operating a semiconductor device |
| US5254867A (en) * | 1990-07-09 | 1993-10-19 | Kabushiki Kaisha Toshiba | Semiconductor devices having an improved gate |
| US6271069B1 (en) * | 1994-03-23 | 2001-08-07 | Agere Systems Guardian Corp. | Method of making an article comprising an oxide layer on a GaAs-based semiconductor body |
| US5962883A (en) * | 1994-03-23 | 1999-10-05 | Lucent Technologies Inc. | Article comprising an oxide layer on a GaAs-based semiconductor body |
| US5427630A (en) * | 1994-05-09 | 1995-06-27 | International Business Machines Corporation | Mask material for low temperature selective growth of silicon or silicon alloys |
| US5920086A (en) * | 1997-11-19 | 1999-07-06 | International Business Machines Corporation | Light emitting device |
| US6404027B1 (en) * | 2000-02-07 | 2002-06-11 | Agere Systems Guardian Corp. | High dielectric constant gate oxides for silicon-based devices |
| DE10110471C2 (de) * | 2001-03-05 | 2003-12-18 | Siemens Ag | Alkoholsensor nach dem Prinzip der Austrittsarbeitsmessung |
| DE10114956C2 (de) | 2001-03-27 | 2003-06-18 | Infineon Technologies Ag | Verfahren zum Herstellen einer dielektrischen Schicht als Isolatorschicht für einen Grabenkondensator |
| DE10156932A1 (de) * | 2001-11-20 | 2003-05-28 | Infineon Technologies Ag | Verfahren zur Abscheidung dünner Praseodymoxid-Schichten mittels ALD/CVD-Verfahren |
| US7204912B2 (en) * | 2002-09-30 | 2007-04-17 | Tokyo Electron Limited | Method and apparatus for an improved bellows shield in a plasma processing system |
| ES2229883B1 (es) * | 2003-03-07 | 2006-07-01 | Fabio Consejo Sup. Investig. Cientificas | Procedimiento de fabricacion de peliculas de moleculas organicas conjugadas y sus aplicaciones. |
| DE102004019604A1 (de) | 2004-04-22 | 2005-11-17 | Siemens Ag | Verfahren zur Minimierung von Querempfindlichkeiten bei FET-basierten Gassensoren |
| DE102004019638A1 (de) * | 2004-04-22 | 2005-11-17 | Siemens Ag | FET-basierter Sensor zur Detektion von insbesondere reduzierenden Gasen, Herstellungs- und Betriebsverfahren |
| DE102004019641B4 (de) * | 2004-04-22 | 2009-10-01 | Micronas Gmbh | FET-basierter Gassensor |
| DE102004019640A1 (de) * | 2004-04-22 | 2005-11-17 | Siemens Ag | Verfahren zur Erhöhung der Selektivität von FET-basierten Gassensoren |
| EP1707952A1 (de) * | 2005-03-31 | 2006-10-04 | Micronas GmbH | Gassensitiver Feldeffekttransistor mit Luftspalt und Verfahren zu dessen Herstellung |
| EP1715333B1 (de) * | 2005-04-01 | 2010-07-28 | Micronas GmbH | Verfahren zur Signalauslesung an einem gassensitiven Feldeffekttransistor |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3202891A (en) * | 1960-11-30 | 1965-08-24 | Gen Telephone & Elect | Voltage variable capacitor with strontium titanate dielectric |
| US3470018A (en) * | 1964-08-24 | 1969-09-30 | Melpar Inc | Thin film capacitor |
| US3386163A (en) * | 1964-08-26 | 1968-06-04 | Ibm | Method for fabricating insulated-gate field effect transistor |
| US3442701A (en) * | 1965-05-19 | 1969-05-06 | Bell Telephone Labor Inc | Method of fabricating semiconductor contacts |
| US3387999A (en) * | 1965-06-23 | 1968-06-11 | Melpar Inc | Capacitor having dysprosium oxide dielectric |
| US3503813A (en) * | 1965-12-15 | 1970-03-31 | Hitachi Ltd | Method of making a semiconductor device |
| US3496433A (en) * | 1966-01-03 | 1970-02-17 | Sprague Electric Co | Yttria modified barium titanate capacitor |
| US3491433A (en) * | 1966-06-08 | 1970-01-27 | Nippon Electric Co | Method of making an insulated gate semiconductor device |
| US3455020A (en) * | 1966-10-13 | 1969-07-15 | Rca Corp | Method of fabricating insulated-gate field-effect devices |
| US3567308A (en) * | 1966-12-22 | 1971-03-02 | Ibm | Rare-earth chalcogenide magneto-optical elements with protective layers |
| US3471756A (en) * | 1968-03-11 | 1969-10-07 | Us Army | Metal oxide-silicon diode containing coating of vanadium pentoxide-v2o5 deposited on n-type material with nickel electrodes |
| US3544865A (en) * | 1968-12-20 | 1970-12-01 | Ibm | Rectifying ferromagnetic semiconductor devices and method for making same |
-
1969
- 1969-11-10 US US875223A patent/US3663870A/en not_active Expired - Lifetime
- 1969-11-12 DE DE19691956964 patent/DE1956964A1/de active Pending
- 1969-11-13 FR FR6939042A patent/FR2023215B1/fr not_active Expired
- 1969-11-13 GB GB55546/69A patent/GB1282135A/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| FR2023215A1 (https=) | 1970-08-07 |
| GB1282135A (en) | 1972-07-19 |
| DE1956964A1 (de) | 1970-06-04 |
| US3663870A (en) | 1972-05-16 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| ST | Notification of lapse |