FR2020094A1 - - Google Patents

Info

Publication number
FR2020094A1
FR2020094A1 FR6928469A FR6928469A FR2020094A1 FR 2020094 A1 FR2020094 A1 FR 2020094A1 FR 6928469 A FR6928469 A FR 6928469A FR 6928469 A FR6928469 A FR 6928469A FR 2020094 A1 FR2020094 A1 FR 2020094A1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
FR6928469A
Other languages
French (fr)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of FR2020094A1 publication Critical patent/FR2020094A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H05K3/1225—Screens or stencils; Holders therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41C—PROCESSES FOR THE MANUFACTURE OR REPRODUCTION OF PRINTING SURFACES
    • B41C1/00—Forme preparation
    • B41C1/14—Forme preparation for stencil-printing or silk-screen printing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/702—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof of thick-or thin-film circuits or parts thereof
    • H01L21/705—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof of thick-or thin-film circuits or parts thereof of thick-film circuits or parts thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing Of Printed Wiring (AREA)
FR6928469A 1968-10-08 1969-08-19 Withdrawn FR2020094A1 (xx)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US76587268A 1968-10-08 1968-10-08

Publications (1)

Publication Number Publication Date
FR2020094A1 true FR2020094A1 (xx) 1970-07-10

Family

ID=25074738

Family Applications (1)

Application Number Title Priority Date Filing Date
FR6928469A Withdrawn FR2020094A1 (xx) 1968-10-08 1969-08-19

Country Status (3)

Country Link
DE (1) DE1949500A1 (xx)
FR (1) FR2020094A1 (xx)
GB (1) GB1262176A (xx)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB8705075D0 (en) * 1987-03-04 1987-04-08 Pilkington Brothers Plc Printing
US4791006A (en) * 1987-06-04 1988-12-13 Avx Corporation High accuracy variable thickness laydown method for electronic components
US5390595A (en) * 1993-05-05 1995-02-21 Cutcher; Thomas V. Printing screen with plugs and method for printing a variable thickness pattern
GB2307446A (en) * 1995-11-25 1997-05-28 Ibm Solder paste deposition

Also Published As

Publication number Publication date
GB1262176A (en) 1972-02-02
DE1949500A1 (de) 1970-04-23

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Legal Events

Date Code Title Description
ST Notification of lapse