FR2014142B1 - - Google Patents

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Publication number
FR2014142B1
FR2014142B1 FR6917522A FR6917522A FR2014142B1 FR 2014142 B1 FR2014142 B1 FR 2014142B1 FR 6917522 A FR6917522 A FR 6917522A FR 6917522 A FR6917522 A FR 6917522A FR 2014142 B1 FR2014142 B1 FR 2014142B1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR6917522A
Other versions
FR2014142A1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
RCA Corp
Original Assignee
RCA Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by RCA Corp filed Critical RCA Corp
Publication of FR2014142A1 publication Critical patent/FR2014142A1/fr
Application granted granted Critical
Publication of FR2014142B1 publication Critical patent/FR2014142B1/fr
Expired legal-status Critical Current

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    • H01L2224/812—Applying energy for connecting
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    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
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    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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    • H01L2924/12—Passive devices, e.g. 2 terminal devices
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    • H01L2924/14—Integrated circuits
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/1062—Prior to assembly
    • Y10T156/1064—Partial cutting [e.g., grooving or incising]

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Dicing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
FR6917522A 1968-05-29 1969-05-29 Expired FR2014142B1 (fr)

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US73309468A 1968-05-29 1968-05-29

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FR2014142A1 FR2014142A1 (fr) 1970-04-17
FR2014142B1 true FR2014142B1 (fr) 1974-08-09

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FR (1) FR2014142B1 (fr)
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MY (1) MY7300381A (fr)

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Publication number Priority date Publication date Assignee Title
US3887392A (en) * 1973-11-23 1975-06-03 Gen Diode Corp Material treatment method
US3932253A (en) * 1974-06-03 1976-01-13 Western Electric Company, Inc. Method for forming a magnet pattern on magnetic memory circuit cards
US4179324A (en) * 1977-11-28 1979-12-18 Spire Corporation Process for fabricating thin film and glass sheet laminate
US5030308A (en) * 1986-07-14 1991-07-09 National Starch And Chemical Investment Holding Corporation Method of bonding a semiconductor chip to a substrate
US4793883A (en) * 1986-07-14 1988-12-27 National Starch And Chemical Corporation Method of bonding a semiconductor chip to a substrate
US5413659A (en) * 1993-09-30 1995-05-09 Minnesota Mining And Manufacturing Company Array of conductive pathways
US6393681B1 (en) * 2001-01-19 2002-05-28 Magnecomp Corp. PZT microactuator processing
US20170287768A1 (en) * 2016-03-29 2017-10-05 Veeco Precision Surface Processing Llc Apparatus and Method to Improve Plasma Dicing and Backmetal Cleaving Process

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Publication number Priority date Publication date Assignee Title
US3040489A (en) * 1959-03-13 1962-06-26 Motorola Inc Semiconductor dicing
US3182873A (en) * 1961-09-11 1965-05-11 Motorola Inc Method for dicing semiconductor material
US3562058A (en) * 1967-05-16 1971-02-09 Texas Instruments Inc Method for breaking and separating substrate material

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FR2014142A1 (fr) 1970-04-17
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GB1239882A (en) 1971-07-21
MY7300381A (en) 1973-12-31

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